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1. 发明专利

JP2001050838A MANUFACTURE OF PRESSURE SENSOR 失效
公开(公告)号：JP2001050838A
公开(公告)日：2001-02-23
申请号：JP2000187844
申请日：2000-06-22
申请人： BOSCH GMBH ROBERT
发明人： WEIBLEN KURT , DOERING ANTON , NIEDER JUERGEN , HAAG FRIEDER
IPC分类号： G01L9/04 , B29C45/02 , G01L9/00 , H01L21/56 , H01L29/84
摘要： PROBLEM TO BE SOLVED: To realize a method for surely avoiding the intrusion of molding material through a gap. SOLUTION: Means for cutting a pressure supply part 28 of a semiconductor pressure pickup 2 from a coating of molding material has a plunger 43 disposed while being spaced apart from the plane 20 of the pickup 2 on the side opposite to an assembling section 12 by a gap 45 in an injection molder 40. Fluidity of molding material is reduced in the region of the plunger 43 by varying the temperature thereof with respect to the temperature of liquefied molding material thus blocking at least complete intrusion of molding material into the gap 45.

2. 发明专利

JP2001033337A METHOD FOR MANUFACTURING PRESSURE SENSOR 失效
公开(公告)号：JP2001033337A
公开(公告)日：2001-02-09
申请号：JP2000188226
申请日：2000-06-22
申请人： BOSCH GMBH ROBERT
发明人： WEIBLEN KURT , DOERING ANTON , NIEDER JUERGEN , HAAG FRIEDER
IPC分类号： G01L19/14 , B81B7/00 , G01L9/00 , G01L9/04 , H01L29/84
摘要： PROBLEM TO BE SOLVED: To prevent a gap between a mold part and an assembly section from being formed by clamping the assembly section having a region being extended from the fitting surface of a semiconductor pressure pickup to the outside of a side part inside an injection mold. SOLUTION: A conductor frame with a semiconductor pressure pickup is inserted into an injection molding mold 40 that is composed of an upper part 41 and a lower part 42. A projection region 13 of an assembly section 12 of the conductor frame is clamped between an upper part 41 and a lower part 42 of the injection molding mold, thus the position detector of the assembly section 12 in the molding mold 40 is fixed. The lower part 42 of the mold in contact with a lower surface 15 of the assembly section 1 covers also a pressure passage 27. Then, the semiconductor pressure pickup is buried into a casing 30 made of a forming material by an injection molding method such as a force feeding forming. In this method, the forming material is liquefied in an injection mold chamber and then is forced into a mold closed under pressure to be cured in the mold. Then, the mold part is eliminated from the pressure sensor.

3. 发明专利

DE19929026B4 Verfahren zur Herstellung eines Drucksensors 未知
公开(公告)号：DE19929026B4
公开(公告)日：2011-02-24
申请号：DE19929026
申请日：1999-06-25
申请人： BOSCH GMBH ROBERT
发明人： WEIBLEN KURT , DOERING ANTON , NIEDER JUERGEN , HAAG FRIEDER
IPC分类号： G01L9/04 , H01L21/56 , B29C45/02 , G01L9/00 , H01L21/60 , H01L29/84

4. 发明专利

DE19929028A1 Completing pressure sensor by injection-molding around sensor assembly, is assisted by clamping lead frame mounting section in injection mold during injection of casing 未知
公开(公告)号：DE19929028A1
公开(公告)日：2000-12-28
申请号：DE19929028
申请日：1999-06-25
申请人： BOSCH GMBH ROBERT
发明人： WEIBLEN KURT , DOERING ANTON , NIEDER JUERGEN , HAAG FRIEDER
IPC分类号： G01L19/14 , B81B7/00 , G01L9/00 , G01L9/04 , H01L29/84 , H01L21/56 , H01L21/60
摘要： The mounting section (12) of the lead frame is clamped in the injection mold (40) during production of the casing. An Independent claim is included for the pressure sensor. The extended region (13) of the mounting section (12) of the lead frame (10) is not embedded in injected mass, and extends out to the side from the casing (30) of the pressure sensor. Preferred features: From the populated region of the semiconductor pressure receiver, an extended region (13) of the mounting section (12), projects out to one side. It is clamped between the two halves (41, 42) of the injection mold (40). Mold halves make contact on the upper and lower sides of the mounting section. A pressure channel (27) constructed in the mounting section below the semiconductor pressure receiver (2), is covered by the mold. The entire lower surface (15) of the mounting section facing away from the pressure receiver is covered by the mold half (42).

5. 发明专利

DE19929026A1 Manufacture of pressure sensor by injection molding over semiconductor mounting assembly and lead frame with clearance, employs plunger locally controlling temperature of duroplastic mass 未知
公开(公告)号：DE19929026A1
公开(公告)日：2000-12-28
申请号：DE19929026
申请日：1999-06-25
申请人： BOSCH GMBH ROBERT
发明人： WEIBLEN KURT , DOERING ANTON , NIEDER JUERGEN , HAAG FRIEDER
IPC分类号： G01L9/04 , B29C45/02 , G01L9/00 , H01L21/56 , H01L29/84 , H01L21/60
摘要： A plunger (43), in the injection mold (40) leaves clearance (45) from the side of the mounting section (12) opposite the semiconductor pressure receiver (2). Alternatively the gap is formed with the side of the receiver facing away from the mounting section. The temperature of the plunger (43) is altered relative to that of the injected liquid mass, to cause a reduction in fluidity close to the plunger. This inhibits penetration of the mass into the gap (45). Preferred features: Cooling the plunger raises the viscosity, causing incomplete penetration into the gap. Heating the plunger accelerates cross-linking and hardening near the plunger, preventing complete penetration of the gap by the mass.

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