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1. 发明专利

DE112013004116T5 CMOS-Bolometer 未知
公开(公告)号：DE112013004116T5
公开(公告)日：2015-05-07
申请号：DE112013004116
申请日：2013-08-20
申请人： FEYH ANDO , O'BRIEN GARY , PURKL FABIAN , BOSCH GMBH ROBERT , SAMARAO ASHWIN , YAMA GARY
发明人： YAMA GARY , SAMARAO ASHWIN , FEYH ANDO , PURKL FABIAN , O'BRIEN GARY
IPC分类号： G01J5/02 , G01J5/20 , H01L27/144
摘要： Ein Verfahren für das Herstellen einer Halbleitereinrichtung beinhaltet das Bilden wenigstens einer Opferschicht auf einem Substrat während eines komplementären Metalloxid-Halbleiter-(CMOS-)Prozesses. Eine Absorberschicht wird auf der Oberfläche der wenigstens einen Opferschicht abgelagert. Ein Teilbereich der wenigstens einen Opferschicht unterhalb der Absorberschicht wird entfernt, um eine Lücke zu bilden, über welche ein Teilbereich der Absorberschicht aufgehängt ist. Die Opferschicht kann ein Oxid des CMOS-Prozesses sein, wobei das Oxid entfernt wird, um die Lücke zu bilden, wobei ein selektiver Wasserstoff-Fluorsäure-Dampf-Trockenätz-Freigabeprozess benutzt wird. Die Opferschicht kann auch eine Polymerschicht sein, wobei die Polymerschicht entfernt wird, um die Lücke zu bilden, wobei ein O2-Plasma-Ätzprozess benutzt wird.

2. 发明专利

DE112013004113T5 Einrichtung und Verfahren für das Erhöhen von Infrarotabsorption in Mems-Bolometern 未知
公开(公告)号：DE112013004113T5
公开(公告)日：2015-05-07
申请号：DE112013004113
申请日：2013-08-22
申请人： O'BRIEN GARY , BOSCH GMBH ROBERT , SAMARAO ASHWIN
发明人： SAMARAO ASHWIN , O'BRIEN GARY
IPC分类号： G01J5/20 , G01J5/08
摘要： Ein Halbleitersensor beinhaltet ein Substrat und einen Absorber. Das Substrat beinhaltet wenigstens eine reflektierende Komponente. Der Absorber ist von der wenigstens einen reflektierenden Komponente durch einen Abstand beabstandet. Der Absorber definiert eine Vielzahl von Öffnungen, wobei jede eine maximale Weite besitzt, welche geringer als oder gleich zu dem Abstand ist.

3. 发明公开

EP3031092A4 LI-ION BATTERY WITH ALUMINA COATED POROUS SILICON ANODE 有权转让
标题翻译：带有碳粉沉积多孔硅阳极的锂离子电池
公开(公告)号：EP3031092A4
公开(公告)日：2016-12-28
申请号：EP14834944
申请日：2014-08-08
申请人： BOSCH GMBH ROBERT , SAMARAO ASHWIN K , O'BRIEN GARY , FEYH ANDO LARS
发明人： SAMARAO ASHWIN K , O'BRIEN GARY , FEYH ANDO
IPC分类号： H01M4/38 , C23C16/40 , C23C16/455 , C23C16/52 , H01M4/02 , H01M4/04 , H01M4/134 , H01M4/36 , H01M10/0525 , H01M10/0562 , H01M10/058
CPC分类号： H01M4/366 , C23C16/045 , C23C16/403 , C23C16/45555 , C23C16/52 , H01M4/0428 , H01M4/134 , H01M4/382 , H01M4/386 , H01M10/0525 , H01M10/0562 , H01M10/058 , H01M2004/021 , H01M2220/20 , H01M2220/30 , H01M2300/0071 , H01M2300/0094 , Y02E60/122 , Y02T10/7011
摘要： A Li-ion battery in one embodiment includes a lithium based compound in a cathode, a first porous silicon portion in an anode, and a layer of atomic layer deposited (ALD) alumina coating the first porous silicon portion and contacting the cathode.

4. 发明公开

EP3031092A1 LI-ION BATTERY WITH ALUMINA COATED POROUS SILICON ANODE 有权转让
标题翻译：锂离子电池麻省理工学院陶氏硅酸盐
公开(公告)号：EP3031092A1
公开(公告)日：2016-06-15
申请号：EP14834944.2
申请日：2014-08-08
申请人： Robert Bosch GmbH , Samarao, Ashwin K. , O'Brien, Gary , Feyh, Ando, Lars
发明人： SAMARAO, Ashwin, K. , O'BRIEN, Gary , FEYH, Ando
IPC分类号： H01M4/38 , H01M10/0562 , H01M10/0525
CPC分类号： H01M4/366 , C23C16/045 , C23C16/403 , C23C16/45555 , C23C16/52 , H01M4/0428 , H01M4/134 , H01M4/382 , H01M4/386 , H01M10/0525 , H01M10/0562 , H01M10/058 , H01M2004/021 , H01M2220/20 , H01M2220/30 , H01M2300/0071 , H01M2300/0094 , Y02E60/122 , Y02T10/7011
摘要： A Li-ion battery in one embodiment includes a lithium based compound in a cathode, a first porous silicon portion in an anode, and a layer of atomic layer deposited (ALD) alumina coating the first porous silicon portion and contacting the cathode.
摘要翻译：在一个实施方案中，锂离子电池包括阴极中的锂基化合物，阳极中的第一多孔硅部分和涂覆第一多孔硅部分并接触阴极的原子层沉积（ALD）氧化铝层。

5. 发明公开

EP2986959A1 THIN-FILM ENCAPSULATED INFRARED SENSOR 有权转让
标题翻译： DÜNNSCHICHTGEKAPSELTER红外线传感器
公开(公告)号：EP2986959A1
公开(公告)日：2016-02-24
申请号：EP13821342.6
申请日：2013-12-20
申请人： Robert Bosch GmbH , Purkl, Fabian , Yama, Gary , Feyh, Ando , Graham, Andrew , Samarao, Ashwin , O'Brien, Gary
发明人： PURKL, Fabian , YAMA, Gary , FEYH, Ando , GRAHAM, Andrew , SAMARAO, Ashwin , O'BRIEN, Gary
IPC分类号： G01J5/04 , G01J5/20
CPC分类号： H01L31/0203 , G01J5/045 , G01J5/20 , H01L31/09 , H01L31/18
摘要： A method of fabricating a bolometer infrared sensor includes depositing a first sacrificial layer on a surface of a substrate over a sensor region, and forming an absorber structure for the infrared sensor on top of the first sacrificial layer. A second sacrificial layer is deposited on top of the absorber structure. An encapsulating thin film is then deposited on top of the second sacrificial layer. Vent holes are formed in the encapsulating thin film. The first and the second sacrificial layers are removed below the encapsulating thin film to release the absorber structure and form a cavity above the sensing region that extends down to the substrate in which the absorber structure is located via the vent holes. The vent holes are then closed in a vacuum environment to seal the absorber structure within the cavity.

6. 发明公开

EP2938979A1 MEMS INFRARED SENSOR INCLUDING A PLASMONIC LENS 有权转让
标题翻译： WITH A电浆LENS MEMS红外
公开(公告)号：EP2938979A1
公开(公告)日：2015-11-04
申请号：EP13821755.9
申请日：2013-12-20
申请人： Robert Bosch GmbH , Samarao, Ashwin , O'Brien, Gary , Feyh, Ando , Yama, Gary , Purkl, Fabian
发明人： SAMARAO, Ashwin , O'BRIEN, Gary , FEYH, Ando , YAMA, Gary , PURKL, Fabian
IPC分类号： G01J5/08 , G01J5/02 , G01J5/20 , G01J5/00
CPC分类号： G01J5/0815 , G01J5/025 , G01J5/0806 , G01J5/20 , G01J2005/0077
摘要： A portable thermal imaging system includes a portable housing configured to be carried by a user, a bolometer sensor assembly supported by the housing and including an array of thermal sensor elements and at least one plasmonic lens, a memory including program instructions, and a processor operably connected to the memory and to the sensor, and configured to execute the program instructions to obtain signals from each of a selected set of thermal sensor elements of the array of thermal sensor elements, assign each of the obtained signals with a respective color data associated with a temperature of a sensed object, and render the color data.

7. 发明公开

EP2984474A1 RESISTIVE MEMS HUMIDITY SENSOR 有权转让
标题翻译：电阻式微机电传感器
公开(公告)号：EP2984474A1
公开(公告)日：2016-02-17
申请号：EP13821548.8
申请日：2013-12-17
申请人： Robert Bosch GmbH , Feyh, Ando , Graham, Andrew , Samarao, Ashwin , Yama, Gary , O'Brien, Gary
发明人： FEYH, Ando , GRAHAM, Andrew , SAMARAO, Ashwin , YAMA, Gary , O'BRIEN, Gary
IPC分类号： G01N27/12
CPC分类号： G01N27/121
摘要： A semiconductor device includes a substrate, an insulating film provided on a surface of the substrate, and a sensing film formed of a conductive material deposited on top of the insulating film. The sensing film defines at least one conductive path between a first position and a second position on the insulating film. A first circuit connection is electrically connected to the sensing film at the first position on the insulating layer, and a second circuit connection is electrically connected to the sensing film at the second position. A control circuit is operatively connected to the first circuit connection and the second circuit connection for measuring an electrical resistance of the sensing film. The sensing film has a thickness that enables a resistivity of the sensing film to be altered predictably in a manner that is dependent on ambient moisture content.
摘要翻译：半导体器件包括衬底，设置在衬底的表面上的绝缘膜和由沉积在绝缘膜的顶部上的导电材料形成的感测膜。感测膜限定绝缘膜上的第一位置和第二位置之间的至少一个导电路径。第一电路连接在绝缘层上的第一位置电连接到感测膜，并且第二电路连接在第二位置电连接到感测膜。控制电路可操作地连接到第一电路连接和用于测量感测膜的电阻的第二电路连接。感测膜具有能够以取决于环境水分含量的方式预测地改变感测膜的电阻率的厚度。

8. 发明申请

WO2016094700A1 ANTI-GETTER: EXPANDABLE POLYMER MICROSPHERES FOR MEMS DEVICES 审中-公开
标题翻译：反射器：用于MEMS器件的可扩展的聚合物微结构
公开(公告)号：WO2016094700A1
公开(公告)日：2016-06-16
申请号：PCT/US2015/065061
申请日：2015-12-10
申请人： ROBERT BOSCH GMBH , SAMARAO, Ashwin, K. , O'BRIEN, Gary , FEYH, Ando
发明人： SAMARAO, Ashwin, K. , O'BRIEN, Gary , FEYH, Ando
IPC分类号： B81B7/02 , B81C1/00 , B81C3/00
CPC分类号： B81B7/0038 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81C1/00285
摘要： A method of fabricating a MEMS device includes depositing an expandable material into a first recess of a cap wafer. The cap wafer includes a plurality of walls that surround and define the first recess and a second recess. The cap wafer is bonded to a MEMS wafer including a first MEMS device and a second MEMS device. The first MEMS device is encapsulated in the first recess, and the second MEMS device is encapsulated in the second recess. The expandable material is then heated to at least an activation temperature to cause the expandable material to expand after the first recess has been sealed. The expansion of the expandable material causes a reduction in volume of the first recess.
摘要翻译：制造MEMS器件的方法包括将可膨胀材料沉积到盖晶片的第一凹槽中。盖晶片包括围绕并限定第一凹部和第二凹部的多个壁。盖晶片结合到包括第一MEMS器件和第二MEMS器件的MEMS晶片。第一MEMS器件被封装在第一凹部中，并且第二MEMS器件封装在第二凹部中。然后将可膨胀材料加热至至少活化温度，以使可膨胀材料在第一凹槽已被密封之后膨胀。可膨胀材料的膨胀导致第一凹部的体积减小。

9. 发明申请

WO2014031876A1 DEVICE AND METHOD FOR INCREASING INFRARED ABSORPTION IN MEMS BOLOMETERS 审中-公开
标题翻译：用于增加MEMS玻璃体中的红外吸收的装置和方法
公开(公告)号：WO2014031876A1
公开(公告)日：2014-02-27
申请号：PCT/US2013/056226
申请日：2013-08-22
申请人： ROBERT BOSCH GMBH , SAMARAO, Ashwin , O'BRIEN, Gary
发明人： SAMARAO, Ashwin , O'BRIEN, Gary
IPC分类号： G01J5/20 , G01J5/08
CPC分类号： G01J5/20 , G01J5/0853
摘要： A semiconductor sensor includes a substrate and an absorber. The substrate includes at least one reflective component. The absorber is spaced apart from the at least one reflective component by a distance. The absorber defines a plurality of openings each having a maximum width that is less than or equal to the distance.
摘要翻译：半导体传感器包括基板和吸收体。基板包括至少一个反射部件。吸收器与至少一个反射部件隔开一段距离。吸收器限定多个开口，每个开口具有小于或等于该距离的最大宽度。

10. 发明申请

WO2010062847A3 MICRO-ELECTROMECHANICAL RESONATORS HAVING ELECTRICALLY-TRIMMED RESONATOR BODIES THEREIN AND METHODS OF FABRICATING SAME USING JOULE HEATING 审中-公开
公开(公告)号：WO2010062847A3
公开(公告)日：2010-06-03
申请号：PCT/US2009/065489
申请日：2009-11-23
申请人： GEORGIA TECH RESEARCH CORPORATION , AYAZI, Farrokh , SAMARAO, Ashwin
发明人： AYAZI, Farrokh , SAMARAO, Ashwin
IPC分类号： H03H3/007 , H03H9/24 , H03H9/46
摘要： A micro-electromechanical resonator (10) includes an electrically-trimmed resonator body (14) having at least one stiffness-enhanced semiconductor region therein containing metal-semiconductor lattice bonds. These metal-semiconductor lattice bonds may be gold-silicon lattice bonds and/or aluminium-silicon lattice bonds. A surface of the resonator body is mass-loaded with the metal, which may be provided by a plurality of spaced-apart metal islands (12). These metal islands (12) may be aligned along a longitudinal axis of the resonator body (14). A size of the at least one stiffness-enhanced polycrystalline semiconductor region may be sufficient to yield an increase in resonant frequency of the resonator body relative to an otherwise equivalent resonator having a single crystal resonator body that is free of mass-loading by the metal.

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