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1. 发明专利

JP2002273699A MICROMECHANICAL ELEMENT AND ITS MANUFACTURING METHOD 审中-公开
公开(公告)号：JP2002273699A
公开(公告)日：2002-09-25
申请号：JP2002024155
申请日：2002-01-31
申请人： BOSCH GMBH ROBERT
发明人： FISCHER FRANK , HEIN PETER , GRAF ECKHARD
IPC分类号： B81C99/00 , B81B3/00 , B81B7/00 , B81C1/00 , B81C3/00
摘要： PROBLEM TO BE SOLVED: To provide a micromechanical element and offer its manufacturing method. SOLUTION: The micromechanical element includes a base board 3, at least one structured layer 5 including at least one functional structure 7, and a cap 1 covering the functional structure(s) 7 in such an arrangement that at least one hollow part 7a is formed between the cap 1 and the functional structure 7, and a bonding layer 2 to join the cap 1 with the structured layer 5, wherein the bonding layer 2 is made of an anode joinable glass, i.e., a bonding glass, having a thickness ranging from 300 nm to 100 μm, preferably to 50 μm.

2. 发明专利

JP2000003931A BONDING PAD STRUCTURE AND ITS MANUFACTURE 失效
公开(公告)号：JP2000003931A
公开(公告)日：2000-01-07
申请号：JP12766199
申请日：1999-05-07
申请人： BOSCH GMBH ROBERT
发明人： MUENZEL HORST , OFFENBERG MICHAEL , BISCHOF UDO , GRAF ECKHARD , LUTZ MARKUS
IPC分类号： H01L23/12 , B81B7/00 , B81C1/00 , G01C19/56 , G01P15/08 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To stop a shunt, which is sometimes caused by contaminated particles or the like which are made to have continuity electrically with a parallel circuit, by a simple method. SOLUTION: At the time of an etching of sacrifice layers 2 and 4 to expose a board 1 and/or a conductor path layer 3, at least a protective layer 5 is temporarily provided in a prescribed range under a bonding pad header 8 and around the header 8 on the layers 2 and 4 for stopping such an underetching as the etching of the layers 2 and 4 under the header 8.

3. 发明专利

JP2002093749A METHOD FOR DIVIDING SUBSTRATE WAFER INTO A PLURALITY OF SUBSTRATE CHIPS 审中-公开
公开(公告)号：JP2002093749A
公开(公告)日：2002-03-29
申请号：JP2001195317
申请日：2001-06-27
申请人： BOSCH GMBH ROBERT
发明人： FISCHER FRANK , GRAF ECKHARD
IPC分类号： H01L21/301 , H01L21/304 , H01L21/78
摘要： PROBLEM TO BE SOLVED: To provide a method for dividing a substrate wafer into a plurality of substrate chips, capable of obtaining a substrate chip having its basal surface particularly flexible and realizing time-saving dividing. SOLUTION: The substrate chip (20) is divided each other by a selective deep structure method capable of controlling material exfoliation deliberately limited in the lateral direction and preferential spatial in-depth of material to be worked.

4. 发明申请

WO2011151098A3 COMPONENT WITH A VIA AND METHOD FOR PRODUCING IT 审中-公开
标题翻译：具有接触过程的建筑构件及其生产方法
公开(公告)号：WO2011151098A3
公开(公告)日：2012-02-09
申请号：PCT/EP2011055825
申请日：2011-04-13
申请人： BOSCH GMBH ROBERT , GONSKA JULIAN , SCHLOSSER ROMAN , FREY JENS , WEBER HERIBERT , GRAF ECKHARD
发明人： GONSKA JULIAN , SCHLOSSER ROMAN , FREY JENS , WEBER HERIBERT , GRAF ECKHARD
IPC分类号： B81C1/00
CPC分类号： H01L23/481 , B81B2203/033 , B81B2207/095 , B81C1/00095 , H01L21/76837 , H01L23/04 , H01L2224/48463 , H01L2924/1461 , H01L2924/00
摘要： An advantageous possibility for realizing electrically very reliable and mechanically extremely stable vias in components is proposed, the functionality of which is realized in a layer construction on a conductive substrate (100). The via (Vertical Interconnect Access) (3) led onto the component rear side and serving for making electrical contact with functional elements (18) realized in the layer construction comprises a connection region in the substrate (100), which connection region extends over the entire substrate thickness and is electrically insulated from the adjoining substrate (100) by a trench-type insulation frame (2) likewise extending over the entire substrate thickness. According to the invention, the trench-type insulation frame (2) is filled with an electrically insulating polymer (21).
摘要翻译：提出了一种有利的可能性，即在功能性以导电衬底（100）上的层结构实现的器件中实现电非常可靠和机械上非常稳定的过孔。用于电接触在层结构中实现的功能元件（18）的垂直互连通路VIA（3）包括衬底（100）中的连接区域，其在整个衬底厚度上延伸并穿过一个在整个衬底厚度上延伸的沟槽形绝缘框架（2）相对于相邻衬底（100）也是电绝缘的。根据具有电绝缘聚合物（21）的沟槽状绝缘框架（2）被填充。

5. 发明申请

WO03106328A2 MICROMECHANICAL COMPONENT AND CORRESPONDING PRODUCTION METHOD 审中-公开
标题翻译：微机械结构及相应方法
公开(公告)号：WO03106328A2
公开(公告)日：2003-12-24
申请号：PCT/DE0300552
申请日：2003-02-21
申请人： BOSCH GMBH ROBERT , NUECHTER WOLFGANG , FISCHER FRANK , HAAG FRIEDER , GRAF ECKHARD
发明人： NUECHTER WOLFGANG , FISCHER FRANK , HAAG FRIEDER , GRAF ECKHARD
IPC分类号： B81B3/00 , B81B7/00 , B81C3/00 , H01L21/56 , H01L21/60 , H01L23/02 , H01L23/495
CPC分类号： B81B7/0077 , H01L21/563 , H01L23/49575 , H01L2224/16145 , H01L2224/32145 , H01L2224/48091 , H01L2224/48247 , H01L2224/73204 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a micromechanical component comprising a chip (18;18a-e) mounted on a substrate (15a-e), said chip having a capped region (19; 19a-e) which is raised in relation to its surrounding area and an assembly region (9) provided in the surrounding area of the capped chip region (19; 19a-e). Said chip (18;18a-e) is mounted on the substrate (15a-e), by means of an assembly device (16) which is connected to the assembly region (9), in such a way that the capped chip region (19; 19a-e) faces the substrate (15a-e) and is at a distance from the same. The capped chip region (19; 19a-e) is surrounded by an underfilling (20) beneath the chip (18;18a-e). The invention also relates to a corresponding production method.
摘要翻译：本发明提供了一种具有微机械部件的基座（15A-E），其安装芯片（18; 18A）上相比，它的周围环境，其增加时，封端的芯片区域（19; 19A-E）和（在加盖芯片区域19的附近 ;具有图19A-E）提供了一种用于安装区域（9）; 其中，所述芯片;安装到所述封端的芯片区域（19; 19A-E）（18 18A-e）通过其被连接到所述安装区域（9），以这样的方式基座（15A-E）上的安装装置（16）的装置到基座（15A-E）具有并与其间隔开; 和封端的芯片面积;所述芯片下底层填料（20）的（19 19A-E）（18; 18A-E）被包围。本发明还提供了相应的制造方法。

6. 发明申请

WO2008132028A2 METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT HAVING A TRENCH STRUCTURE FOR BACKSIDE CONTACT 审中-公开
标题翻译：用于生产用于背面侧的具有微机械部件沟槽结构
公开(公告)号：WO2008132028A2
公开(公告)日：2008-11-06
申请号：PCT/EP2008054233
申请日：2008-04-08
申请人： BOSCH GMBH ROBERT , SCHEUERER ROLAND , WEBER HERIBERT , GRAF ECKHARD
发明人： SCHEUERER ROLAND , WEBER HERIBERT , GRAF ECKHARD
IPC分类号： B81B7/00
CPC分类号： B81C1/00095
摘要： The invention relates to a method for producing a micromechanical component. The aim of the invention is to produce at least one trench structure in a substrate, said trench structure having a depth that is less than the substrate thickness. An insulating layer is applied to a first face of the substrate and a filler layer is produced on or applied to the substrate. Said filler layer comprises a filler material that fills the trench structure essentially completely. A planarization within a plane of the filler layer or the insulating layer or the substrate produces a planar first face of the substrate. Subsequently, the second face of the substrate is planarized. The invention also relates to a micromechanical component which is produced according to said method.
摘要翻译：它提出了一种用于制造微机械部件的方法。以下是在一个基板上的至少一个沟槽结构具有的深度小于所述衬底的厚度中产生。在基板也形成绝缘层和填充层的第一侧，在基板上形成或施加。填料层具有基本上完全填充沟槽结构的填充材料。通过填料层或绝缘层或衬底的一个平面内的后续平坦化，产生了衬底的平坦第一侧。接着，将基板的第二侧的一个额外的平面化。本发明的另一个目的是一种微机械部件，它是由本发明方法生产。

7. 发明申请

WO0158803A3 METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT, AND A COMPONENT PRODUCED ACCORDING TO SAID METHOD 审中-公开
标题翻译：用于生产微机械结构和直线到组件MADE
公开(公告)号：WO0158803A3
公开(公告)日：2002-03-14
申请号：PCT/DE0004673
申请日：2000-12-28
申请人： BOSCH GMBH ROBERT , FISCHER FRANK , HEIN PETER , GRAF ECKHARD
发明人： FISCHER FRANK , HEIN PETER , GRAF ECKHARD
IPC分类号： B81B3/00 , B81C1/00 , B81C3/00 , G01P15/08 , G01P15/125 , H01L29/84
CPC分类号： B81C1/00801 , B81B2203/0136 , B81B2203/0315 , B81C2201/0109 , B81C2201/053 , G01P15/0802 , G01P15/125 , G01P2015/0814
摘要： The invention relates to a method for producing a micromechanical component (100) that comprises at least one cavity (110) and one functional element (12) at least partially disposed in said cavity (110) and/or one functional layer (13a, 13b, 13c) at least partially disposed therein. The invention further relates to a micromechanical component (100) produced according to the inventive method. The aim of the invention is to reduce the production costs for such a micromechanical component. To this end, the functional element (12) and/or the functional layer (13a, 13b, 13c) is provided with a first protective layer (41; 71) at least in a zone that adjoins a first sacrificial coating (52) that temporarily occupies the space of the cavity (22) subsequently formed in one or more etching steps. The material of the first protective layer (41) is selected in such a manner that at least one etching method and/or etching agent etching or dissolving the first sacrificial coating (52) does substantially not corrode the first protective layer (41; 71) or corrodes it only at a reduced etching rate in relation to the first sacrificial coating (52).
摘要翻译：本发明涉及一种用于制造微机械部件（100）的方法，设置有至少一个腔（110）和一个至少在所述腔内部分（110）的功能元件（12）和/或至少部分地设置在其中功能层（13A， 13B，13C），以及根据根据有关独立权利要求的前序部分的方法（100）制备的微机械部件。以降低制造成本，功能元件（12）和/或所述功能层（13A，13B，13C）是相邻于第一牺牲层（52）的区域中的至少该暂时形成在下面的一个或多个蚀刻步骤的空间空腔（22）占据，其中第一保护层（41; 71）提供（图4;图7），其中，所述第一保护层（41）的材料被选择为使得至少一个第一牺牲层（52）或腐蚀性。解析度蚀刻和/或蚀刻介质，所述第一保护层（41; 71）基本上仅与相对于所述第一牺牲层（52）蚀刻速度降低的接合或没有。

8. 发明申请

WO2011151098A2 COMPONENT WITH A VIA AND METHOD FOR PRODUCING IT 审中-公开
标题翻译：通过A和方法用于分量ITS
公开(公告)号：WO2011151098A2
公开(公告)日：2011-12-08
申请号：PCT/EP2011055825
申请日：2011-04-13
申请人： BOSCH GMBH ROBERT , GONSKA JULIAN , SCHLOSSER ROMAN , FREY JENS , WEBER HERIBERT , GRAF ECKHARD
发明人： GONSKA JULIAN , SCHLOSSER ROMAN , FREY JENS , WEBER HERIBERT , GRAF ECKHARD
IPC分类号： B81C1/00
CPC分类号： H01L23/481 , B81B2203/033 , B81B2207/095 , B81C1/00095 , H01L21/76837 , H01L23/04 , H01L2224/48463 , H01L2924/1461 , H01L2924/00
摘要： An advantageous possibility for realizing electrically very reliable and mechanically extremely stable vias in components is proposed, the functionality of which is realized in a layer construction on a conductive substrate (100). The via (Vertical Interconnect Access) (3) led onto the component rear side and serving for making electrical contact with functional elements (18) realized in the layer construction comprises a connection region in the substrate (100), which connection region extends over the entire substrate thickness and is electrically insulated from the adjoining substrate (100) by a trench-type insulation frame (2) likewise extending over the entire substrate thickness. According to the invention, the trench-type insulation frame (2) is filled with an electrically insulating polymer (21).
摘要翻译：它是实现高度可靠的电和机械非常稳定在馈通装置提出了一种有利的可能性，该功能是在导电性基板（100）上的层结构来实现。背面经由（垂直互连访问VIA）（3），供应用于在层结构的功能元件实现电接触（18）的设备上的引导包括其中在基板整个厚度延伸的基板（100）的连接区域，并通过延伸同样延伸在整个基片厚度，墓形绝缘框架（2）相对于相邻的基板（100）是电绝缘的。根据本发明的严重形绝缘框架（2）填充有电绝缘的聚合物（21）。

9. 发明申请

WO2008132024A3 METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT HAVING A FILLER LAYER AND A MASKING LAYER 审中-公开
标题翻译：生产具有一个填料层和掩模层的微机械部件
公开(公告)号：WO2008132024A3
公开(公告)日：2009-01-15
申请号：PCT/EP2008054187
申请日：2008-04-08
申请人： BOSCH GMBH ROBERT , SCHEUERER ROLAND , WEBER HERIBERT , GRAF ECKHARD
发明人： SCHEUERER ROLAND , WEBER HERIBERT , GRAF ECKHARD
IPC分类号： B81C1/00
CPC分类号： B81C1/00333 , B81B2203/033 , B81C1/0015 , B81C2201/0197
摘要： The invention relates to a method for producing a micromechanical component. According to said method, a trench structure is essentially completely filled with a first filler layer and a first masking layer is applied to the first filler layer, to which masking layer a second filler layer and a second masking layer are applied. The invention also relates to a micromechanical component, wherein the first filler layer fills the trench structure of the micromechanical component and at the same time forms a mobile sensor structure.
摘要翻译：它提出了一种用于制造微机械部件，其中沟槽结构基本上完全由第一填料和第一掩模层填充的方法沉积在第一填料层上，反过来，第二填料和第二掩模层可以在沉积。此外，微机械部件，提出，其中，所述第一填料填充所述微机械装置的沟槽结构，同时形成可移动的传感器结构。

10. 发明专利

DE102013206597A1 Verfahren zur Herstellung von Halbleiterbauelementen mit seitlichen Anschlusspads 未知
公开(公告)号：DE102013206597A1
公开(公告)日：2014-10-16
申请号：DE102013206597
申请日：2013-04-12
申请人： BOSCH GMBH ROBERT
发明人： GONSKA JULIAN , SCHARY TIMO , BENZEL HUBERT , GRAF ECKHARD , BUSSE STEFAN
IPC分类号： H01L21/78 , H01L21/283 , H01L21/58
摘要： Es werden Maßnahmen vorgeschlagen, durch die dickere Halbleiterbauelemente (10), deren Funktionalität (11) zumindest teilweise in der Bauelementvorderseite realisiert ist, wie z.B. mikromechanische Sensor- und Aktorbauelemente, mit seitlichen Anschlusspads (13) ausgestattet werden können, wobei die Position und Größe dieser Anschlusspads weitgehend unabhängig von der Größe der Bauelementseitenfläche vorgegeben werden können. Erfindungsgemäß werden sowohl die Funktionalität (11) der Halbleiterbauelemente (10) als auch die seitlichen Anschlusspads (13) im Waferverbund (100) angelegt. Dazu wird zunächst zumindest ein Abschnitt einer Seitenfläche jedes Halbleiterbauelements (10) durch einen ersten Trenchgraben (1) in der Vorderseite des Waferverbunds (100) definiert. Auf die so strukturierte Vorderseite des Waferverbunds (100) wird dann mindestens eine dielektrische Isolationsschicht (5) aufgebracht, und zwar insbesondere auf die Wandung des ersten Trenchgrabens (1). Dann wird mindestens eine elektrisch leitfähige Beschichtung (6) auf die dielektrische Isolationsschicht (5) aufgebracht, ebenfalls insbesondere im Bereich der Wandung des ersten Trenchgrabens (1). Zur Vereinzelung der Halbleiterbauelemente (10) wird mindestens ein zweiter Trenchgraben (2) in die Vorderseite des Waferverbunds (100) eingebracht, wobei die dielektrische Isolationsschicht (5) auf der Wandung des ersten Trenchgrabens (1) als seitliche Begrenzung für den zweiten Trenchgraben (2) genutzt wird. Die Halbleiterbauelemente (10) werden schließlich von der Rückseite ausgehend aus dem Waferverbund (100) herausgetrennt, wobei in der Rückseite des Waferverbunds (100) mindestens ein Schnitt (3) erzeugt wird, der in den zweiten Trenchgraben (2) mündet.

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