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1. 发明申请

US20100059870A1 CHIP PACKAGE STRUCTURE 有权
标题翻译：芯片包装结构
公开(公告)号：US20100059870A1
公开(公告)日：2010-03-11
申请号：US12491096
申请日：2009-06-24
申请人： Chau-Chun Wen , Da-Jung Chen , Bau-Ru Lu , Chun-Hsien Lu
发明人： Chau-Chun Wen , Da-Jung Chen , Bau-Ru Lu , Chun-Hsien Lu
IPC分类号： H01L23/495
CPC分类号： H01L23/4334 , H01L23/3735 , H01L23/49531 , H01L23/49586 , H01L23/62 , H01L24/48 , H01L25/0655 , H01L25/072 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A chip package structure including a substrate, at least one chip, a plurality of leads, a heat dissipation device, a molding compound, and at least one insulating sheet is provided. The chip is disposed on the substrate. The leads are electrically connected to the substrate. The molding compound having a top surface encapsulates the chip, the substrate, and a portion of the leads. The heat dissipation device is disposed on the top surface of the molding compound. The insulating sheet disposed between the heat dissipation device and at least one of the leads has a bending line dividing the insulating sheet into a main body disposed on the molding compound and a bending portion extending from the main body.
摘要翻译：提供了包括基板，至少一个芯片，多个引线，散热装置，模塑料和至少一个绝缘片的芯片封装结构。芯片设置在基板上。引线电连接到基板。具有顶表面的模制化合物封装芯片，衬底和引线的一部分。散热装置设置在模塑料的顶表面上。布置在散热装置与至少一个引线之间的绝缘片具有将绝缘片划分为设置在模制化合物上的主体和从主体延伸的弯曲部的弯曲线。

2. 发明申请

US20100117216A1 CHIP PACKAGE STRUCTURE 有权
标题翻译：芯片包装结构
公开(公告)号：US20100117216A1
公开(公告)日：2010-05-13
申请号：US12540021
申请日：2009-08-12
申请人： BAU-RU LU , Chau-Chun Wen , Da-Jung Chen , Chun-Hsien Lu
发明人： BAU-RU LU , Chau-Chun Wen , Da-Jung Chen , Chun-Hsien Lu
IPC分类号： H01L23/48
CPC分类号： H01L23/49811 , H01L23/36 , H01L23/3735 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/49 , H01L2224/73265 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/1305 , H01L2924/13055 , H01L2924/15312 , H01L2924/1532 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A chip package structure including a substrate, at least one chip, a heat dissipation device, at least one first conductive bar, a molding compound, and at least one second conductive bar is provided. The chip and the heat dissipation device are respectively disposed on a first and a second surface of the substrate. The first conductive bar has two opposite end surfaces, wherein one end surface is disposed on the first surface of the substrate, the other end surface is extended away from the substrate, and a fastening slot is disposed between the two end surfaces and passes through the other end surface. The molding compound encapsulates the substrate, the chip, part of the heat dissipation device, and the first conductive bar. The second conductive bar is disposed on one surface of the molding compound and has a protrusion portion fastened to the fastening slot of the first conductive bar.
摘要翻译：提供一种芯片封装结构，包括基板，至少一个芯片，散热装置，至少一个第一导电棒，模塑料和至少一个第二导电棒。芯片和散热装置分别设置在基板的第一和第二表面上。第一导电棒具有两个相对的端面，其中一个端面设置在基板的第一表面上，另一端表面远离基板延伸，并且紧固槽设置在两个端面之间并穿过另一端面。模塑料封装基板，芯片，散热装置的一部分和第一导电棒。第二导电棒设置在模制化合物的一个表面上，并且具有紧固到第一导电棒的紧固槽的突起部分。

3. 发明授权

US08247891B2 Chip package structure including heat dissipation device and an insulation sheet 有权
标题翻译：芯片封装结构包括散热装置和绝缘片
公开(公告)号：US08247891B2
公开(公告)日：2012-08-21
申请号：US12491096
申请日：2009-06-24
申请人： Chau-Chun Wen , Da-Jung Chen , Bau-Ru Lu , Chun-Hsien Lu
发明人： Chau-Chun Wen , Da-Jung Chen , Bau-Ru Lu , Chun-Hsien Lu
IPC分类号： H01L23/495 , H01L23/10 , H01L23/34 , H01L23/28
CPC分类号： H01L23/4334 , H01L23/3735 , H01L23/49531 , H01L23/49586 , H01L23/62 , H01L24/48 , H01L25/0655 , H01L25/072 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A chip package structure including a substrate, at least one chip, a plurality of leads, a heat dissipation device, a molding compound, and at least one insulating sheet is provided. The chip is disposed on the substrate. The leads are electrically connected to the substrate. The molding compound having a top surface encapsulates the chip, the substrate, and a portion of the leads. The heat dissipation device is disposed on the top surface of the molding compound. The insulating sheet disposed between the heat dissipation device and at least one of the leads has a bending line dividing the insulating sheet into a main body disposed on the molding compound and a bending portion extending from the main body.
摘要翻译：提供了包括基板，至少一个芯片，多个引线，散热装置，模塑料和至少一个绝缘片的芯片封装结构。芯片设置在基板上。引线电连接到基板。具有顶表面的模制化合物封装芯片，衬底和引线的一部分。散热装置设置在模塑料的顶表面上。布置在散热装置与至少一个引线之间的绝缘片具有将绝缘片划分为设置在模制化合物上的主体和从主体延伸的弯曲部的弯曲线。

4. 发明授权

US07982304B2 Chip package structure 有权
标题翻译：芯片封装结构
公开(公告)号：US07982304B2
公开(公告)日：2011-07-19
申请号：US12540021
申请日：2009-08-12
申请人： Bau-Ru Lu , Chau-Chun Wen , Da-Jung Chen , Chun-Hsien Lu
发明人： Bau-Ru Lu , Chau-Chun Wen , Da-Jung Chen , Chun-Hsien Lu
IPC分类号： H01L23/48
CPC分类号： H01L23/49811 , H01L23/36 , H01L23/3735 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/49 , H01L2224/73265 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/1305 , H01L2924/13055 , H01L2924/15312 , H01L2924/1532 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A chip package structure including a substrate, at least one chip, a heat dissipation device, at least one first conductive bar, a molding compound, and at least one second conductive bar is provided. The chip and the heat dissipation device are respectively disposed on a first and a second surface of the substrate. The first conductive bar has two opposite end surfaces, wherein one end surface is disposed on the first surface of the substrate, the other end surface is extended away from the substrate, and a fastening slot is disposed between the two end surfaces and passes through the other end surface. The molding compound encapsulates the substrate, the chip, part of the heat dissipation device, and the first conductive bar. The second conductive bar is disposed on one surface of the molding compound and has a protrusion portion fastened to the fastening slot of the first conductive bar.
摘要翻译：提供一种芯片封装结构，包括基板，至少一个芯片，散热装置，至少一个第一导电棒，模塑料和至少一个第二导电棒。芯片和散热装置分别设置在基板的第一和第二表面上。第一导电棒具有两个相对的端面，其中一个端面设置在基板的第一表面上，另一端表面远离基板延伸，并且紧固槽设置在两个端面之间并穿过另一端面。模塑料封装基板，芯片，散热装置的一部分和第一导电棒。第二导电棒设置在模制化合物的一个表面上，并且具有紧固到第一导电棒的紧固槽的突起部分。

5. 发明申请

US20120262074A1 DRIVING CIRCUIT OF LIGHT EMITTING DIODES HAVING AT LEAST ONE BYPASS CIRCUIT, AND DRIVING METHOD THEREOF 审中-公开
标题翻译：具有至少一个旁路电路的发光二极管的驱动电路及其驱动方法
公开(公告)号：US20120262074A1
公开(公告)日：2012-10-18
申请号：US13425412
申请日：2012-03-20
申请人： Wei-Cheng Wang , Bau-Ru Lu , Chun-Hsien Lu , Jeng-Jen Li
发明人： Wei-Cheng Wang , Bau-Ru Lu , Chun-Hsien Lu , Jeng-Jen Li
IPC分类号： H05B37/02
CPC分类号： H05B33/083
摘要： A driving circuit of light emitting diodes includes a power supply circuit, at least one bypass circuit, and a temperature control circuit. The power supply circuit is used for providing a driving voltage to at least one series of light emitting diodes. Each bypass circuit of the at least one bypass circuit is used for being turned on when an ambient temperature is lower than a predetermined temperature. The temperature control circuit is coupled to the at least one bypass circuit for detecting the ambient temperature, and sending a control signal to the at least one bypass circuit when the ambient temperature is lower than the predetermined temperature. Therefore, the driving voltage can still drive the at least one series of light emitting diodes when the ambient temperature is lower than the predetermined temperature.
摘要翻译：发光二极管的驱动电路包括电源电路，至少一个旁路电路和温度控制电路。电源电路用于向至少一系列的发光二极管提供驱动电压。当环境温度低于预定温度时，所述至少一个旁路电路的每个旁路电路用于接通。温度控制电路耦合到至少一个旁路电路，用于检测环境温度，并且当环境温度低于预定温度时，将控制信号发送到至少一个旁路电路。因此，当环境温度低于预定温度时，驱动电压仍能驱动至少一系列的发光二极管。

6. 发明申请

US20050096163A1 Bidirectional continuous power transmission system 有权
标题翻译：双向连续输电系统
公开(公告)号：US20050096163A1
公开(公告)日：2005-05-05
申请号：US10702951
申请日：2003-11-05
申请人： Huang-Lung Gu , Chun-Hsien Lu , Tseng-Te Wei , Tseng-Te Wei , Chien-Tsung Wu , Shian-Hsua Huang
发明人： Huang-Lung Gu , Chun-Hsien Lu , Tseng-Te Wei , Tseng-Te Wei , Chien-Tsung Wu , Shian-Hsua Huang
IPC分类号： F16H9/00 , F16H9/16 , F16H9/18 , F16H55/56 , F16H61/662 , F16H63/06 , F16H55/36 , F16H63/00
CPC分类号： F16H9/16 , F16H9/18 , F16H55/563 , F16H61/66272 , F16H63/067
摘要： A bidirectional continuous power transmission system, characterized by a projecting bolt moving within a guiding opening with a rear wall and a front wall. Upon a rotating movement, the projecting bolt exerts a force on the rear wall or the front wall, depending on the orientation of the rotating movement. The force has a component parallel to an axis of rotation, causing two halves of a driven wheel to be pressed together and against a transmission belt. By providing the rear wall and the front wall of the guiding opening with defined curvatures, well-defined forces are exerted at any speed in both orientations of the rotating movement, so that torque is continuously transmitted effectively in both directions.
摘要翻译：一种双向连续动力传动系统，其特征在于突出的螺栓在具有后壁和前壁的引导开口内移动。在旋转运动时，突出螺栓根据旋转运动的方向在后壁或前壁上施加力。该力具有平行于旋转轴线的分量，使得从动轮的两半被压在一起并靠在传动带上。通过提供具有确定曲率的引导开口的后壁和前壁，在旋转运动的两个取向中以任何速度施加明确的力，使得扭矩在两个方向上被有效地连续传递。

7. 发明申请

US20070137911A1 Vehicle hybrid propulsion system 有权
标题翻译：车辆混合推进系统
公开(公告)号：US20070137911A1
公开(公告)日：2007-06-21
申请号：US11489633
申请日：2006-07-20
申请人： Huan-Lung Gu , Tseng-Teh Wei , Chun-Hsien Lu , Shian-Hsuan Huang , Li-Ju Cheng
发明人： Huan-Lung Gu , Tseng-Teh Wei , Chun-Hsien Lu , Shian-Hsuan Huang , Li-Ju Cheng
IPC分类号： B60L8/00
CPC分类号： B60W20/10 , B60K6/387 , B60K6/40 , B60K6/48 , B60K6/547 , B60W10/02 , B60W10/08 , B60W10/10 , B60W20/00 , B60W2510/0642 , F16D28/00 , Y02T10/6221
摘要： A vehicle hybrid propulsion system includes an internal combustion engine, a transmission, a plate clutch, and at least one electric actuator coupled with the engine and with the transmission for being able to perform one of the operations consisting of generating propulsive forces, generating electric power and idling. A lever mechanism driven by an electric motor is used to control engaging and disengaging of the plate clutch such that connection between the transmission and the engine and/or the electric motor can be established or blocked. Thus, hybrid propulsion systems having different functions can be formed. Moreover, the hybrid propulsion systems are easy to implement by combining modular components.
摘要翻译：车辆混合动力推进系统包括内燃机，变速器，板式离合器以及与发动机和变速器相连的至少一个电致动器，用于能够执行包括产生推进力，产生电力空闲由电动机驱动的杠杆机构用于控制板式离合器的接合和分离，从而能够建立或阻止变速器与发动机和/或电动机之间的连接。因此，可以形成具有不同功能的混合推进系统。此外，混合推进系统通过组合模块化组件易于实现。

8. 发明授权

US06663524B2 Hybrid power system 有权
标题翻译：混合动力系统
公开(公告)号：US06663524B2
公开(公告)日：2003-12-16
申请号：US10038137
申请日：2001-12-31
申请人： Huan-Lung Gu , Chin-Taz Wu , Pan-Hsiang Hsieh , Wen-Bin Lee , Chun-Hsien Lu
发明人： Huan-Lung Gu , Chin-Taz Wu , Pan-Hsiang Hsieh , Wen-Bin Lee , Chun-Hsien Lu
IPC分类号： F16H372
CPC分类号： B60K6/442 , B60K6/543 , F16H61/662 , Y02T10/6234 , Y10S903/906 , Y10S903/909 , Y10S903/912 , Y10S903/918 , Y10S903/951
摘要： A hybrid power system, comprising a first power unit, a secondary shaft, a speed converter, a clutch, and an electric motor. The first power unit has a primary shaft. The secondary shaft is driven by the primary shaft in a rotational movement. The speed converter is placed between the primary shaft and the secondary shaft, having a transmission belt, transmitting torque from the primary shaft to the secondary shaft. The clutch is set on the primary shaft or on the secondary shaft, allowing or interrupting transmission of torque from the first power unit to the secondary shaft. The electric motor is connected with the secondary shaft, either driving the secondary shaft or being driven by the secondary shaft to generate electricity or running idle.
摘要翻译：一种混合动力系统，包括第一动力单元，次级轴，速度转换器，离合器和电动马达。第一动力单元具有主轴。副轴由主轴以旋转运动驱动。变速器位于主轴和次级轴之间，具有传动皮带，将扭矩从主轴传递到副轴。离合器设置在主轴或副轴上，允许或中断从第一动力单元到次级轴的扭矩传递。电动机与副轴连接，驱动副轴或由副轴驱动，发电或空转。

9. 发明授权

US07583001B2 Electric motor design for in hub motors 有权
标题翻译：轮毂电机的电机设计
公开(公告)号：US07583001B2
公开(公告)日：2009-09-01
申请号：US11034662
申请日：2005-01-12
申请人： Chun-Hsien Lu , Huan-Lung Gu , Chi-Tang Hsu
发明人： Chun-Hsien Lu , Huan-Lung Gu , Chi-Tang Hsu
IPC分类号： H02K1/18 , H02K1/27
CPC分类号： H02K1/2786 , H02K1/148 , H02K21/22
摘要： An electric motor design for hub motors comprises a stator assembly, having an axle, a stator plate sector holder, fixed on the axle, at least one stator sector assembly, mounted on the stator plate holder, and electric coils, would around the plates of the stator plate assembly; and a rotor assembly, having a casing, a rotor magnet retainer assembly, placed inside of the casing, and at least one permanent magnet, mounted on plates of the rotor magnet retainer assembly; wherein the stator sector assembly and/or the rotor magnet retainer assembly have plates which are stacked on top of each other and which are each divided into at least two sectors, saving production cost.
摘要翻译：用于轮毂电动机的电动机设计包括定子组件，其具有轴，固定在轴上的定子板扇形支架，安装在定子板支架上的至少一个定子扇形组件和电线圈，围绕板定子板组件; 以及转子组件，其具有壳体，设置在壳体内部的转子磁体保持器组件和安装在转子磁体保持器组件的板上的至少一个永磁体; 其中定子扇区组件和/或转子磁体保持器组件具有堆叠在彼此顶部并且被分成至少两个扇区的板，从而节省生产成本。

10. 发明授权

US07204771B2 Bidirectional continuous power transmission system 有权
标题翻译：双向连续输电系统
公开(公告)号：US07204771B2
公开(公告)日：2007-04-17
申请号：US10702951
申请日：2003-11-05
申请人： Huang-Lung Gu , Chun-Hsien Lu , Tseng-Te Wei , Chien-Tsung Wu , Shian-Hsua Huang
发明人： Huang-Lung Gu , Chun-Hsien Lu , Tseng-Te Wei , Chien-Tsung Wu , Shian-Hsua Huang
IPC分类号： F16H59/06 , F16H61/04 , F16H9/12
CPC分类号： F16H9/16 , F16H9/18 , F16H55/563 , F16H61/66272 , F16H63/067
摘要： A bidirectional continuous power transmission system, characterized by a projecting bolt moving within a guiding opening with a rear wall and a front wall. Upon a rotating movement, the projecting bolt exerts a force on the rear wall or the front wall, depending on the orientation of the rotating movement. The force has a component parallel to an axis of rotation, causing two halves of a driven wheel to be pressed together and against a transmission belt. By providing the rear wall and the front wall of the guiding opening with defined curvatures, well-defined forces are exerted at any speed in both orientations of the rotating movement, so that torque is continuously transmitted effectively in both directions.
摘要翻译：一种双向连续动力传动系统，其特征在于突出的螺栓在具有后壁和前壁的引导开口内移动。在旋转运动时，突出螺栓根据旋转运动的方向在后壁或前壁上施加力。该力具有平行于旋转轴线的分量，使得从动轮的两半被压在一起并靠在传动带上。通过提供具有确定曲率的引导开口的后壁和前壁，在旋转运动的两个取向中以任何速度施加明确的力，使得扭矩在两个方向上被有效地连续传递。

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