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    • 6. 发明专利
    • DE102005043242A1
    • 2007-03-15
    • DE102005043242
    • 2005-09-09
    • BASF AG
    • SCHNEIDER NORBERTLIPPERT GERALDLOCHTMAN RENEMAAS HEIKOPFISTER JUERGENSOBOTKA BETTINAWAGNER NORBERT
    • C08J7/04C09D5/38C09D5/23C09D5/32C09K23/00
    • Dispersion for applying a metal layer on an electrically non-conductive substrate comprises an organic binder component (0.01-30 wt.%); a metal component (30-89.99 wt.%) containing a first metal with a first metal particle (0.01-99.99 wt.%) and a second metal with a second metal particle (99.99-0.01 wt.%); and a solvent component (10-69.99 wt.%); where the first metal and -particle and second metal and -particle are different from each other. Independent claims are included for: (1) a method for preparing the dispersion comprising mixing an organic binder component, a metal component containing a first metal with a first metal particle and a second metal with a second metal particle, a solvent component, dispersing agent, filler components and further components, and dispersing the obtained mixture; (2) preparation of metal layer on at least a part of an electrically non-conductive substrate comprising applying the dispersion on the substrate, drying the dispersion applied layer on the substrate and optionally de-energizing and/or galvanically separating the metal on the dried dispersion layer; and (3) a substrate surface comprising at least a partially electrical conductive metal layer.