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    • 1. 发明授权
    • Adjustable lithography blocking device and method
    • 可调光刻阻挡装置及方法
    • US07598507B2
    • 2009-10-06
    • US10459681
    • 2003-06-11
    • Basab ChatterjeeRichard L. GuldiKeith W. Melcher
    • Basab ChatterjeeRichard L. GuldiKeith W. Melcher
    • G03B27/52G03B27/42G03B27/58
    • G03F7/70066G03F7/70216G03F7/7035
    • The present invention provides, in one embodiment, a method (100) of manufacturing a semiconductor device. A conventionally formed reticle is positioned over a resist located on a substrate (110). A radiation path through the reticle and a window assembly located between a radiation source and resist (120), is considered. It is determined whether or not the radiation would expose a predefined blocking area of the resist within the exposure zone (130). If the radiation would expose a blocking area, then the window assembly is configured to prevent radiation from exposing the blocking area in the exposure zone (140). Other embodiments include a window assembly (300) and system (400) to facilitate manufacturing of the semiconductor device according to the method (100).
    • 本发明在一个实施例中提供了制造半导体器件的方法(100)。 常规形成的掩模版位于位于基底(110)上的抗蚀剂上。 考虑通过掩模版的辐射路径和位于辐射源和抗蚀剂(120)之间的窗口组件。 确定辐射是否暴露在曝光区域(130)内的抗蚀剂的预定阻挡区域。 如果辐射将暴露阻挡区域,则窗口组件被配置为防止辐射暴露曝光区域(140)中的阻挡区域。 其他实施例包括根据方法(100)制造半导体器件的窗口组件(300)和系统(400)。
    • 2. 发明授权
    • Semiconductor wafer edge marking
    • 半导体晶圆边缘标记
    • US06710364B2
    • 2004-03-23
    • US10178627
    • 2002-06-20
    • Richard L. GuldiKeith W. MelcherJohn Williston
    • Richard L. GuldiKeith W. MelcherJohn Williston
    • G01N2186
    • H01L23/544B41M5/262H01L21/67282H01L2223/54413H01L2223/54433H01L2223/54493H01L2924/0002Y10S438/959H01L2924/00
    • The marking of identification and orientation information along the edge (E) of a semiconductor wafer (20, 20′) is disclosed. The information may be marked by way of laser marking at one or more locations (10) along a flat portion (14) or bevel (12t, 12b) of the edge (E) of the wafer (20, 20′). The wafer marking (10) may be encoded, for example by way of a 2-D bar code. A system (30) for reading the identification information from wafers (20, 20′) in a carrier (32) is also disclosed. The system (30) includes a sensor (36) for sensing reflected light from the wafer markings (10) along the wafer edge (E), and for decoding identification and orientation therefrom. A motor (38), under the control of feedback (RFB) from the sensor (36), rotates the wafers (20, 20′) by way of a roller (39) until the wafer marking (10) is in view by the sensor (36). A processing system (40), which includes a rotatable chuck (41) upon which the wafer (20, 20′) is placed, is also disclosed. The processing system (40) also includes a sensor (36) for sensing identification and orientation information from the wafer edge (E), and a process control computer (46) that receives signals corresponding to the identification information, for purposes of manufacturing data logging and process control.
    • 公开了沿着半导体晶片(20,20')的边缘(E)的识别和取向信息的标记。 信息可以通过沿着晶片(20,20')的边缘(E)的平坦部分(14)或斜面(12t,12b)的一个或多个位置(10)处的激光标记来标记。 晶片标记(10)可以例如通过2-D条形码进行编码。 还公开了一种用于从载体(32)中的晶片(20,20')读取识别信息的系统(30)。 系统(30)包括用于从晶片边缘(E)感测来自晶片标记(10)的反射光并用于解码其识别和取向的传感器(36)。 在来自传感器(36)的反馈(RFB)控制下的电动机(38)通过辊(39)旋转晶片(20,20'),直到晶片标记(10)由 传感器(36)。 还公开了一种包括可放置晶片(20,20')的可旋转卡盘(41)的处理系统(40)。 处理系统(40)还包括用于感测来自晶片边缘(E)的识别和取向信息的传感器(36),以及为了制造数据记录的目的而接收对应于识别信息的信号的过程控制计算机(46) 和过程控制。
    • 4. 发明授权
    • Semiconductor wafer edge marking
    • 半导体晶圆边缘标记
    • US06420792B1
    • 2002-07-16
    • US09661963
    • 2000-09-14
    • Richard L. GuldiKeith W. MelcherJohn Williston
    • Richard L. GuldiKeith W. MelcherJohn Williston
    • H01L2176
    • H01L23/544B41M5/262H01L21/67282H01L2223/54413H01L2223/54433H01L2223/54493H01L2924/0002Y10S438/959H01L2924/00
    • The marking of identification and orientation information along the edge (E) of a semiconductor wafer (20, 20′) is disclosed. The information may be marked by way of laser marking at one or more locations (10) along a flat portion (14) or bevel (12t, 12b) of the edge (E) of the wafer (20, 20′). The wafer marking (10) may be encoded, for example by way of a 2-D bar code. A system (30) for reading the identification information from wafers (20, 20′) in a carrier (32) is also disclosed. The system (30) includes a sensor (36) for sensing reflected light from the wafer markings (10) along the wafer edge (E), and for decoding identification and orientation therefrom. A motor (38), under the control of feedback (RFB) from the sensor (36), rotates the wafers (20, 20′) by way of a roller (39) until the wafer marking (10) is in view by the sensor (36). A processing system (40), which includes a rotatable chuck (41) upon which the wafer (20, 20′) is placed, is also disclosed. The processing system (40) also includes a sensor (36) for sensing identification and orientation information from the wafer edge (E), and a process control computer (46) that receive signals corresponding to the identification information, for purposes of manufacturing data logging and process control.
    • 公开了沿着半导体晶片(20,20')的边缘(E)的识别和取向信息的标记。 信息可以通过沿着晶片(20,20')的边缘(E)的平坦部分(14)或斜面(12t,12b)的一个或多个位置(10)处的激光标记来标记。 晶片标记(10)可以例如通过2-D条形码进行编码。 还公开了一种用于从载体(32)中的晶片(20,20')读取识别信息的系统(30)。 系统(30)包括用于从晶片边缘(E)感测来自晶片标记(10)的反射光并用于解码其识别和取向的传感器(36)。 在来自传感器(36)的反馈(RFB)控制下的电动机(38)通过辊(39)旋转晶片(20,20'),直到晶片标记(10)由 传感器(36)。 还公开了一种包括可放置晶片(20,20')的可旋转卡盘(41)的处理系统(40)。 处理系统(40)还包括用于感测来自晶片边缘(E)的识别和取向信息的传感器(36)以及接收与识别信息对应的信号的过程控制计算机(46),用于制造数据记录 和过程控制。
    • 5. 发明授权
    • Error reduction in semiconductor processes
    • 半导体工艺中的误差减少
    • US06848066B2
    • 2005-01-25
    • US10634008
    • 2003-08-04
    • Chris D. AtkinsonKeith W. MelcherRichard L. Guldi
    • Chris D. AtkinsonKeith W. MelcherRichard L. Guldi
    • G03F7/20G03F7/207G03F9/00G03F9/02G01R31/28
    • G03F9/7026G03F7/70425G03F9/7003
    • A photolithography system includes a photolithography tool 32 that includes a stage upon which a semiconductor wafer is mounted. The tool is operable to move the stage to automatically focus a pre-determined image on a surface of the semiconductor wafer. The tool is further operable to log movements of the stage. The system also includes an automation host computer 36 operable to poll the photolithography tool 32 to obtain data reflecting the logged movements of the stage. The automation host computer 36 is further operable to analyze the data and compare the data to pre-determined error conditions. The host computer also takes a pre-determined action, including sending an electronic mail message to the personal computers 38 of relevant line personnel, in the event the data meets the pre-determined error conditions.
    • 光刻系统包括光刻工具32,其包括安装半导体晶片的台。 该工具可操作以移动台以自动将预定图像聚焦在半导体晶片的表面上。 该工具进一步可操作以记录舞台的运动。 该系统还包括自动化主机36,可操作以轮询光刻工具32以获得反映该台的记录运动的数据。 自动化主计算机36还可操作以分析数据并将数据与预定的错误条件进行比较。 如果数据满足预定的错误条件,则主计算机还采取预先确定的动作,包括向相关线路人员的个人计算机38发送电子邮件消息。
    • 6. 发明授权
    • Robot crash sensor system
    • 机器人碰撞传感器系统
    • US06298282B1
    • 2001-10-02
    • US09338753
    • 1999-06-23
    • Richard L. GuldiRobin D. WorleyKeith W. Melcher
    • Richard L. GuldiRobin D. WorleyKeith W. Melcher
    • G06F1900
    • B25J9/1674G05B19/4061G05B2219/37434G05B2219/39082Y10S477/906Y10S477/907Y10T74/20305
    • A method of detecting object scratching during robotic arm movement of the object. The method includes providing a robotic arm for grasping and placing of an object into a cassette and providing a cassette having an entrance for receiving an object therein. A vibration sensor is placed on at least one of the robotic arm or under the cassette control of the robotic arm is provided in response to a malfunction indication at least one of the vibration sensors. There can further be provided an air flow across the entrance of the cassette with placement of a particle counter at the downstream end of the air flow across cassette entrance, wherein the control of said robotic arm is provided in response to a malfunction indication at least one of the vibration sensors and the particle counter. The control can also be provided in response to both of the vibration sensors or one or both of the vibration sensors and the particle counter. The control can be one or more of making a record of the malfunction, providing an alarm signal or terminating operation of the arm. The object is preferably some form of disc or disc-shaped object.
    • 一种在物体的机器人臂运动期间检测物体划伤的方法。 该方法包括提供用于将物体夹持并放置到盒中的机器臂,并提供具有用于在其中接收物体的入口的盒。 响应于至少一个振动传感器的故障指示,设置有振动传感器,所述振动传感器被放置在所述机器臂的至少一个上或所述机器人臂的盒控制下。 可以进一步提供穿过盒的入口的空气流,其中颗粒计数器位于穿过盒入口的空气流的下游端,其中响应于故障指示提供所述机器人手臂的控制,至少一个 的振动传感器和粒子计数器。 还可以响应于两个振动传感器或者一个或两个振动传感器和粒子计数器来提供控制。 该控制可以是记录故障的一个或多个,提供报警信号或手臂的终止操作。 该物体最好是某种形式的盘或盘形物体。