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1. 发明授权

US5312803A Process for producing Bi- and Pb-containing oxide superconducting wiring films 失效
标题翻译：生产含Bi和Pb的氧化物超导布线膜的工艺
公开(公告)号：US5312803A
公开(公告)日：1994-05-17
申请号：US861823
申请日：1992-06-16
申请人： Atsushi Tanaka , Kazunori Yamanaka , Nobuo Kamehara , Koichi Niwa
发明人： Atsushi Tanaka , Kazunori Yamanaka , Nobuo Kamehara , Koichi Niwa
IPC分类号： H01L39/24 , B05D5/12
CPC分类号： H01L39/2464 , Y10S505/704 , Y10S505/73 , Y10S505/731 , Y10S505/732 , Y10S505/741 , Y10S505/742
摘要： In an oxide superconducting film wiring, when the line width is reduced, the evaporation of a component during firing becomes so vigorous that it becomes impossible to form a desired single crystal phase, which causes a significant lowering in the properties of the oxide superconducting wiring. This problem can be solved by preventing the evaporation of the evaporable component during the firing. Examples of this include a process wherein plate is placed above the superconductor forming material film wiring pattern on the substrate so as to face each other, the plate comprising a material having no chemical influence on the superconducting wiring, and a pattern of a material containing an evaporable component is arbitrarily formed, a process wherein a pattern having a smaller line width is sandwiched between patterns having a larger line width, and a process wherein the firing atmosphere or the concentration of the evaporable component in the pattern is varied depending upon the line width.
摘要翻译： PCT No.PCT / JP91 / 01422 Sec。 371日期：1992年6月16日 102（e）日期1992年6月16日PCT 1991年10月17日PCT公布。第WO92 / 07381号公报日期：1992年04月30日。在氧化物超导膜布线中，当线宽减小时，焙烧期间的成分的蒸发变得如此剧烈，不可能形成期望的单晶相，这导致了氧化物超导布线的性能。这个问题可以通过防止在焙烧期间的蒸发组分的蒸发来解决。其实例包括其中板被放置在基板上的超导体形成材料膜布线图案之上以彼此面对的方法，该板包括对超导布线不具有化学影响的材料，以及含有可以任意地形成蒸发部件，其中具有较小线宽的图形被夹在具有较大线宽的图案之间的处理，以及其中烧制气氛或图案中的可蒸发部件的浓度根据线宽变化的处理。

2. 发明授权

US5629269A Process for forming oxide superconducting films with a plurality of metal buffer layers 失效
标题翻译：用多个金属缓冲层形成氧化物超导膜的方法
公开(公告)号：US5629269A
公开(公告)日：1997-05-13
申请号：US332479
申请日：1994-10-31
申请人： Kazunori Yamanaka , Takuya Uzumaki , Nobuo Kamehara , Koichi Niwa
发明人： Kazunori Yamanaka , Takuya Uzumaki , Nobuo Kamehara , Koichi Niwa
IPC分类号： H01L39/24 , B05D5/12 , B05D1/32
CPC分类号： H01L39/2461 , Y10S505/741
摘要： Disclosed is a process for forming a super-conducting film, which a multi-layer metal film (buffer film) is formed at a specific temperature on a ceramic substrate and a superconducting film is formed at a specific temperature on the multi-layer metal film. According to this process, a superconducting film having a high critical temperature can be formed over the ceramic substrate while controlling or suppressing the occurrence of a chemical reaction between the substrate and the superconducting film, and required superconducting performances can be manifested or exhibited.
摘要翻译：公开了一种用于形成超导膜的方法，其中在特定温度下在陶瓷基板上形成多层金属膜（缓冲膜），并且在特定温度下在多层金属膜上形成超导膜。根据该方法，可以在陶瓷基板上形成具有高临界温度的超导膜，同时控制或抑制基板与超导膜之间的化学反应的发生，并且可以显示或显示所需的超导性能。

3. 发明授权

US5081070A Superconducting circuit board and paste adopted therefor 失效
标题翻译：采用超导电路板和糊状物
公开(公告)号：US5081070A
公开(公告)日：1992-01-14
申请号：US268195
申请日：1989-01-30
申请人： Hiromitsu Yokoyama , Yoshihiko Imanaka , Kazunori Yamanaka , Nobuo Kamehara , Koichi Niwa , Takuya Uzumaki , Hitoshi Suzuki , Takato Machi
发明人： Hiromitsu Yokoyama , Yoshihiko Imanaka , Kazunori Yamanaka , Nobuo Kamehara , Koichi Niwa , Takuya Uzumaki , Hitoshi Suzuki , Takato Machi
IPC分类号： H01L39/02 , B32B18/00 , C01G1/00 , C01G3/00 , C04B35/00 , C04B35/45 , H01B12/00 , H01B13/00 , H01L21/48 , H01L21/768 , H01L23/498 , H01L39/06 , H01L39/24 , H05K1/09
CPC分类号： H01L21/4846 , B32B18/00 , C04B35/4504 , C04B35/4512 , C04B35/4521 , C04B37/005 , C04B37/006 , H01L21/76891 , H01L23/49888 , H01L39/2429 , C04B2235/483 , C04B2235/6567 , C04B2237/06 , C04B2237/066 , C04B2237/09 , C04B2237/125 , C04B2237/343 , C04B2237/59 , C04B2237/68 , C04B2237/704 , C04B2237/708 , H01L2924/0002 , H01L2924/09701 , Y10S428/901 , Y10S428/93 , Y10S505/701 , Y10S505/702 , Y10S505/703 , Y10S505/704 , Y10T428/24917 , Y10T428/24926
摘要： A superconducting circuit board is provided comprising a sintered alumina board containing more than 99% by weight of alumina and an interconnection pattern of an superconducting ceramics formed on the alumina board. Adhesion of the interconnection pattern to the alumina board is improved by an addition of Ti or Si coupling agent to a paste for forming the interconnection pattern. The use of copper powder in place of copper oxide powder as an ingredient forming a superconducting ceramics in the paste is advantageous for printing and obtaining a uniform superconducting ceramic pattern.
摘要翻译：提供了一种超导电路板，其包括含有超过99重量％的氧化铝的烧结氧化铝板和形成在氧化铝板上的超导陶瓷的互连图案。通过在用于形成互连图案的糊料中添加Ti或Si偶联剂来改善互连图案与氧化铝板的粘合性。使用铜粉代替氧化铜粉末作为糊料中形成超导陶瓷的成分有利于印刷和获得均匀的超导陶瓷图案。

4. 发明授权

US5049541A Process for preparing superconductor 失效
标题翻译：制备超导体的工艺
公开(公告)号：US5049541A
公开(公告)日：1991-09-17
申请号：US382180
申请日：1989-07-19
申请人： Takuya Uzumaki , Kazunori Yamanaka , Nobuo Kamehara , Koichi Niwa
发明人： Takuya Uzumaki , Kazunori Yamanaka , Nobuo Kamehara , Koichi Niwa
IPC分类号： C04B35/45 , H01L39/24
CPC分类号： C04B35/4517 , C04B35/4525 , H01L39/2477 , Y10S505/782
摘要： Superconductors of the Bi-Pb-Sr-Ca-Cu-O system and Tl-Pb-Ba-Ca-Cu-O system having a high Tc phase (about 110K and about 125K, respectively, or more) at a high proportion are obtained by adding a calcium compound which forms CaO and a liquid phase at a temperature for firing the superconductors, e.g., Ca.sub.2 PbO.sub.x (x=3 or 4); or by starting form a composition represented by the formula: Bi.sub.2 Pb.sub.(n-1)/2 Sr.sub.2 Ca.sub.n Cu.sub.n+1 O.sub.b, or Tl.sub.2 Pb.sub.(n-1)/2 Ba.sub.2 Ca.sub.n Cu.sub.n+1 Ob where 2.ltoreq.n.ltoreq.10, 5.ltoreq.b.ltoreq.40.5, i.e., at a ratio of Ca:Pb=2:1.

5. 发明授权

US5286713A Method for manufacturing an oxide superconducting circuit board by printing 失效
标题翻译：通过印刷制造氧化物超导电路板的方法
公开(公告)号：US5286713A
公开(公告)日：1994-02-15
申请号：US64668
申请日：1993-05-21
申请人： Hiromitsu Yokoyama , Yoshihiko Imanaka , Kazunori Yamanaka , Nobuo Kamehara , Koichi Niwa , Takuya Uzumaki , Hitoshi Suzuki , Takato Machi
发明人： Hiromitsu Yokoyama , Yoshihiko Imanaka , Kazunori Yamanaka , Nobuo Kamehara , Koichi Niwa , Takuya Uzumaki , Hitoshi Suzuki , Takato Machi
IPC分类号： B32B18/00 , C04B35/45 , H01L21/48 , H01L21/768 , H01L23/498 , H01L39/24 , B05D3/02 , B05D5/12
CPC分类号： H01L21/4846 , B32B18/00 , C04B35/4504 , C04B35/4512 , C04B35/4521 , C04B37/005 , H01L21/76891 , H01L23/49888 , H01L39/2429 , C04B2235/6567 , C04B2235/6585 , C04B2237/066 , C04B2237/125 , C04B2237/34 , C04B2237/343 , C04B2237/592 , C04B2237/62 , C04B2237/68 , C04B2237/704 , C04B2237/708 , H01L2924/0002 , H01L2924/09701 , Y10S428/901 , Y10S428/93 , Y10S505/701 , Y10S505/703 , Y10S505/741
摘要： A superconducting circuit board is provided comprising a sintered alumina board containing more than 99% by weight of alumina and an interconnection pattern of an superconducting ceramics formed on the alumina board. Adhesion of the interconnection pattern to the alumina board is improved by an addition of Ti or Si coupling agent to a paste for forming the interconnection pattern. The use of copper powder in place of copper oxide powder as an ingredient forming a superconducting ceramics in the paste is advantageous for printing and obtaining a uniform superconducting ceramic pattern.
摘要翻译：提供了一种超导电路板，其包括含有超过99重量％的氧化铝的烧结氧化铝板和形成在氧化铝板上的超导陶瓷的互连图案。通过在用于形成互连图案的糊料中添加Ti或Si偶联剂来改善互连图案与氧化铝板的粘合性。使用铜粉代替氧化铜粉末作为糊料中形成超导陶瓷的成分有利于印刷和获得均匀的超导陶瓷图案。

6. 发明授权

US4954480A Multi-layer superconducting circuit substrate and process for manufacturing same 失效
标题翻译：多层超导电路基板及其制造方法
公开(公告)号：US4954480A
公开(公告)日：1990-09-04
申请号：US197583
申请日：1988-04-27
申请人： Yoshihiko Imanaka , Takato Machi , Kazunori Yamanaka , Hiromitsu Yokoyama , Nobuo Kamehara , Koichi Niwa
发明人： Yoshihiko Imanaka , Takato Machi , Kazunori Yamanaka , Hiromitsu Yokoyama , Nobuo Kamehara , Koichi Niwa
IPC分类号： H05K3/46 , B32B18/00 , C04B35/45 , C04B35/634 , C04B35/636 , H01L21/48 , H01L21/768 , H01L23/498 , H01L23/538 , H01L39/24
CPC分类号： C04B35/63416 , B32B18/00 , C04B35/45 , C04B35/4504 , C04B35/4512 , C04B35/4521 , C04B35/634 , C04B35/63424 , C04B35/6365 , C04B35/645 , H01L21/4857 , H01L21/76891 , H01L23/49888 , H01L23/5383 , H01L39/2429 , H01L39/2464 , C04B2235/6567 , C04B2235/663 , C04B2237/343 , C04B2237/62 , C04B2237/68 , C04B2237/704 , H01L2924/0002 , H01L2924/09701 , Y10S428/901 , Y10S428/93 , Y10S505/701 , Y10S505/702 , Y10S505/703 , Y10S505/704 , Y10T428/23 , Y10T428/239 , Y10T428/24917 , Y10T428/24926
摘要： A multi-layer superconducting circuit substrate, including insulating layers, and interconnection patterns of a superconductive ceramic material located between the insulating layers, the patterns of the superconductive ceramic material being connected via through-holes of the superconductive ceramic material, is provided. The patterns of the superconductive ceramic material are preferably encapsulated with a metal of gold, silver, platinum or an alloy thereof.

7. 发明授权

US5306702A Process for producing Bi-Pb-Sr-Ca-Cu-O superconducting films 失效
标题翻译：生产Bi-Pb-Sr-Ca-Cu-O超导薄膜的方法
公开(公告)号：US5306702A
公开(公告)日：1994-04-26
申请号：US860505
申请日：1992-06-17
申请人： Atsushi Tanaka , Nobuo Kamehara , Koichi Niwa
发明人： Atsushi Tanaka , Nobuo Kamehara , Koichi Niwa
IPC分类号： C04B35/00 , C01G1/00 , C01G29/00 , C04B35/45 , C23C14/08 , C23C14/35 , C23C14/58 , H01L39/24 , B05D5/12 , C23C14/00
CPC分类号： C23C14/5806 , C23C14/087 , C23C14/58 , C23C14/5853 , H01L39/2451 , Y10S505/728 , Y10S505/73 , Y10S505/731 , Y10S505/742
摘要： A process for producing a Bi-based perovskite superconducting film, comprising the steps of forming on a substrate a Pb-film, containing Bi-base material film comprising Bi, Pb, Sr, Ca and Cu in a Bi:Pb:Sr:Ca:Cu molar ratio of (1.9 to 2.1):(1.2 to 2.2, preferably 1.5 to 1.8):2:(1.9 to 2.2):(3 to 3.5) and sintering the Pb-containing Bi-base material film in an oxygen-containing atmosphere. The sintering step includes a main sintering period of 20 to 120 minutes, in which the temperature is raised from a first temperature to a second temperature, with the second temperature being in a range of 850.degree. to 860.degree. C., and the temperature rise in the main sintering period of 20 to 120 minutes being from 3.degree. to 10.degree. C.
摘要翻译： PCT No.PCT / JP91 / 01423 Sec。 371日期：1992年6月17日 102（e）日期1992年6月17日PCT 1991年10月17日PCT公布。出版物WO92 / 06923 日本1992年04月30日。一种Bi系钙钛矿超导膜的制造方法，其特征在于，在基板上形成含有Bi，Pb，Sr，Ca，Cu的Bi基材料膜的Pb膜， Bi：Pb：Sr：Ca：Cu的摩尔比为（1.9〜2.1）：1.2〜2.2，优选为1.5〜1.8）：2：（1.9〜2.2）:( 3〜3.5）在含氧气氛中的基材膜。烧结步骤包括20〜120分钟的主烧结期间，其中温度从第一温度升至第二温度，第二温度在850℃至860℃的范围内，温度升高在20〜120分钟的主烧结时间为3〜10℃。

8. 发明授权

US5141917A Multilayer deposition method for forming Pb-doped Bi-Sr-Ca-Cu-O Superconducting films 失效
标题翻译：用于形成Pb掺杂的Bi-Sr-Ca-Cu-O超导膜的多层沉积方法
公开(公告)号：US5141917A
公开(公告)日：1992-08-25
申请号：US565209
申请日：1990-08-09
申请人： Atsushi Tanaka , Nobuo Kamehara , Koichi Niwa
发明人： Atsushi Tanaka , Nobuo Kamehara , Koichi Niwa
IPC分类号： B32B18/00 , C04B35/45 , H01L39/24
CPC分类号： C04B35/45 , H01L39/2422 , Y10S505/731 , Y10S505/732 , Y10S505/742
摘要： A perovskite type superconductor film having a high content, almost a single phase, of the high Tc phase is formed by the steps of: depositing at least one first film of a first material (e.g., a composite oxide of Bi-Sr-Ca-Cu-O system or Tl-Ba-Ca-Cu-O system) constituting a perovskite type superconductor over a substrate; depositing at least one second film of a second material containing an oxide or element (Bi.sub.2 O.sub.3, Tl.sub.2 O.sub.3, PbO.sub.x, etc., particularly PbO.sub.x) having a vapor pressure of more than 10 .sup.-4 Pa at 800.degree. C. at least as a main component over the substrate; to thereby form a stack of the first and second films; and heat treating the stack of the first and second films to form the perovskite type superconductor film on the substrate. Further, preferred compositions of the as-deposited films or stack are determined.
摘要翻译：通过以下步骤形成具有高含量，几乎单相的高Tc相的钙钛矿型超导体膜：沉积至少一种第一材料的第一膜（例如，Bi-Sr-Ca- Cu-O系或Tl-Ba-Ca-Cu-O系），在基板上构成钙钛矿型超导体; 沉积至少一个第二材料的第二材料，该第二材料包含氧化物或元素（Bi 2 O 3，Tl 2 O 3，PbO x等，特别是PbO x），其在800℃下蒸气压大于10 -4 Pa至少作为主要成分基材; 从而形成第一和第二膜的堆叠; 并对第一和第二膜的堆叠进行热处理，以在基板上形成钙钛矿型超导膜。此外，确定沉积膜或叠层的优选组成。

9. 发明授权

US5585332A Process for preparing a perovskite Bi-containing superconductor film 失效
标题翻译：制备钙钛矿Bi超导膜的方法
公开(公告)号：US5585332A
公开(公告)日：1996-12-17
申请号：US378087
申请日：1995-01-25
申请人： Atsushi Tanaka , Nobuo Kamehara , Koichi Niwa
发明人： Atsushi Tanaka , Nobuo Kamehara , Koichi Niwa
IPC分类号： B32B18/00 , C04B35/45 , H01L39/24 , B05D5/12
CPC分类号： C04B35/45 , H01L39/2422 , Y10S505/731 , Y10S505/732 , Y10S505/742
摘要： A perovskite type superconductor film having a high content, almost a single phase, of the high Tc phase is formed by the steps of: depositing at least one first film of a first material (e.g., a composite oxide of Bi-Sr-Ca-Cu-O system or Tl-Ba-Ca-Cu-O system) constituting a perovskite type superconductor over a substrate; depositing at least one second film of a second material containing an oxide or element (Bi.sub.2 O.sub.3, Tl.sub.2 O.sub.3, PbO.sub.x, etc., particularly PbO.sub.x) having a vapor pressure of more than 10.sup.-4 Pa at 800.degree. C. at least as a main component over the substrate; to thereby form a stack of the first and second films; and heat treating the stack of the first and second films to form the perovskite type superconductor film on the substrate. Further, preferred compositions of the as-deposited films or stack are determined.
摘要翻译：通过以下步骤形成具有高含量，几乎单相的高Tc相的钙钛矿型超导体膜：沉积至少一种第一材料的第一膜（例如，Bi-Sr-Ca- Cu-O系或Tl-Ba-Ca-Cu-O系），在基板上构成钙钛矿型超导体; 在800℃下至少沉积至少具有蒸气压大于10-4Pa的氧化物或元素（Bi 2 O 3，Tl 2 O 3，PbO x等，特别是PbO x）的第二材料的至少一个第二膜至少作为主要成分基材; 从而形成第一和第二膜的堆叠; 并对第一和第二膜的堆叠进行热处理，以在基板上形成钙钛矿型超导膜。此外，确定沉积膜或叠层的优选组成。

10. 发明授权

US4761325A Multilayer ceramic circuit board 失效
标题翻译：多层陶瓷电路板
公开(公告)号：US4761325A
公开(公告)日：1988-08-02
申请号：US762310
申请日：1985-08-02
申请人： Kazuaki Kurihara , Nobuo Kamehara , Hiromitsu Yokoyama , Hiromi Ogawa , Kishio Yokouchi , Yoshihiko Imanaka , Koichi Niwa
发明人： Kazuaki Kurihara , Nobuo Kamehara , Hiromitsu Yokoyama , Hiromi Ogawa , Kishio Yokouchi , Yoshihiko Imanaka , Koichi Niwa
IPC分类号： C03C10/00 , C04B35/14 , C04B35/16 , C04B35/18 , C04B35/632 , H01L21/48 , H01L23/15 , H05K1/03 , H05K1/09 , H05K3/46 , B32B3/00
CPC分类号： H05K3/4667 , C03C10/0009 , H01L21/4857 , H01L21/4867 , H01L23/15 , H05K1/0306 , H05K3/46 , H05K3/4629 , C03C2214/04 , C03C2214/20 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K1/092 , H05K2203/086 , H05K2203/088 , H05K2203/1126 , H05K3/1291 , H05K3/4611 , Y10S428/901 , Y10T428/24322 , Y10T428/24917 , Y10T428/24926 , Y10T428/252
摘要： A method for producing a multilayer ceramic circuit board including the steps of forming a multilayer structure consisting of patterns of copper-based paste and glass-ceramic layers, the glass-ceramic layers consisting of a mixture of 10 percent to 75 percent by weight of .alpha.-alumina, 20 percent to 60 percent by weight of crystallizable or noncrystallizable glass which can be sintered at a temperature lower than the melting point of copper, and 5 percent to 70 percent by weight of quartz glass, based on the total weight of the glass-ceramic, blended with a binder containing a thermally depolymerizable resin; prefiring the multilayer structure in an inert atmosphere containing water vapor, the partial pressure of which is 0.005 to 0.3 atmosphere, at a temperature where the thermally depolymerizable resin is eliminated; and firing the multilayer structure in an inert atmosphere containing no water vapor at a temperature below the melting point of copper so as to sinter the glass-ceramic.

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