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1. 发明授权

US06330164B1 Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device 失效
标题翻译：互连组件和方法，包括紧邻半导体器件连接的辅助电子部件
公开(公告)号：US06330164B1
公开(公告)日：2001-12-11
申请号：US09114589
申请日：1998-07-13
申请人： Igor Y. Khandros , David V. Pedersen , Benjamin N. Eldridge , Richard S. Roy , Gaetan Mathieu
发明人： Igor Y. Khandros , David V. Pedersen , Benjamin N. Eldridge , Richard S. Roy , Gaetan Mathieu
IPC分类号： H05K702
CPC分类号： H05K7/1069 , B23K20/004 , B23K2101/40 , C25D7/12 , G01R1/0483 , G01R31/2889 , H01L21/4846 , H01L21/4853 , H01L21/563 , H01L21/76897 , H01L22/20 , H01L23/49811 , H01L24/06 , H01L24/11 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/04042 , H01L2224/05599 , H01L2224/06136 , H01L2224/1134 , H01L2224/13099 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2224/73203 , H01L2224/73265 , H01L2224/81801 , H01L2224/85399 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/15183 , H01L2924/15184 , H01L2924/15311 , H01L2924/15787 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/19106 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , H01L2224/45099 , H01L2224/29099 , H01L2924/00
摘要： The present invention provides an ancillary electrical component in very close proximity to a semiconductor device, preferably mounted directly to the semiconductor device. In one preferred embodiment, the ancillary electrical component is a capacitor. In a preferred embodiment, a terminal is provided on the semiconductor device such that the capacitor can be electrically connected directly to the terminals, as by soldering or with conductive epoxy. Connecting the capacitor between terminals of a power loop provides superior noise and transient suppression. The very short path between the capacitor and the active circuit provides for extremely low inductance, allowing for the use of relatively small capacitors. The semiconductor device then is connected to an electronic device such as a PC board for further connection to other circuitry. One particularly preferred mode of connection is by incorporating resilient, free-standing contact structures on the same semiconductor device, with the structures standing farther away from the semiconductor and the capacitor. Other useful connectors include providing similar resilient, free-standing contact structures on the other device, then positioning the semiconductor over the resilient contacts and securing the two devices together. A socket with such resilient structures is particularly useful for this application. In an alternative preferred embodiment, the capacitor and resilient contacts all are incorporated in the second device, such as a socket. In one aspect of the invention, the ancillary electrical component may include a travel stop structure which defines a minimum separation between the semiconductor and a substrate such as a printed circuit board.
摘要翻译：本发明提供了非常接近半导体器件的辅助电气部件，优选地直接安装在半导体器件上。在一个优选实施例中，辅助电气部件是电容器。在优选实施例中，端子设置在半导体器件上，使得电容器可以通过焊接或与导电环氧树脂直接电连接到端子。在电源回路端子之间连接电容器可提供卓越的噪声和瞬态抑制。电容器和有源电路之间的非常短的路径提供极低的电感，允许使用相对较小的电容器。然后，半导体器件连接到诸如PC板的电子设备，用于进一步连接到其它电路。一个特别优选的连接方式是通过在相同的半导体器件上并入弹性，独立的接触结构，其结构远离半导体和电容器。其他有用的连接器包括在另一装置上提供类似的弹性，独立的接触结构，然后将半导体定位在弹性触点上并将两个装置固定在一起。具有这种弹性结构的插座对于该应用特别有用。在替代的优选实施例中，电容器和弹性触点都被并入第二装置，例如插座。在本发明的一个方面，辅助电气部件可以包括限定半导体和诸如印刷电路板的基板之间的最小间隔的行进止动结构。

2. 发明授权

US06713374B2 Interconnect assemblies and methods 失效
标题翻译：互连组件和方法
公开(公告)号：US06713374B2
公开(公告)日：2004-03-30
申请号：US09752640
申请日：2000-12-29
申请人： Benjamin N. Eldridge , Gaetan Mathieu
发明人： Benjamin N. Eldridge , Gaetan Mathieu
IPC分类号： H01L2144
CPC分类号： H01L23/4822 , H01L24/01 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/12042 , H01L2924/14 , H01L2924/00
摘要： An interconnect assembly and methods for making and using the assembly. An exemplary embodiment of an aspect of the invention includes a contact element which includes a base portion adapted to be adhered to a substrate and a beam portion connected to and extending from the base portion. The beam portion is designed to have a geometry which substantially optimizes stress across the beam portion when deflected (e.g. it is triangular in shape) and is adapted to be freestanding. An exemplary embodiment of another aspect of the invention involves a method for forming a contact element. This method includes forming a base portion to adhere to a substrate of an electrical assembly and forming a beam portion connected to the base portion. The beam portion extends from the base portion and is designed to have a geometry which substantially evenly distributes stress across the beam portion when deflected and is adapted to be freestanding. It will be appreciated that in certain embodiments of the invention, a plurality of contact elements are used together to create an interconnect assembly. Various other assemblies and methods are also described below in conjunction with the following figures.
摘要翻译：互连组件和用于制造和使用组件的方法。本发明的一个方面的示例性实施例包括接触元件，其包括适于粘附到基底的基部和连接到基部并从基部延伸的梁部。梁部分被设计成具有几何形状，当偏转（例如，其形状为三角形）时，几何形状基本上优化横梁部分上的应力，并且适于独立。本发明的另一方面的示例性实施例涉及形成接触元件的方法。该方法包括形成基部以粘附到电气组件的基板并形成连接到基部的梁部分。梁部分从基部延伸并且被设计成具有几何形状，当几何形状偏转时基本上均匀地分布横梁部分的应力，并适于独立。应当理解，在本发明的某些实施例中，多个接触元件一起用于产生互连组件。下面结合以下附图描述各种其它组件和方法。

3. 发明申请

US20090035959A1 INTERCONNECT ASSEMBLIES AND METHODS 审中-公开
标题翻译：互连组合和方法
公开(公告)号：US20090035959A1
公开(公告)日：2009-02-05
申请号：US12251217
申请日：2008-10-14
申请人： Benjamin N. Eldridge , Gaetan Mathieu
发明人： Benjamin N. Eldridge , Gaetan Mathieu
IPC分类号： H01R12/00
CPC分类号： G01R1/06727 , G01R1/07342 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/72 , H01L2224/02311 , H01L2224/02313 , H01L2224/02335 , H01L2224/0235 , H01L2224/0239 , H01L2224/0345 , H01L2224/03472 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05008 , H01L2224/0502 , H01L2224/05027 , H01L2224/05552 , H01L2224/05563 , H01L2224/056 , H01L2224/10122 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/11472 , H01L2224/13012 , H01L2224/13016 , H01L2224/13023 , H01L2224/13026 , H01L2224/13082 , H01L2224/131 , H01L2224/13144 , H01L2224/13155 , H01L2224/13164 , H01L2224/13173 , H01L2224/1379 , H01L2224/138 , H01L2224/1412 , H01L2224/1413 , H01L2224/16057 , H01L2224/81007 , H01L2224/81191 , H01L2224/81801 , H01L2224/8185 , H01L2224/819 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01R13/03 , H01L2924/01027 , H01L2924/00014 , H01L2924/00012
摘要： Interconnect assemblies having resilient contact elements and methods for making these assemblies. In one aspect, the interconnect assembly includes a substrate and a resilient electrical contact element disposed on the substrate. A first portion of the resilient contact structure is disposed on the substrate and a second portion extends away from the substrate and is capable of moving from a first position to a second position under the application of a force. A stop structure is disposed on the surface of the substrate and on a surface of the first portion of the resilient contact structure. According to another aspect of the present invention, a beam portion of the resilient contact structure has a substantially triangular shape.
摘要翻译：具有弹性接触元件的互连组件和用于制造这些组件的方法。在一个方面，互连组件包括衬底和设置在衬底上的弹性电接触元件。弹性接触结构的第一部分设置在基底上，第二部分远离基底延伸并且能够在施加力的情况下从第一位置移动到第二位置。止动结构设置在基板的表面上和弹性接触结构的第一部分的表面上。根据本发明的另一方面，弹性接触结构的梁部分具有基本上三角形的形状。

4. 发明授权

US07435108B1 Variable width resilient conductive contact structures 失效
标题翻译：可变宽度弹性导电接触结构
公开(公告)号：US07435108B1
公开(公告)日：2008-10-14
申请号：US09364788
申请日：1999-07-30
申请人： Benjamin N. Eldridge , Gaetan Mathieu
发明人： Benjamin N. Eldridge , Gaetan Mathieu
IPC分类号： H05K1/00
CPC分类号： G01R1/06727 , G01R1/07342 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/72 , H01L2224/02311 , H01L2224/02313 , H01L2224/02335 , H01L2224/0235 , H01L2224/0239 , H01L2224/0345 , H01L2224/03472 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05008 , H01L2224/0502 , H01L2224/05027 , H01L2224/05552 , H01L2224/05563 , H01L2224/056 , H01L2224/10122 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/11472 , H01L2224/13012 , H01L2224/13016 , H01L2224/13023 , H01L2224/13026 , H01L2224/13082 , H01L2224/131 , H01L2224/13144 , H01L2224/13155 , H01L2224/13164 , H01L2224/13173 , H01L2224/1379 , H01L2224/138 , H01L2224/1412 , H01L2224/1413 , H01L2224/16057 , H01L2224/81007 , H01L2224/81191 , H01L2224/81801 , H01L2224/8185 , H01L2224/819 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01R13/03 , H01L2924/01027 , H01L2924/00014 , H01L2924/00012
摘要： Interconnect assemblies having resilient contact elements and methods for making these assemblies. In one aspect, the interconnect assembly includes a substrate and a resilient electrical contact element disposed on the substrate. A first portion of the resilient contact structure is disposed on the substrate and a second portion extends away from the substrate and is capable of moving from a first position to a second position under the application of a force. A stop structure is disposed on the surface of the substrate and on a surface of the first portion of the resilient contact structure. According to another aspect of the present invention, a beam portion of the resilient contact structure has a substantially triangular shape.
摘要翻译：具有弹性接触元件的互连组件和用于制造这些组件的方法。在一个方面，互连组件包括衬底和设置在衬底上的弹性电接触元件。弹性接触结构的第一部分设置在基底上，第二部分远离基底延伸并且能够在施加力的情况下从第一位置移动到第二位置。止动结构设置在基板的表面上和弹性接触结构的第一部分的表面上。根据本发明的另一方面，弹性接触结构的梁部分具有基本上三角形的形状。

5. 发明授权

US06664628B2 Electronic component overlapping dice of unsingulated semiconductor wafer 失效
标题翻译：电子元件重叠的半导体晶片的重叠芯片
公开(公告)号：US06664628B2
公开(公告)日：2003-12-16
申请号：US09971981
申请日：2001-10-04
申请人： Igor Y. Khandros , David V. Pedersen , Benjamin N. Eldridge , Richard S. Roy , Gaetan Mathieu
发明人： Igor Y. Khandros , David V. Pedersen , Benjamin N. Eldridge , Richard S. Roy , Gaetan Mathieu
IPC分类号： H01L21301
CPC分类号： H01L24/06 , H01L23/50 , H01L25/0652 , H01L2224/0401 , H01L2224/04042 , H01L2224/05599 , H01L2224/06136 , H01L2224/1134 , H01L2224/131 , H01L2224/16 , H01L2224/85399 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/3025 , H01L2224/13099 , H01L2224/45099 , H01L2924/00
摘要： The present invention provides an ancillary electrical component in very close proximity to a semiconductor device, preferably mounted directly to the semiconductor device. In one preferred embodiment, the ancillary electrical component is a capacitor. In a preferred embodiment, a terminal is provided on the semiconductor device such that the capacitor can be electrically connected directly to the terminals, as by soldering or with conductive epoxy. Connecting the capacitor between terminals of a power loop provides superior noise and transient suppression. The very short path between the capacitor and the active circuit provides for extremely low inductance, allowing for the use of relatively small capacitors. The semiconductor device then is connected to an electronic device such as a PC board for further connection to other circuitry. One particularly preferred mode of connection is by incorporating resilient, free-standing contact structures on the same semiconductor device, with the structures standing farther away from the semiconductor and the capacitor. Other useful connectors include providing similar resilient, free-standing contact structures on the other device, then positioning the semiconductor over the resilient contacts and securing the two devices together. A socket with such resilient structures is particularly useful for this application. In an alternative preferred embodiment, the capacitor and resilient contacts all are incorporated in the second device, such as a socket. In one aspect of the invention, the ancillary electrical component may include a travel stop structure which defines a minimum separation between the semiconductor and a substrate such as a printed circuit board.
摘要翻译：本发明提供了非常接近半导体器件的辅助电气部件，优选地直接安装在半导体器件上。在一个优选实施例中，辅助电气部件是电容器。在优选实施例中，端子设置在半导体器件上，使得电容器可以通过焊接或与导电环氧树脂直接电连接到端子。在电源回路端子之间连接电容器可提供卓越的噪声和瞬态抑制。电容器和有源电路之间的非常短的路径提供极低的电感，允许使用相对较小的电容器。然后，半导体器件连接到诸如PC板的电子设备，用于进一步连接到其它电路。一个特别优选的连接方式是通过在相同的半导体器件上并入弹性，独立的接触结构，其结构远离半导体和电容器。其他有用的连接器包括在另一装置上提供类似的弹性，独立的接触结构，然后将半导体定位在弹性触点上并将两个装置固定在一起。具有这种弹性结构的插座对于该应用特别有用。在替代的优选实施例中，电容器和弹性触点都被并入第二装置，例如插座。在本发明的一个方面，辅助电气部件可以包括限定半导体和诸如印刷电路板的基板之间的最小间隔的行进止动结构。

6. 发明申请

US20110214910A1 WIRING SUBSTRATE WITH CUSTOMIZATION LAYERS 有权
标题翻译：带有自定义层的布线基板
公开(公告)号：US20110214910A1
公开(公告)日：2011-09-08
申请号：US12719136
申请日：2010-03-08
申请人： Benjamin N. Eldridge , Gaetan L. Mathieu
发明人： Benjamin N. Eldridge , Gaetan L. Mathieu
IPC分类号： H05K1/00 , H05K1/11 , H05K3/12 , H05K3/42 , H05K3/46
CPC分类号： H05K3/4664 , H05K3/1241 , H05K3/4015 , H05K3/4046 , H05K3/4647 , H05K2203/049 , Y10T29/49155 , Y10T29/49165
摘要： One or more customization layers can be added to a wiring substrate. The customization layers can provide customized electrical connections from electrical contacts of the base wiring substrate to electrical contacts at an outer surface of the customization layers, which can allow the contacts at the outer surface of the customization layers can be in a different pattern than the contacts at the surface of the base wiring substrate. The customization layers can comprise electrically insulating material, electrically conductive via structures through the insulating material, electrically conductive traces, electrically conductive jumpers electrically connecting two traces without contacting a trace disposed between the two traces, and/or other such elements. A jumper can be formed by making a relatively small deposit of electrically insulating material between the two traces to be connected and then making a relatively small deposit of electrically conductive material on parts of the two traces and the insulating material. Via structures can be coupled to traces and an insulating material can be cast around the via structures. Alternatively, via structures can be formed in openings with sloped side walls in an insulating layer.
摘要翻译：可以将一个或多个定制层添加到布线基板。定制层可以提供从基底布线基板的电触点到定制层外表面处的电触点的定制电连接，这允许定制层外表面处的触点可以与触点不同的图案在基极配线基板的表面。定制层可以包括电绝缘材料，通过绝缘材料的导电通孔结构，导电迹线，电连接两个迹线的导电跳线，而不接触设置在两个迹线之间的迹线和/或其它这样的元件。可以通过在要连接的两个迹线之间形成相对较小的电绝缘材料沉积，然后在两个迹线和绝缘材料的部分上形成相对较小的导电材料沉积物来形成跳线。通孔结构可以耦合到迹线，并且绝缘材料可以围绕通孔结构铸造。或者，通孔结构可以形成在具有绝缘层中的倾斜侧壁的开口中。

7. 发明授权

US07956633B2 Stacked guard structures 有权
标题翻译：堆叠的防护结构
公开(公告)号：US07956633B2
公开(公告)日：2011-06-07
申请号：US11308094
申请日：2006-03-06
申请人： Benjamin N. Eldridge
发明人： Benjamin N. Eldridge
IPC分类号： G01R31/00
CPC分类号： G01R1/07378 , G01R31/2889 , H05K1/0216 , H05K1/0298 , H05K2201/093 , H05K2201/09663 , H05K2201/09672
摘要： Systems and methods for providing a stack with a guard plane embedded in the stack are disclosed. An electrical apparatus can be made by forming a stack comprising an electrically conductive signal structure, an electrical guard structure, and an electrically insulating structure disposed between the signal structure and the guard structure. The signal structure, insulating structure, and guard structure can be aligned one with another in the stack.
摘要翻译：公开了一种用于提供具有嵌入堆叠中的保护平面的堆叠的系统和方法。可以通过形成包括导电信号结构，电保护结构和布置在信号结构和保护结构之间的电绝缘结构的堆叠来制造电气设备。信号结构，绝缘结构和防护结构可以在堆叠中彼此对准。

8. 发明授权

US07948252B2 Multilayered probe card 有权
标题翻译：多层探针卡
公开(公告)号：US07948252B2
公开(公告)日：2011-05-24
申请号：US12173695
申请日：2008-07-15
申请人： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
发明人： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
IPC分类号： G01R31/02
CPC分类号： G01R1/07314 , G01R1/07342 , G01R1/07378 , G01R3/00 , G01R31/2886 , G01R31/2889 , Y10T29/49002 , Y10T29/49004 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49453
摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
摘要翻译：一种设计和制造探针卡组件的方法包括将探针卡组件的一个或多个元件预制成一个或多个预定的设计。此后，接收关于新设计的半导体器件的设计数据以及描述用于测试半导体器件的测试器和测试算法的数据。使用接收到的数据，选择一个或多个预制元素。再次使用接收的数据，定制一个或多个所选择的预制元素。然后使用选定和定制的元件构建探针卡组件。

9. 发明授权

US07930219B2 Method and system for designing a probe card 有权
标题翻译：探针卡设计方法及系统
公开(公告)号：US07930219B2
公开(公告)日：2011-04-19
申请号：US12564799
申请日：2009-09-22
申请人： Benjamin N. Eldridge , Mark W. Brandemuehl , Stefan Graef , Yves Parent
发明人： Benjamin N. Eldridge , Mark W. Brandemuehl , Stefan Graef , Yves Parent
IPC分类号： G06Q30/00
CPC分类号： G01R3/00 , G01R1/073 , G01R1/07342 , G06Q30/0609 , G06Q30/0621 , G06Q30/0633 , G06Q50/188
摘要： A method and system for designing a probe card from data provided by prospective customers via the Internet is provided. Design specifications are entered into the system by prospective customers and compiled into a database. The collective feasibility of each set of design specifications is determined by an automated computer system and communicated to the prospective customer. If feasible, additional software enables prospective customers to create verification packages according to their respective design specifications. These verification packages further consist of drawing files visually describing the final design and verification files confirming wafer bonding pad data. Verification packages are reviewed and forwarded to an applications engineer after customer approval. An interactive simulation of probe card performance is also provided. Data on probe card performance is incorporated into an overall modeling exercise, which includes not only the probe card, but data on the device(s) under test and wafer, as well as data on automated test equipment.
摘要翻译：提供了一种通过互联网从潜在客户提供的数据设计探针卡的方法和系统。设计规范由潜在客户输入系统并编译成数据库。每套设计规范的集体可行性由自动化计算机系统确定，并传达给潜在客户。如果可行，附加软件可使潜在客户根据各自的设计规范创建验证包。这些验证包还包括可视化地描述确认晶圆键合焊盘数据的最终设计和验证文件的绘图文件。在客户批准后，验证包将被审核并转发给应用工程师。还提供了探针卡性能的交互式仿真。探针卡性能数据被纳入整体建模练习中，其中不仅包括探针卡，还包括被测设备和晶片上的数据，以及自动测试设备的数据。

10. 发明授权

US07825674B2 Probe card configuration for low mechanical flexural strength electrical routing substrates 失效
标题翻译：用于低机械抗弯强度电路基板的探针卡配置
公开(公告)号：US07825674B2
公开(公告)日：2010-11-02
申请号：US11479068
申请日：2006-06-30
申请人： Makarand S. Shinde , Richard A. Larder , Timothy E. Cooper , Ravindra V. Shenoy , Benjamin N. Eldridge
发明人： Makarand S. Shinde , Richard A. Larder , Timothy E. Cooper , Ravindra V. Shenoy , Benjamin N. Eldridge
IPC分类号： G01R31/02 , H01R11/18
CPC分类号： G01R31/2889 , G01R1/07378
摘要： A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3) an insulating flexible membrane, or load support member machined into the inner frame, to engage the low flexural strength substrate farther away from its edge; (4) a support structure, such as support pins, added to provide support to counteract probe loading near the center of the space transformer substrate; and/or (5) a highly rigid interface tile provided between the probes and a lower flexural strength space transformer substrate.
摘要翻译：提供了用于晶片测试系统的探针卡的机械支撑结构，以增加对支撑弹簧探针的极低弯曲强度基底的支撑。通过以下方式提供增加的机械支撑：（1）围绕基板的周边的框架，在基板的表面上具有增大尺寸的水平延伸; （2）具有弯曲的板簧，使得板簧能够垂直延伸并使内框架接近弹簧探针; （3）绝缘柔性膜或加工到内框架中的负载支撑构件，使低弯曲强度基板与其边缘更远地接合; （4）加载支撑结构，例如支撑销，以提供支撑以抵消在空间变压器基板的中心附近的探头负载; 和/或（5）设置在所述探针与下弯曲强度空间变换器基板之间的高刚性界面砖。

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