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    • 4. 发明申请
    • ELECTROPLATING DEVICE AND METHOD
    • DEVICE AND METHOD FOR电镀层
    • WO2007118875A2
    • 2007-10-25
    • PCT/EP2007053707
    • 2007-04-17
    • BASF AGLOCHTMAN RENEKACZUN JUERGENSCHNEIDER NORBERTPFISTER JUERGENPOHL GERTWAGNER NORBERT
    • LOCHTMAN RENEKACZUN JUERGENSCHNEIDER NORBERTPFISTER JUERGENPOHL GERTWAGNER NORBERT
    • C25D5/54C25D17/00C25D17/12
    • C25D17/14C25D5/06C25D5/54C25D7/0621C25D17/005C25D17/12H05K3/241
    • The invention relates to a device for electroplating at least one electrically conductive substrate (8), or an electrically conductive structure situated on a non-conductive substrate (8). Said device comprises at least one bath, an anode and a cathode (2). The bath contains an electrolyte solution, which comprises at least one metal salt and from which metal ions are deposited on electrically conductive surfaces of the substrate, as the cathode is brought into contact with the surface of the substrate to be coated and said substrate is conveyed through the bath. The cathode comprises at least one strip (2) with at least one electrically conductive segment (12) and is guided around at least two rotating shafts (3). The invention also relates to a method for electroplating at least one substrate that is carried out in a device according to the invention. According to said method, to produce the coating, the strip lies on the substrate and circulates at a speed corresponding to the speed at which the substrate is conveyed through the bath. The invention further relates to the use of said device for electroplating electrically conductive structures situated on an electrically non-conductive support.
    • 本发明涉及一种用于至少一个导电基材(8)或不导电的基底上(8),包括至少一个浴,一个阳极和一个阴极(2)一种导电图案的电镀涂层,其中所述浴至少 包含含有金属离子的金属的盐的电解质溶液是从沉积在衬底的导电表面,而阴极被带入与所述表面接触到待涂覆的基材和所述衬底通过所述浴输送。 阴极包括至少一条带(2)与被引导围绕至少一个导电部分(12)的至少两个可转动的轴(3)。 此外,本发明涉及一种用于至少一个基板,其在根据本发明的装置中进行,其中,对于涂覆该带被支撑在基板上,并在对应于所述速度在该基板通过该浴传递的圆周速度旋转的电解涂覆的方法 , 最后,本发明还可以根据本发明的用于导电结构的不导电的载体上电解涂覆涉及一种使用该装置。
    • 5. 发明申请
    • ELECTROPLATING DEVICE AND METHOD
    • DEVICE AND METHOD FOR电镀层
    • WO2007118810A3
    • 2008-05-22
    • PCT/EP2007053401
    • 2007-04-05
    • BASF SELOCHTMAN RENEKACZUN JUERGENSCHNEIDER NORBERTPFISTER JUERGENPOHL GERTWAGNER NORBERT
    • LOCHTMAN RENEKACZUN JUERGENSCHNEIDER NORBERTPFISTER JUERGENPOHL GERTWAGNER NORBERT
    • C25D7/06C25D7/00C25D17/00
    • C25D17/12C25D7/0657C25D17/005C25D17/06C25D17/28
    • The invention relates to a device for electroplating at least one electrically conductive substrate or a structured or electrically conductive surface covering the whole area of a non-conductive substrate. Said device comprises at least one bath, an anode and a cathode. The bath contains an electrolyte solution, which comprises at least one metal salt and from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer, as the cathode is brought into contact with the surface of the substrate to be coated and said substrate is conveyed through the bath. The cathode comprises at least two discs (2, 4, 10) that are rotatably mounted on a respective shaft (1, 5, 14), said discs (2, 4, 10) intermeshing. The invention also relates to a method for electroplating at least one substrate, said method being carried out in a device according to the invention. The invention further relates to the use of said device for electroplating electrically conductive structures situated on an electrically non-conductive support.
    • 本发明涉及一种用于至少一个导电基材的电解涂覆或结构化的或全表面导电表面的不导电基板,其包括至少一个浴,在阳极和阴极上,其中电解液中含有至少一个含金属盐的电解液, 从上所述衬底以形成金属层的导电表面中的金属离子被沉积,而阴极被带入与所述表面接触到待涂覆的基材和所述衬底通过所述浴输送。 阴极包括在在任轴(1,5,14)可旋转地安装盘(2,4,10),所述盘(2,4,10)插入每个网格的至少两个。 此外,Erfindüng涉及一种用于至少一个基板,其在根据本发明的装置中进行的电解涂覆的方法。 最后,本发明还可以根据本发明的用于导电结构的不导电的载体上电解涂覆涉及一种使用该装置。