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1. 发明申请

WO2012101108A3 SOLAR CELL MODULE AND METHOD FOR PRODUCING SAME 审中-公开
标题翻译：太阳能电池组件及其制造方法
公开(公告)号：WO2012101108A3
公开(公告)日：2012-12-13
申请号：PCT/EP2012051022
申请日：2012-01-24
申请人： BOSCH GMBH ROBERT , SCHAAF ULRICH , KUGLER ANDREAS , ZIPPEL MARTIN , ZERRER PATRICK , KOYUNCU METIN
发明人： SCHAAF ULRICH , KUGLER ANDREAS , ZIPPEL MARTIN , ZERRER PATRICK , KOYUNCU METIN
IPC分类号： H01L31/05 , H01L31/048
CPC分类号： H01L31/0508 , H01L31/048 , H01L31/0512 , H01L31/0516 , Y02E10/50
摘要： The invention relates to a solar cell module comprising a plurality of solar cells that are arranged on a mechanical support and are interconnected in predetermined circuit configurations by means of connection conductors that run on the rear faces of the solar cells. To produce the connection conductors, the solar cell module is provided with an interconnection support substrate comprising an electrically insulating base layer, some sections of said substrate having conductive layers on both sides and both sides of said substrate being in local electric contact with the solar cells, or is provided with a multi-layer interconnection support substrate comprising multiple electrically insulating base layers and multiple conductive layers that are insulated in relation to one another by the base layers. Said substrate including insulation spacers and/or an insulating layer is moved to the rear faces of the solar cells.
摘要翻译：一种太阳能电池模块被布置成与上一个机械支撑的多个和背部在太阳能电池上延伸的侧面中的互连的太阳能电池的一个预定的电路配置中连接导体，连接导体的实现双面部分与太阳能电池表现出局部两侧上的导电层电接触的互连支撑衬底有电绝缘支撑层或具有多个电绝缘基层的并且彼此多个隔离的由基材层导电层的多层互连支撑基板上设置，其与绝缘间隔件和/或太阳能电池的绝缘层背面布置。

2. 发明申请

WO2012171680A2 SOLAR CELL MODULE AND A METHOD FOR PRODUCING SAME 审中-公开
标题翻译：太阳能电池组件与方法研究
公开(公告)号：WO2012171680A2
公开(公告)日：2012-12-20
申请号：PCT/EP2012057101
申请日：2012-04-19
申请人： BOSCH GMBH ROBERT , SCHAAF ULRICH , KUGLER ANDREAS , ZERRER PATRICK , ZIPPEL MARTIN , STIHLER PATRICK , KOYUNCU METIN
发明人： SCHAAF ULRICH , KUGLER ANDREAS , ZERRER PATRICK , ZIPPEL MARTIN , STIHLER PATRICK , KOYUNCU METIN
IPC分类号： H01L31/042
CPC分类号： H01L31/0516 , H01L31/0481 , Y02E10/50
摘要： The invention relates to a solar cell module which comprises a plurality of solar cells arranged on a mechanical carrier and connected, in a predetermined circuit configuration, by connecting conductors which extend on the rear sides of said solar cells. In order to obtain said connecting conductors, a circuit carrier-substrate which has a conductive layer on some sections of one surface, is locally and electrically contacted with said solar cells, and comprises an electrically insulating carrier layer, is provided, or alternatively a stack of such carrier-substrates is provided, wherein insulation spacers and/or an insulating intermediate layer is/are laid on said substrate or stack, towards the solar cell rear sides. At least one portion of the contact sections are formed, for contacting the solar cells and/or locally interconnecting a plurality of conductive layers of the stack, from through-holes or blind-holes in the circuit carrier-substrate or stack, said holes being filled with a conductive paste or ink that is compatible with the material of the, or of each, conductive layer.
摘要翻译：设置具有在机械支撑件的多个和在所述太阳能电池背面上的连接导体在所述互连的太阳能电池的预定电路结构在一个表面上并局部地与太阳能电池电接触的互连支撑衬底与延伸，为实现该连接的导体的部分表现出导电层的太阳能电池模块电绝缘支撑层或提供这样的载体基底的堆叠，其/其上安装有绝缘间隔物和/或层间绝缘膜的太阳能电池背面，接触部分的至少一个部分，用于接触所述太阳能电池和/或用于多个导电层的本地连接通过使用导电膏或墨，其与的材料或各导电层兼容堆叠彼此-filled通孔在互连TRAG或盲孔形成ersubstrat或堆栈。

3. 发明申请

WO2011128001A3 METHOD FOR PRODUCING A PHOTOVOLTAIC MODULE COMPRISING SEMICONDUCTOR CELLS CONTACT-CONNECTED ON THE REAR SIDE, AND PHOTOVOLTAIC MODULE 审中-公开
标题翻译：工艺生产具有背接触半导体电池及太阳能电池组件的光伏组件
公开(公告)号：WO2011128001A3
公开(公告)日：2011-12-22
申请号：PCT/EP2010066122
申请日：2010-10-26
申请人： BOSCH GMBH ROBERT , SCHAAF ULRICH , KUGLER ANDREAS , ZERRER PATRICK , ZIPPEL MARTIN , STIHLER PATRICK , KOYUNCU METIN
发明人： SCHAAF ULRICH , KUGLER ANDREAS , ZERRER PATRICK , ZIPPEL MARTIN , STIHLER PATRICK , KOYUNCU METIN
IPC分类号： H01L31/0224 , H01L21/268 , H01L31/05 , H01L31/18
CPC分类号： H01L31/05 , H01L21/268 , H01L31/022433 , H01L31/0516 , H01L31/1804 , Y02E10/547 , Y02P70/521
摘要： The invention relates to a method for producing a photovoltaic module comprising semiconductor cells (1) contact-connected on the rear side and comprising contact regions (3) respectively provided on a contact side (2), comprising the following method steps: providing a film-like nonconductive carrier (4) having an at least one-sided carrier coating (5) which is electrically conductive at least in sections on a first carrier side, placing the contact sides of the semiconductor cells onto a second carrier side, performing a local perforation which perforates the carrier and the carrier coating in order to produce perforations (10) at the contact regions (3) of the semiconductor cells (1), applying a contact-connecting means (11) for filling the perforations (10) and for forming a contact-connection between the carrier coating on the first carrier side and the semiconductor cells on the second carrier side.
摘要翻译：个e-发明涉及一种制造具有背接触半导体单元，每个单元具有上的接触侧（1）的光伏模块的方法（2）在接触区（3）中提供，其包括以下步骤：提供一片状的非导电载体（4）具有至少一个侧和至少部分的，导电的在支撑件的第一侧的载体涂料（5），把由于半导体单元的连接的接触到所述支撑件的第二侧，在执行支持，并通过打破的地方穿孔用于产生突破（10）到所述接触区域的载体涂层（3）的半导体的细胞（1），施加Kontaktiermittels（11），用于所述孔（10）的填充和用于形成载体涂层之间在第一衬底侧和所述半导体单元上的第二支承侧秒的接触。

4. 发明申请

WO2011131567A3 METHOD FOR PRODUCING A PHOTOVOLTAIC MODULE HAVING SEMICONDUCTOR CELLS CONNECTED ON THE BACK SIDE, AND PHOTOVOLTAIC MODULE 审中-公开
标题翻译：工艺生产具有背接触半导体电池及太阳能电池组件的光伏组件
公开(公告)号：WO2011131567A3
公开(公告)日：2012-09-07
申请号：PCT/EP2011055951
申请日：2011-04-14
申请人： BOSCH GMBH ROBERT , SCHAAF ULRICH , KUGLER ANDREAS , ZIPPEL MARTIN , STIHLER PATRICK , KOYUNCU METIN
发明人： SCHAAF ULRICH , KUGLER ANDREAS , ZIPPEL MARTIN , STIHLER PATRICK , KOYUNCU METIN
IPC分类号： H01L31/0224
CPC分类号： H01L31/022441 , B32B3/085 , B32B7/12 , B32B7/14 , B32B15/04 , B32B17/10018 , B32B17/10807 , B32B27/06 , B32B2255/10 , B32B2255/205 , B32B2307/202 , B32B2457/12 , H01L31/02008 , H01L31/0481 , H01L31/0512 , Y02E10/50
摘要： The invention relates to a method for producing a photovoltaic module comprising semiconductor cells (1) contacted on the back side and each having contact areas (3) provided on a contact side (2) for a photovoltaic module, characterized by the method steps of providing a non-conductive substrate (4) in the form of the film or the laminate and having a substrate coating (5) at least on one side and conductive at least in segments, applying an anisotropically conductive adhesive (6) to the substrate coating (5), placing the semiconductor cells (1) on the substrate coating having the adhesive, fixing each semiconductor cell by means of pressure and/or thermal effects for forming conductor paths (7) within the anisotropically conductive adhesive between the substrate coating and each contact side (2) of the semiconductor cell.
摘要翻译：一种用于生产具有（1）中提供的每个上的接触侧的背接触半导体电池的光伏模块的过程（2），用于光伏模块，其特征在于通过提供一种非导电性载体的步骤的接触区（3）（4）在薄膜或层压材料与形式至少一侧上，至少部分导电载体涂层（5）施加各向异性导电性粘接剂（6）在载体涂层，将（1），其上设置有粘合剂载体涂层的半导体单元，由压力和/或热量到每个半导体电池固定形成导电路径（7）的载体涂层和半导体单元的各自的接触面（2）之间的各向异性导电粘合剂内。

5. 发明申请

WO2011124716A3 METHOD FOR PRODUCING A PHOTOVOLTAIC MODULE COMPRISING SEMICONDUCTOR CELLS CONTACT-CONNECTED ON THE REAR SIDE 审中-公开
标题翻译：工艺生产具有背接触半导体电池的光伏组件
公开(公告)号：WO2011124716A3
公开(公告)日：2012-01-12
申请号：PCT/EP2011055575
申请日：2011-04-08
申请人： BOSCH GMBH ROBERT , SCHAAF ULRICH , KUGLER ANDREAS , ZIPPEL MARTIN , STIHLER PATRICK , KOYUNCU METIN
发明人： SCHAAF ULRICH , KUGLER ANDREAS , ZIPPEL MARTIN , STIHLER PATRICK , KOYUNCU METIN
IPC分类号： H01L31/0224 , H01L21/268 , H01L31/048 , H01L31/05 , H01L31/18
CPC分类号： H01L31/18 , H01L21/268 , H01L31/022433 , H01L31/048 , H01L31/0516 , H01L31/1804 , H01L31/188 , Y02E10/547 , Y02P70/521
摘要： The invention relates to a method for producing a photovoltaic module comprising semiconductor cells (1) contact-connected on the rear side, with contact regions (3) provided in each case on a contact side (2), comprising the following method steps: providing a non-conductive film-like carrier (4), placing the contact sides of the semiconductor cells onto the carrier, carrying out laser drilling that penetrates through the carrier in order to produce perforations (10) on the contact regions (3) of the contact sides (2) of the semiconductor cells (1), applying a contact-connecting means (1) to the carrier in order to fill the perforations and in order to form a contact-connecting layer running on the carrier.
摘要翻译：本发明涉及一种用于制造具有背接触半导体单元，每个单元具有上的接触侧（1）的光伏模块（2）在接触区（3）提供，其包括以下步骤：提供非导电的片状载体（4），将所述接触侧的半导体单元的支撑，执行由折射激光钻孔的载体用于在接触区域产生的突破（10）（3）的接触侧面（2）的半导体单元（1），在所述载体上施加Kontaktiermittels（11）中的孔的填充，以及用于形成的延伸的载体接触层上。

6. 发明申请

WO2009153129A3 METHOD FOR THE MANUFACTURE OF AN ELECTRONIC ASSEMBLY 审中-公开
标题翻译：方法用于制造电子组件
公开(公告)号：WO2009153129A3
公开(公告)日：2010-03-04
申请号：PCT/EP2009056286
申请日：2009-05-25
申请人： BOSCH GMBH ROBERT , SCHAAF ULRICH , KUGLER ANDREAS
发明人： SCHAAF ULRICH , KUGLER ANDREAS
IPC分类号： H01L23/538 , H01L21/48 , H01L21/60
CPC分类号： H01L24/18 , H01L21/4825 , H01L23/5387 , H01L23/5389 , H01L24/82 , H01L2221/68377 , H01L2224/05568 , H01L2224/05573 , H01L2224/16237 , H01L2224/18 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/181 , H05K1/0284 , H05K1/186 , H05K1/189 , H05K3/0014 , H05K3/4038 , H05K2201/0305 , H05K2201/0355 , H05K2201/10674 , H05K2203/302 , Y10T29/49126 , Y10T29/4913 , Y10T29/49165 , H01L2924/00 , H01L2224/05599
摘要： The invention relates to a method for the manufacture of an electronic assembly, comprising at least one electronic component (9) and also a conductor track structure (7) which is used to make contact with the at least one electronic component (9). The method involves a first step being used to pattern a conductive foil (1) to produce the conductor track structure (7). In a second step, the conductor track structure (7) has the at least one electronic component (9) fitted. In a final step, a further foil is laminated onto the conductive foil (1) fitted with the at least one electronic component (9) on the side on which the conductive foil (1) has the at least one electronic component (9) fitted.
摘要翻译：本发明涉及一种制备一电子组件，其包括至少一个电子元件（9）和一个导体线路结构（7），其通过所述至少一个电子元件（9）接触。在该方法中，在第一步骤中，用于形成布线图案（7）的导电膜（1）被构造。在第二步骤中，印刷导体结构（7）与所述至少一个电子元件（9）被装配。在最后的步骤中，进一步膜施加到所述至少一个电子元件（9），放养导电膜（1）在其上的导电膜（1）配备有至少一个电子部件的一侧（9），层压，

7. 发明申请

WO2008141898A3 METHOD FOR PRODUCING AN ELECTRONIC ASSEMBLY 审中-公开
标题翻译：方法用于制造电子组件
公开(公告)号：WO2008141898A3
公开(公告)日：2009-04-02
申请号：PCT/EP2008055175
申请日：2008-04-28
申请人： BOSCH GMBH ROBERT , WUERTH ELEKTRONIK ROT AM SEE G , FRAUNHOFER GES FORSCHUNG , SCHAAF ULRICH , KUGLER ANDREAS , BECKER KARL-FRIEDERICH , NEUMANN ALEXANDER , KOSTELNIK JAN
发明人： SCHAAF ULRICH , KUGLER ANDREAS , BECKER KARL-FRIEDERICH , NEUMANN ALEXANDER , KOSTELNIK JAN
IPC分类号： H05K1/18
CPC分类号： H01L23/5389 , H01L23/3121 , H01L24/19 , H01L24/24 , H01L24/82 , H01L2224/04105 , H01L2224/24227 , H01L2224/32145 , H01L2224/32245 , H01L2224/73267 , H01L2224/82039 , H01L2224/83132 , H01L2224/83192 , H01L2224/92144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/014 , H01L2924/07802 , H01L2924/1461 , H01L2924/181 , H05K1/0206 , H05K1/0207 , H05K1/188 , H05K3/4602 , H05K3/4641 , H05K2201/068 , H05K2201/10674 , Y10T29/4913 , Y10T29/49133 , Y10T29/49139 , H01L2924/00
摘要： The invention relates to a method for producing an electronic assembly (21), wherein, in a first step, at least one electronic component (9) is fastened on an isolating layer (5) of a conductive film (1), the conductive film (1) with the electronic component (9) is laminated onto a printed circuit board carrier (13) and finally a conductor structure (15) is formed by structuring the conductive film (1). The coefficient of expansion of the isolating layer (5) is between the coefficient of expansion of the printed circuit board carrier (13) and the coefficient of expansion of the conductor structure (15), and/or electronic components (9), which need small passages for contacting with the conductor structure (15), are pressed further into the isolating layer (5) than electronic components (9), which need larger passages in the isolating layer (5), and/or the conductor structure (15) is forced apart before the application of a further conductor structure (27).
摘要翻译：本发明涉及一种方法，用于与所述的绝缘层上制造电子组件（21），至少一个电子元件（9）是（5）（1），其安装在第一步骤中的导电膜，所述导电膜（1）电子元件（9）到印刷电路板的载体（13）被层压，然后在导体轨道结构（15）由导电性膜图案化而形成（1）。在这种情况下，或者，如果膨胀的印刷电路板的载体（13）和导体轨道结构（15）的膨胀系数的膨胀系数之间的绝缘层（5）的，和/电子部件（9），需要对一个Ankontaktierung到导体轨道结构（15）的小通道的系数，被进一步压入到绝缘层（5）和电子部件（9），所述绝缘层（5）在较大的通道需要，和/或导体轨道结构（15）进一步的导体轨道结构（27）的应用程序之前，已展开。

8. 发明申请

WO2009037145A3 METHOD FOR THE PRODUCTION OF AN ELECTRONIC ASSEMBLY, AND ELECTRONIC ASSEMBLY 审中-公开
标题翻译：方法用于生产电子装配，以及电子装配
公开(公告)号：WO2009037145A3
公开(公告)日：2009-05-28
申请号：PCT/EP2008061897
申请日：2008-09-09
申请人： BOSCH GMBH ROBERT , KUGLER ANDREAS , LIEBING GERHARD , FREUNDT DIRK
发明人： KUGLER ANDREAS , LIEBING GERHARD , FREUNDT DIRK
IPC分类号： H05K1/18
CPC分类号： H05K1/188 , H01L23/3677 , H01L23/49816 , H01L23/5389 , H01L23/66 , H01L24/19 , H01L24/82 , H01L2223/6677 , H01L2224/04105 , H01L2224/18 , H01L2224/32245 , H01L2224/82039 , H01L2224/83132 , H01L2224/83192 , H01L2224/92144 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01082 , H01L2924/14 , H01L2924/1423 , H01L2924/1461 , H05K1/0206 , H05K1/141 , H05K3/3436 , H05K2201/0355 , H05K2201/10666 , H01L2924/00
摘要： The invention relates to a method for the production of an electronic assembly (21), particularly for high-frequency applications, comprising at least one electronic component (9) that is mounted on a printed circuit board (45), and at least one conductor structure (15, 25), by means of which the at least one electronic component (9) is contacted. For this purpose, the at least one electronic component (9) is mounted on an insulating layer (5) of a conductive foil (1). The conductive foil (1) having the at least one electronic component (9) mounted thereon is laminated onto a printed circuit board carrier (13). The structuring of the conductive foil (1) and the contacting of the at least one electronic component (9) forms a conductor structure (15). Soldering points (35) are provided to through-platings (33), which are configured in the electronic assembly (21) and lead to the bottom of the electronic assembly (21), and are connected to the conductor structure (15, 25).
摘要翻译：本发明涉及一种方法，用于制造电子组件（21），特别是用于包括至少一个电子元件的高频应用（9），其被安装在电路板（45），和至少一个导体轨道结构（15，25）与该至少一个电子元件（9）接触。为了这个目的，所述至少一个电子元件（9）安装在导电膜（1）的绝缘层（5）上。导电片（1）与连接到它（9）的至少一个电子部件被层压到印刷电路板的载体（13）。由导电膜（1）和Ankontaktieren图案化的至少一个电子元件（9）形成的导体路径结构（15）。通孔（33）形成在所述电子模块（21）中，并导致电子模块（21）的底部，并与导体轨道结构（15，25）都连接到焊垫（35）附连。

9. 发明专利

JP2000223913A CIRCUIT DEVICE 失效
公开(公告)号：JP2000223913A
公开(公告)日：2000-08-11
申请号：JP2000011896
申请日：2000-01-20
申请人： BOSCH GMBH ROBERT
发明人： WEIBLEN KURT , LUCAS BERNHARD , SEIZ JUERGEN , KUGLER ANDREAS , DIETERICH ACHIM
IPC分类号： H01P1/30 , H01P5/107 , H01R13/24 , H01P5/08
摘要： PROBLEM TO BE SOLVED: To facilitate the manufacture and to excellently compensate various different thermal expansions. SOLUTION: The circuit device is equipped with a contact element which is electrically connected to a microstrip 7 of a microstrip line. The contact element has a conductive casing 3 and a ball 4 of conductive yarn or beltlike material in the casing 3. The casing 3 is electrically connected on the microstrip 7 and the clew body 4 presses a waveguide elastically.

10. 发明专利

JP2000223912A CIRCUIT DEVICE 失效
公开(公告)号：JP2000223912A
公开(公告)日：2000-08-11
申请号：JP2000011895
申请日：2000-01-20
申请人： BOSCH GMBH ROBERT
发明人： LUCAS BERNHARD , SCHATZ FRANK , SEIZ JUERGEN , EISENSCHMID HEINZ , KUGLER ANDREAS , DIETERICH ACHIM
IPC分类号： B21D28/00 , H01P1/30 , H01P5/107 , H01R4/04 , H01R13/24 , H01R43/16 , H01P5/08
摘要： PROBLEM TO BE SOLVED: To facilitate the manufacture and to excellently compensate various different thermal expansions. SOLUTION: A contact element is a precision bending spring 11 which is previously manufactured and can be manufactured having reproducible characteristics and the bending spring 11 is fixed to a waveguide 1 or microstrip 7 with an electrically conductive adhesive at one contact position 9. As a 2nd contact position, a slide contact 10 is provided. Then the bending spring is preloaded, or provided with an electrically conductive adhesion place, formed in a U shape or provided with a highly flexible electrically conductive adhesion place.

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