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1. 发明申请

WO2013134592A3 ATOMIC LAYER DEPOSITION STRENGTHENING MEMBERS AND METHOD OF MANUFACTURE 审中-公开
标题翻译：原子层沉积强化元件及其制造方法
公开(公告)号：WO2013134592A3
公开(公告)日：2013-10-31
申请号：PCT/US2013029763
申请日：2013-03-08
申请人： BOSCH GMBH ROBERT , YAMA GARY , PURKL FABIAN , LIGER MATTHIEU , ILLING MATTHIAS
发明人： YAMA GARY , PURKL FABIAN , LIGER MATTHIEU , ILLING MATTHIAS
IPC分类号： B81C1/00 , B81B3/00 , G01J5/02 , G01J5/20 , H01L27/146
CPC分类号： B81C1/00039 , B81B3/007 , B81B2201/0207 , B81B2203/0307 , B81C2201/0181 , G01J5/023 , H01L27/14649 , H01L27/14683
摘要： In one embodiment, a method of forming a semiconductor device includes providing a substrate, forming a sacrificial layer above the substrate layer, forming a first trench in the sacrificial layer, forming a first sidewall layer with a thickness of less than about 50 nm on a first sidewall of the first trench using atomic layer deposition (ALD), and removing the sacrificial layer.
摘要翻译：在一个实施例中，一种形成半导体器件的方法包括提供衬底，在衬底层上方形成牺牲层，在牺牲层中形成第一沟槽，在衬底上形成厚度小于约50nm的第一侧壁层使用原子层沉积（ALD）形成第一沟槽的第一侧壁，并去除牺牲层。

2. 发明申请

WO2007021396A8 MICROELECTROMECHANICAL DEVICES AND FABRICATION METHODS 审中-公开
标题翻译：微电子设备和制造方法
公开(公告)号：WO2007021396A8
公开(公告)日：2007-09-07
申请号：PCT/US2006026531
申请日：2006-07-07
申请人： BOSCH GMBH ROBERT , YAMA GARY
发明人： YAMA GARY
IPC分类号： B81C99/00
CPC分类号： B81C1/00333
摘要： There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. An embodiment further includes a buried polysilicon layer and a "protective layer" deposited over the buried polysilicon layer to prevent possible erosion of, or damage to the buried polysilicon layer during processing steps. The material that encapsulates the mechanical structures, when deposited, includes one or more of the following attributes: low tensile stress, good step coverage, maintains its integrity when subjected to subsequent processing, does not significantly and/or adversely impact the performance characteristics of the mechanical structures in the chamber (if coated with the material during deposition), and/or facilitates integration with high-performance integrated circuits. In one embodiment, the material that encapsulates the mechanical structures is, for example, silicon (polycrystalline, amorphous or porous, whether doped or undoped), silicon carbide, silicon-germanium, germanium, or gallium-arsenide.
摘要翻译：这里描述和说明了许多发明。在一个方面，本发明涉及MEMS器件，以及制造或制造MEMS器件的技术，其具有在最终封装之前封装在腔室中的机械结构。实施例还包括掩埋多晶硅层和沉积在掩埋多晶硅层上的“保护层”，以防止在处理步骤期间可能的侵蚀或损坏埋多晶硅层。当沉积时，封装机械结构的材料包括以下属性中的一个或多个：低拉伸应力，良好的阶梯覆盖，在经受后续加工时保持其完整性，不会显着和/或不利地影响室中的机械结构（如果在沉积期间涂覆材料）和/或促进与高性能集成电路的集成。在一个实施例中，封装机械结构的材料是例如硅（多晶，无定形或多孔，无论掺杂或未掺杂），碳化硅，硅 - 锗，锗或砷化镓。

3. 发明申请

WO2014036250A3 SERPENTINE IR SENSOR 审中-公开
标题翻译： SERPENTINE红外传感器
公开(公告)号：WO2014036250A3
公开(公告)日：2014-05-08
申请号：PCT/US2013057280
申请日：2013-08-29
申请人： BOSCH GMBH ROBERT , PURKLY FABIAN , YAMA GARY , FEYH ANDO , O'BRIEN GARY
发明人： PURKLY FABIAN , YAMA GARY , FEYH ANDO , O'BRIEN GARY
IPC分类号： G01J5/04 , G01J5/02 , G01J5/06 , G01J5/08 , G01J5/20
CPC分类号： H01L31/0232 , G01J5/0225 , G01J5/023 , G01J5/024 , G01J5/045 , G01J5/046 , G01J5/06 , G01J5/0809 , G01J5/0853 , G01J5/20 , H01L31/09
摘要： In one embodiment, a MEMS sensor includes a mirror and an absorber spaced apart from the mirror, the absorber including a plurality of spaced apart conductive legs defining a tortuous path across an area directly above the mirror.
摘要翻译：在一个实施例中，MEMS传感器包括反射镜和与反射镜间隔开的吸收体，所述吸收器包括多个间隔开的导电支柱，其限定穿过反射镜正上方的区域的曲折路径。

4. 发明申请

WO2008067097A3 MICROELECTROMECHANICAL DEVICES AND FABRICATION METHODS 审中-公开
标题翻译：微电子设备和制造方法
公开(公告)号：WO2008067097A3
公开(公告)日：2008-11-27
申请号：PCT/US2007082882
申请日：2007-10-29
申请人： BOSCH GMBH ROBERT , METZ MATTHIAS , PAN ZHIYU , STARK BRIAN , ULM MARKUS , YAMA GARY
发明人： METZ MATTHIAS , PAN ZHIYU , STARK BRIAN , ULM MARKUS , YAMA GARY
IPC分类号： B81C1/00
CPC分类号： B81C1/00301 , B81B2207/015 , B81B2207/097 , B81C2203/0136 , B81C2203/0145 , H01L21/56 , H01L2924/0002 , H01L2924/00
摘要： There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. An embodiment further includes location of a piezoelectric material as part of a semiconductor sensing structure. The semiconductor sensing structure, in conjunction with the piezoelectric material, can be used as a sensing device to provide an output signal associated with a sensed event.
摘要翻译：这里描述和说明了许多发明。在一个方面，本发明涉及MEMS器件，以及制造或制造MEMS器件的技术，其具有在最终封装之前封装在腔室中的机械结构。实施例还包括作为半导体感测结构的一部分的压电材料的位置。结合压电材料的半导体感测结构可以用作感测装置以提供与感测到的事件相关联的输出信号。

5. 发明申请

WO2007046869A3 IN-PLANE MECHANICALLY COUPLED MICROELECTROMECHANICAL TUNING FORK RESONATORS 审中-公开
标题翻译：平面机械耦合微电子机械调谐器谐振器
公开(公告)号：WO2007046869A3
公开(公告)日：2007-12-21
申请号：PCT/US2006019531
申请日：2006-05-19
申请人： BOSCH GMBH ROBERT , UNIV LELAND STANFORD JUNIOR , PAN ZHIYU , CHANDLER ROB NORRIS , LUTZ MARKUS , PARTRIDGE AARON , MATERNA VOLKER , YAMA GARY , FREY WILHELM
发明人： PAN ZHIYU , CHANDLER ROB NORRIS , LUTZ MARKUS , PARTRIDGE AARON , MATERNA VOLKER , YAMA GARY , FREY WILHELM
IPC分类号： H03H9/50 , H03H9/02
CPC分类号： H03H9/505 , H03H9/0023 , H03H9/02338 , H03H9/2468 , H03H2009/02496
摘要： In one aspect, the present invention is directed to a resonator architecture including a plurality of in-plane vibration microelectromechanical resonators (for example, 2 or 4 resonators) that are mechanically coupled to provide, for example, a differential signal output. In one embodiment, the present invention includes four commonly shaped microelectromechanical tuning fork resonators (12, 14, 16, 18) (for example, tuning fork resonators having two or more rectangular-shaped or square-shaped tines). Each resonator is mechanically coupled to another resonator of the architecture. For example, each resonator of the architecture is mechanically coupled to another one of the resonators on one side or a corner of one of the sides. In this way, all of the resonators, when induced, vibrate at the same frequency.
摘要翻译：在一个方面，本发明涉及一种包括机械耦合以提供例如差分信号输出的多个平面内振动微机电谐振器（例如，2或4个谐振器）的谐振器结构。在一个实施例中，本发明包括四个通常形状的微机电音叉谐振器（12,14,16,18）（例如，具有两个或更多个矩形或正方形形状的叉的音叉谐振器）。每个谐振器机械耦合到该架构的另一谐振器。例如，该架构的每个谐振器在其中一个侧面的一侧或拐角上机械耦合到另一个谐振器。以这种方式，所有谐振器在被感应时以相同的频率振动。

6. 发明申请

WO2014062273A3 SUBSTRATE WITH MULTIPLE ENCAPSULATED DEVICES 审中-公开
标题翻译：具有多个封装器件的衬底
公开(公告)号：WO2014062273A3
公开(公告)日：2014-06-26
申请号：PCT/US2013052974
申请日：2013-07-31
申请人： BOSCH GMBH ROBERT , CHEN PO-JUI , YAMA GARY , LIGER MATTHIEU , GRAHAM ANDREW
发明人： CHEN PO-JUI , YAMA GARY , LIGER MATTHIEU , GRAHAM ANDREW
IPC分类号： B81B7/02 , B81C1/00
CPC分类号： H01L29/84 , B81B2201/0235 , B81B2201/0242 , B81B2207/015 , B81C1/0023 , B81C2201/0197 , B81C2203/0136 , B81C2203/0771 , G01C19/5783 , G01P15/0802 , G01P15/18 , H01L29/66007
摘要： A device with multiple encapsulated functional layers, includes a substrate, a first functional layer positioned above a top surface of the substrate, the functional layer including a first device portion, a first encapsulating layer encapsulating the first functional layer, a second functional layer positioned above the first encapsulating layer, the second functional layer including a second device portion, and a second encapsulating layer encapsulating the second functional layer.
摘要翻译：具有多个封装功能层的器件包括衬底，位于衬底顶表面上方的第一功能层，功能层包括第一器件部分，封装第一功能层的第一封装层，位于第一功能层上方的第二功能层第一封装层，第二功能层包括第二器件部分和封装第二功能层的第二封装层。

7. 发明申请

WO2010107619A3 SUBSTRATE WITH MULTIPLE ENCAPSULATED PRESSURES 审中-公开
标题翻译：带有多个封装压力的基板
公开(公告)号：WO2010107619A3
公开(公告)日：2011-04-21
申请号：PCT/US2010026685
申请日：2010-03-09
申请人： BOSCH GMBH ROBERT , CANDLER ROBERT N , YAMA GARY
发明人： CANDLER ROBERT N , YAMA GARY
IPC分类号： B81B7/02 , B81C1/00
CPC分类号： H01L23/3171 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81C1/00293 , B81C2203/0136 , H01L2924/0002 , H01L2924/00
摘要： A method of forming a device with multiple encapsulated pressures is disclosed herein. In accordance with one embodiment of the present invention, there is provided a method of forming a device with multiple encapsulated pressures, including providing a substrate, forming a functional layer on top of a surface of the substrate, the functional layer including a first device portion at a first location, and a second device portion at a second location adjacent to the first location, encapsulating the functional layer, forming at least one diffusion resistant layer above the encapsulated functional layer at a location above the first location and not above the second location, modifying an environment adjacent the at least one diffusion resistant layer, and diffusing a gas into the second location as a result of the modified environment.
摘要翻译：本文公开了形成具有多个封装压力的装置的方法。根据本发明的一个实施例，提供了一种形成具有多个封装压力的器件的方法，包括提供衬底，在衬底的表面的顶部上形成功能层，所述功能层包括第一器件部分在第一位置处的第二设备部分和与第一位置相邻的第二位置处的第二设备部分，封装功能层，在第一位置上方并且不在第二位置之上的位置处在封装的功能层上方形成至少一个扩散阻挡层改变邻近所述至少一个扩散阻挡层的环境，以及由于所述改进的环境而将气体扩散到所述第二位置。

8. 发明申请

WO2006115592A8 ANTI-STICTION TECHNIQUE FOR ELECTROMECHANICAL SYSTEMS AND ELECTROMECHANICAL DEVICE EMPLOYING SAME 审中-公开
标题翻译：机电系统的防伪技术及其使用的电子设备
公开(公告)号：WO2006115592A8
公开(公告)日：2007-11-01
申请号：PCT/US2006008600
申请日：2006-03-10
申请人： BOSCH GMBH ROBERT , ULM MARKUS , METZ MATTHIAS , STARK BRIAN , YAMA GARY , LUTZ MARKUS , PARTRIDGE AARON , FREY WILHELM
发明人： ULM MARKUS , METZ MATTHIAS , STARK BRIAN , YAMA GARY , LUTZ MARKUS , PARTRIDGE AARON , FREY WILHELM
IPC分类号： B81C1/00
CPC分类号： B81C1/0096 , B81B3/0005 , B81C2201/112 , B82Y30/00 , H01L2224/13 , H01L2924/1461 , H01L2924/00
摘要： A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure. An anti-stiction layer is disposed on at least a portion of the mechanical structure. An anti-stiction channel is formed in at least one of the substrate and the encapsulation structure. A cap has at least one preform portion disposed over or in at least a portion of the anti-stiction channel to seal the anti-stiction channel, at least in part.
摘要翻译：机械结构设置在室中，其至少一部分由封装结构限定。第一种方法提供了一种通道盖，其具有至少部分地设置在防静电通道上方或至少一部分中的至少一个预制件部分，以密封抗静电通道。第二种方法提供了通道盖，其具有至少部分地设置在防静电通道上方或至少一部分中的至少一部分，以密封抗静脉通道。该至少一个部分与机电装置分开制造，然后固定在机电装置上。第三种方法提供了通道盖，其具有至少部分地设置在抗静电通道上方或至少一部分中的至少一个部分，以密封抗静脉通道。所述至少一个部分可以包括线球，螺柱，金属箔或焊料预制件。一种器件包括衬底，封装结构和机械结构。抗静电层设置在机械结构的至少一部分上。在基板和封装结构中的至少一个中形成抗静电通道。至少部分地，盖具有至少一个预制件部分设置在防静电通道的上方或其至少一部分中，以密封抗静电通道。

9. 发明公开

EP2973685A4 MEMS DEVICE HAVING A GETTER 有权
标题翻译： MEMS-VORRICHTUNG MIT EINEM GETTER
公开(公告)号：EP2973685A4
公开(公告)日：2016-10-12
申请号：EP14774321
申请日：2014-03-13
申请人： BOSCH GMBH ROBERT
发明人： SAMARAO ASHWIN , O'BRIEN GARY , FEYH ANDO , YAMA GARY , GRAHAM ANDREW , KIM BONGSANG , PURKL FABIAN
IPC分类号： H01L23/12 , B81B7/02 , H01L21/322
CPC分类号： B81C1/00285 , B81C2201/0115 , B81C2203/0109 , B81C2203/0118 , B81C2203/035 , H01L21/3223 , H01L21/3225 , H01L23/28
摘要： A microelectromechanical system (MEMS) device includes a high density getter. The high density getter includes a silicon surface area formed by porosification or by the formation of trenches within a sealed cavity of the device. The silicon surface area includes a deposition of titanium or other gettering material to reduce the amount of gas present in the sealed chamber such that a low pressure chamber is formed. The high density getter is used in bolometers and gyroscopes but is not limited to those devices.
摘要翻译：微机电系统（MEMS）装置包括高密度吸气剂。高密度吸气剂包括通过孔化形成的硅表面积或者通过在器件的密封空腔内形成沟槽。硅表面积包括钛或其它吸气材料的沉积物以减少存在于密封室中的气体的量，从而形成低压室。高密度吸气剂用于测辐射热计和陀螺仪，但不限于这些设备。

10. 发明申请

WO2014189600A3 ANISOTROPIC CONDUCTOR AND METHOD OF FABRICATION THEREOF 审中-公开
标题翻译：各向异性导体及其制造方法
公开(公告)号：WO2014189600A3
公开(公告)日：2015-01-29
申请号：PCT/US2014022175
申请日：2014-03-08
申请人： BOSCH GMBH ROBERT , FEYH ANDO , PURKL FABIAN , SAMARAO ASHWIN , YAMA GARY , O'BRIEN GARY
发明人： FEYH ANDO , PURKL FABIAN , SAMARAO ASHWIN , YAMA GARY , O'BRIEN GARY
IPC分类号： C23C28/00 , C23C16/455
CPC分类号： B81C1/00095 , B81B7/0006 , B82Y10/00 , B82Y30/00 , H01L21/02601 , H01L21/3142 , H01L45/146
摘要： An anisotropic conductor and a method of fabrication thereof. The anisotropic conductor includes an insulating matrix and a plurality of nanoparticles disposed therein. A first portion of the plurality of nanoparticles provides a conductor when subjected to a voltage and/or current pulse. A second portion of the plurality of the nanoparticles does not form a conductor when the voltage and or current pulse is applied to the first portion. The anisotropic conductor forms a conductive path between conductors of electronic devices, components, and systems, including microelectromechanical systems (MEMS) devices, components, and systems.
摘要翻译：各向异性导体及其制造方法。各向异性导体包括绝缘基体和设置在其中的多个纳米颗粒。多个纳米颗粒的第一部分在经受电压和/或电流脉冲时提供导体。当电压和/或电流脉冲施加到第一部分时，多个纳米颗粒的第二部分不形成导体。各向异性导体在电子器件，部件和系统的导体之间形成导电路径，包括微机电系统（MEMS）器件，部件和系统。

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