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    • 2. 发明授权
    • Manual feeding method for robots
    • 机器人手动进给方法
    • US5485389A
    • 1996-01-16
    • US193210
    • 1994-02-14
    • Tomoyuki TeradaHirotsugu Kaihori
    • Tomoyuki TeradaHirotsugu Kaihori
    • B25J9/10B25J9/16B25J9/18B25J9/22G05B19/416G05B19/425G05B19/4061G06F19/00
    • B25J9/1656G05B19/425G05B2219/36471G05B2219/39083
    • A method of manually feeding robots to ensure an efficient and safe teaching operation for each robot, even when the multiplicity of robots are arranged close to each other. As long as a controller B receives a manual feed command, coordinates representing current positions of feature points Pi and Qj defined on the robots A1 and A2 are sequentially simulated for being updated and stored in the RAM. The distances R between the feature points Pi (i=1 to final value) and feature points Qj (j=1 to final value) are determined sequentially. Each time a smaller distance between the feature points is calculated, the value is updated and stored into the register R min to calculate a shortest distance between the robots A1 and A2. The actual manual feed rate V is increased or decreased in response to the value of the shortest distance R min.
    • PCT No.PCT / JP93 / 00787 Sec。 371日期1994年2月14日 102(e)日期1994年2月14日PCT提交1993年6月11日PCT公布。 公开号WO93 / 25356 日期:1993年12月23日。一种手动进给机器人的方法,以确保每个机器人的有效和安全的教学操作,即使多个机器人彼此靠近布置。 只要控制器B接收到手动进给命令,就顺序地模拟表示在机器人A1和A2上定义的特征点Pi和Qj的当前位置的坐标,以便更新并存储在RAM中。 特征点Pi(i = 1〜最终值)与特征点Qj(j = 1〜最终值)之间的距离R依次确定。 每当特征点之间的距离较小时,该值被更新并存储到寄存器R min中以计算机器人A1和A2之间的最短距离。 实际手动进给速度V响应于最短距离R min的值而增加或减小。
    • 5. 发明授权
    • Method of automatically adjusting welding conditions for an arc welding
robot
    • 自动调整电弧焊机器人焊接条件的方法
    • US5528013A
    • 1996-06-18
    • US347489
    • 1995-02-23
    • Hirotsugu KaihoriKyozi Iwasaki
    • Hirotsugu KaihoriKyozi Iwasaki
    • B23K9/095B23K9/10B23K9/12B23K9/127
    • B23K9/1062
    • A method, such that, using known data, a relationship between a target welding current and a welding current command to be instructed to a welding machine to achieve the target welding current is estimated by a linear formula. Then, a welding current command corresponding to a welding current to be achieved is obtained according to the linear formula, and is actually supplied to the welding machine to carry out a welding operation. An actual welding current is fed back from the welding machine, and this actual welding current and the welding current command associated therewith are stored as one set of data. This process is repeated using different welding current command values, and the resulting sets of data each including the combination of a corresponding welding current command and actual welding current are stored. Based on a plurality of sets of data thus obtained, a linear relational formula, representing the relationship between the actual welding current (target welding current) and the current command, is derived for each of a plurality of welding current ranges.
    • PCT No.PCT / JP94 / 00589 Sec。 371日期1995年2月23日 102(e)1995年2月23日PCT PCT 1994年4月7日PCT公布。 公开号WO94 / 23882 日期:1994年10月27日。一种使用已知数据的方法,通过线性公式来估计目标焊接电流和要指示焊接机实现目标焊接电流的焊接电流指令之间的关系。 然后,根据线性公式获得与实现的焊接电流对应的焊接电流指令,实际上供给焊接机进行焊接作业。 从焊接机器反馈实际的焊接电流,将该实际焊接电流与与其相关的焊接电流指令作为一组数据存储。 使用不同的焊接电流指令值重复该过程,并且存储各自包括对应的焊接电流指令和实际焊接电流的组合的所得到的数据组。 基于如此获得的多组数据,针对多个焊接电流范围中的每一个导出表示实际焊接电流(目标焊接电流)与电流指令之间的关系的线性关系式。
    • 6. 发明授权
    • Reflected light intensity ratio measuring device, device for measuring light energy absorption ratio and heat treatment apparatus
    • 反射光强度比测量装置,光能吸收率测量装置和热处理装置
    • US07439534B2
    • 2008-10-21
    • US11479296
    • 2006-06-30
    • Hirotsugu Kaihori
    • Hirotsugu Kaihori
    • G01N21/86G01N21/88G01V8/00
    • H01L21/67115H01L21/67248
    • A measuring optical system for emitting and receiving light is fixedly installed in a ceiling portion of a measuring device, and a wafer holding part for supporting a semiconductor wafer is provided in a bottom portion of the measuring device. A support table is horizontally laid between support pins of the wafer holding part, and a calibration standard member for calibration is placed on an upper surface of the support table. When a semiconductor wafer is supported by the support pins, light emerging from the measuring optical system impinges upon the semiconductor wafer, and the reflection intensity of the light is measured. When no semiconductor wafer is supported by the support pins, light emerging from the measuring optical system impinges upon the calibration standard member, whereby the calibration can be done at any time.
    • 用于发射和接收光的测量光学系统固定地安装在测量装置的顶部,并且在测量装置的底部设置用于支撑半导体晶片的晶片保持部。 将支撑台水平放置在晶片保持部件的支撑销之间,并且用于校准的校准标准构件放置在支撑台的上表面上。 当半导体晶片被支撑销支撑时,从测量光学系统出射的光照射在半导体晶片上,并测量光的反射强度。 当没有半导体晶片被支撑销支撑时,从测量光学系统出射的光照射到校准标准件上,由此可以在任何时间进行校准。
    • 7. 发明申请
    • Reflected light intensity ratio measuring device, device for measuring light energy absorption ratio and heat treatment apparatus
    • 反射光强度比测量装置,光能吸收率测量装置和热处理装置
    • US20070003259A1
    • 2007-01-04
    • US11479296
    • 2006-06-30
    • Hirotsugu Kaihori
    • Hirotsugu Kaihori
    • F26B19/00
    • H01L21/67115H01L21/67248
    • A measuring optical system for emitting and receiving light is fixedly installed in a ceiling portion of a measuring device, and a wafer holding part for supporting a semiconductor wafer is provided in a bottom portion of the measuring device. A support table is horizontally laid between support pins of the wafer holding part, and a calibration standard member for calibration is placed on an upper surface of the support table. When a semiconductor wafer is supported by the support pins, light emerging from the measuring optical system impinges upon the semiconductor wafer, and the reflection intensity of the light is measured. When no semiconductor wafer is supported by the support pins, light emerging from the measuring optical system impinges upon the calibration standard member, whereby the calibration can be done at any time.
    • 用于发射和接收光的测量光学系统固定地安装在测量装置的顶部,并且在测量装置的底部设置用于支撑半导体晶片的晶片保持部。 将支撑台水平放置在晶片保持部件的支撑销之间,并且用于校准的校准标准构件放置在支撑台的上表面上。 当半导体晶片被支撑销支撑时,从测量光学系统出射的光照射在半导体晶片上,并测量光的反射强度。 当没有半导体晶片被支撑销支撑时,从测量光学系统出射的光照射到校准标准件上,由此可以在任何时间进行校准。