专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2001033338A PRESSURE SENSOR DEVICE 失效
公开(公告)号：JP2001033338A
公开(公告)日：2001-02-09
申请号：JP2000191668
申请日：2000-06-26
申请人： BOSCH GMBH ROBERT
发明人： WEIBLEN KURT , TOENNESEN TORE
IPC分类号： G01L19/14 , G01D11/24 , G01L9/00 , G01L9/04 , H01L29/84
摘要： PROBLEM TO BE SOLVED: To provide the pressure sensor device which eliminates the need to prepare a different type completion system equipped with a casing, a pressure terminal, a semiconductor pressure sensor, and all other constitution elements for various different applications. SOLUTION: The pressure terminal 2 is formed as a molding member 2 which is manufactured irrelevantly to sensor casings 12 and 15 and can be fixed to a constitution unit carrier 1, and the exit 24 of a pressure passage 23 formed in the molding member is connected at least indirectly to the opening 13 of the sensor casings 12 and 15.

2. 发明专利

JP2000223913A CIRCUIT DEVICE 失效
公开(公告)号：JP2000223913A
公开(公告)日：2000-08-11
申请号：JP2000011896
申请日：2000-01-20
申请人： BOSCH GMBH ROBERT
发明人： WEIBLEN KURT , LUCAS BERNHARD , SEIZ JUERGEN , KUGLER ANDREAS , DIETERICH ACHIM
IPC分类号： H01P1/30 , H01P5/107 , H01R13/24 , H01P5/08
摘要： PROBLEM TO BE SOLVED: To facilitate the manufacture and to excellently compensate various different thermal expansions. SOLUTION: The circuit device is equipped with a contact element which is electrically connected to a microstrip 7 of a microstrip line. The contact element has a conductive casing 3 and a ball 4 of conductive yarn or beltlike material in the casing 3. The casing 3 is electrically connected on the microstrip 7 and the clew body 4 presses a waveguide elastically.

3. 发明专利

JP2001050838A MANUFACTURE OF PRESSURE SENSOR 失效
公开(公告)号：JP2001050838A
公开(公告)日：2001-02-23
申请号：JP2000187844
申请日：2000-06-22
申请人： BOSCH GMBH ROBERT
发明人： WEIBLEN KURT , DOERING ANTON , NIEDER JUERGEN , HAAG FRIEDER
IPC分类号： G01L9/04 , B29C45/02 , G01L9/00 , H01L21/56 , H01L29/84
摘要： PROBLEM TO BE SOLVED: To realize a method for surely avoiding the intrusion of molding material through a gap. SOLUTION: Means for cutting a pressure supply part 28 of a semiconductor pressure pickup 2 from a coating of molding material has a plunger 43 disposed while being spaced apart from the plane 20 of the pickup 2 on the side opposite to an assembling section 12 by a gap 45 in an injection molder 40. Fluidity of molding material is reduced in the region of the plunger 43 by varying the temperature thereof with respect to the temperature of liquefied molding material thus blocking at least complete intrusion of molding material into the gap 45.

4. 发明专利

JP2000111431A PRESSURE SENSOR DEVICE 失效
公开(公告)号：JP2000111431A
公开(公告)日：2000-04-21
申请号：JP27509899
申请日：1999-09-28
申请人： BOSCH GMBH ROBERT
发明人： WEIBLEN KURT , BERNHARD ZAPEL , JOERG HAUER , TRAH HANS-PETER
IPC分类号： G01L7/08 , G01L9/00 , G01L9/04
摘要： PROBLEM TO BE SOLVED: To prevent disadvantageous effect from being given to a signal due to various different thermal inflation since a diaphragm and a deformable member are optimally matched in terms of structure. SOLUTION: In a pressure sensor device, a diaphragm 1 and a member that is deformed by the displacement of the diaphragm 1 are provided, the member 2 is connected to the diaphragm via a first connection member 101 and to a frame 3 via a second connection member 102, a deformation-measuring device 11 for detecting the deformation of the deformable member 2 is provided, and the first connection member 101 does not move in a first direction (z) and is flexible in a second direction (y), and the second connection member 102 does not move in the first direction (z) and in the second direction (y). In the pressure sensor device, the first connection member 101 and the second connection member 102 are made of first and second support profiles being made of materials with the same thermal inflation and extremely larger height and width than the thickness, and the support profiles are flexible only in each thickness direction.

5. 发明专利

JPH10209470A MANUFACTURE OF SENSOR AND WAFER STAPLE 失效
公开(公告)号：JPH10209470A
公开(公告)日：1998-08-07
申请号：JP318798
申请日：1998-01-09
申请人： BOSCH GMBH ROBERT
发明人： KURLE JUERGEN , WEIBLEN KURT , PINTER STEFAN DR , MUENZEL HORST DR , BAUMANN HELMUT DR , SCHUBERT DIETRICH DR , BENDER KARL , LUTZ MARKUS
IPC分类号： H01L29/84 , G01L9/00
摘要： PROBLEM TO BE SOLVED: To reduce the required area by fixing a wafer cap to a region between two sensor elements arranged on a substrate wafer, arranging a connection tape accurately and bonding, cutting the wafer cap and the connection tape on the side face of the sensor, inspecting the degree of enclosure of a cavity section and then cutting off the substrate wafer. SOLUTION: A sensor element 2 is fixed to a substrate wafer 1 and provided with fixing contacts. A cap wafer 3 having a bridges 4 and contact holes 9 is prepared and the contact holes 9 are arranged to correspond with contacts selected on the substrate wafer. The cap wafer 3 is connected with the substrate 1 through a connection tape and a gas is sealed in a cavity 17 thus formed. A contact 16 is provided on the substrate 1 and connected with the sensor element 2 which is then inspected by an inspection equipment 10. An acceptable sensor is positioned on a selected hybrid substrate 15 and the cap wafer 3 is cut off from the substrate 1 between adjacent tapes. Since only one tape is present on a wafer staple, the area required for the tap and a groove can be reduced.

6. 发明专利

JP2002323424A LIQUID VISCOSITY MEASURING INSTRUMENT 审中-公开
公开(公告)号：JP2002323424A
公开(公告)日：2002-11-08
申请号：JP2002072039
申请日：2002-03-15
申请人： BOSCH GMBH ROBERT
发明人： JAKOBY BERNHARD , WEIBLEN KURT , BRIELMANN VOLKER
IPC分类号： G01N5/02 , G01N11/16
摘要： PROBLEM TO BE SOLVED: To provide a liquid viscosity measuring instrument that can accurately measure the viscosity of a liquid by preventing the electric characteristics of a piezoelectric sensor device from being affected by mechanical actions during the course of measurement. SOLUTION: In this liquid viscosity measuring instrument which measures the characteristics of the liquid, the piezoelectric sensor device has an electrical contacting spot for electric control section which is completely dipped in the liquid to be measured and has a resistance to the liquid. A power feeder has a resistance to the liquid and is connected to an electronic controlling/evaluating device on the outside of the liquid and also to the contacting spot of the sensor device by using an appropriate conductive adhesive section provided with a metallic piece.

7. 发明专利

JP2001033337A METHOD FOR MANUFACTURING PRESSURE SENSOR 失效
公开(公告)号：JP2001033337A
公开(公告)日：2001-02-09
申请号：JP2000188226
申请日：2000-06-22
申请人： BOSCH GMBH ROBERT
发明人： WEIBLEN KURT , DOERING ANTON , NIEDER JUERGEN , HAAG FRIEDER
IPC分类号： G01L19/14 , B81B7/00 , G01L9/00 , G01L9/04 , H01L29/84
摘要： PROBLEM TO BE SOLVED: To prevent a gap between a mold part and an assembly section from being formed by clamping the assembly section having a region being extended from the fitting surface of a semiconductor pressure pickup to the outside of a side part inside an injection mold. SOLUTION: A conductor frame with a semiconductor pressure pickup is inserted into an injection molding mold 40 that is composed of an upper part 41 and a lower part 42. A projection region 13 of an assembly section 12 of the conductor frame is clamped between an upper part 41 and a lower part 42 of the injection molding mold, thus the position detector of the assembly section 12 in the molding mold 40 is fixed. The lower part 42 of the mold in contact with a lower surface 15 of the assembly section 1 covers also a pressure passage 27. Then, the semiconductor pressure pickup is buried into a casing 30 made of a forming material by an injection molding method such as a force feeding forming. In this method, the forming material is liquefied in an injection mold chamber and then is forced into a mold closed under pressure to be cured in the mold. Then, the mold part is eliminated from the pressure sensor.

8. 发明专利

JP2000352540A METHOD FOR SETTING PRESSURE SENSOR TO PRESSURE SENSOR CASING, AND PRESSURE SENSOR APPARATUS HELD IN PRESSURE SENSOR CASING 失效
公开(公告)号：JP2000352540A
公开(公告)日：2000-12-19
申请号：JP2000126386
申请日：2000-04-26
申请人： BOSCH GMBH ROBERT
发明人： WEIBLEN KURT , GUENSCHEL ROLAND
IPC分类号： G01L19/14 , G01L9/00 , H01L29/84
摘要： PROBLEM TO BE SOLVED: To inexpensively set a pressure sensor by setting a template to a base of the pressure sensor which is to be coupled to a casing, and setting a lateral sectional area of an opening of the template to be smaller than a size of a chip element. SOLUTION: A pressure sensor casing 1 with a casing bottom part 2 and a casing 3 accommodates a pressure sensor 9. A measurement strip 11 is fixed to an upper face of a sensor chip 9.1. A pressure transmitted to the sensor chip 9.1 through a hole 10 can be converted to an electric signal by the measurement strip 11. Before a base 9.2 is brazed and soldered to the casing bottom part 2 in a groove-shaped notch 12, a template 13 of a stay type which remains in the base 9.2 is loaded to the casing bottom part 2. In brazing and soldering the base 9.2, the base 9.2 is guided sideways trough the template 13 and refrained from inclining. A size of an opening 14 is set so that the template 13 cannot move over the sensor chip 9.1.

9. 发明专利

JP2000236124A DEVICE FOR GENERATING ELECTRICAL PULSATION IN GHz REGION 失效
公开(公告)号：JP2000236124A
公开(公告)日：2000-08-29
申请号：JP2000037035
申请日：2000-02-15
申请人： BOSCH GMBH ROBERT
发明人： LEITER MANFRED , WEIBLEN KURT , LUCAS BERNHARD , SCHATZ FRANK , BEEZ THOMAS , SEIZ JUERGEN , BAUMANN HELMUT DR , OLBRICH HERBERT , EISENSCHMID HEINZ , EBERHARD MESS , DUTZI JOACHIM , KUGLER ANDREAS
IPC分类号： H01L47/02 , H01L23/48
摘要： PROBLEM TO BE SOLVED: To improve reliability in a continuous operation by fixedly mounting an elastic electrical contact device between the contact surface of a Gunn device and a casing cover. SOLUTION: A Gunn device 5 having a contact surface 6 is mounted on a base 3. A merallized elastic plastic ball 7 is fixed between a casing cover 4 and the contact surface 6. The elastic plastic ball 7 can be deformed in a vertical plane, when the casing cover 4 is required to move relative to the Gunn device 5. Also, three balls mode of gold which are bonded to each other in the up-down may be used to compensate for the relative movement. Also, a contact device may be mounted between the casing cover 4 and the contact surface 6. The contact device is made of a flexible woven body including a block-like member 10 made of a conductive band arranged in a conductive sleeve 9.

10. 发明专利

JP2000200979A CASING FOR ELECTRONIC STRUCTURE ELEMENT 失效
公开(公告)号：JP2000200979A
公开(公告)日：2000-07-18
申请号：JP34673899
申请日：1999-12-06
申请人： BOSCH GMBH ROBERT
发明人： LEITER MANFRED , WEIBLEN KURT , LUCAS BERNHARD , SCHATZ FRANK , BEEZ THOMAS , SEIZ JUERGEN , BAUMANN HELMUT DR , OLBRICH HERBERT , EISENSCHMID HEINZ , MOESS EBERHARD , DUTZI JOACHIM , KUGLER ANDREAS
IPC分类号： H05K5/02 , G01S7/282 , G01S13/93 , H01L23/48 , H03B9/12
摘要： PROBLEM TO BE SOLVED: To eliminate defects of a casing for public domain electronic structure elements. SOLUTION: This embodiment is a casing for electronic structure elements. This casing has a bottom part, a wall part, and a cover part. The electronic structure elements are enclosed with these parts. A contact spring 7, for causing electric connection in a connection part of the electronic structure elements, is fitted on a cover part 6. The cover part 6 and contact spring 7 are integrally constituted.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式