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1. 发明授权

US06992861B2 Head suspension for swing arm actuator 失效
标题翻译：摇臂执行器的悬挂头
公开(公告)号：US06992861B2
公开(公告)日：2006-01-31
申请号：US10264146
申请日：2002-10-03
申请人： Atsushi Suzuki , Ryosuke Koishi , Daisuke Mizutani , Ren Ishikawa , Masashi Takada , Yasuhiro Yoneda
发明人： Atsushi Suzuki , Ryosuke Koishi , Daisuke Mizutani , Ren Ishikawa , Masashi Takada , Yasuhiro Yoneda
IPC分类号： G11B5/48
CPC分类号： G11B5/4833
摘要： The present invention is aimed to provide a head suspension having a high resonant frequency, high shock resistance and low rigidity, which greatly contributes to an improvement of a magnetic disk apparatus. In an oscillation-type actuator, at least a part of a spring arm of the head suspension having a data reading/writing head slider 1 is made of an anisotropic layer whose rigidity varies in accordance with a direction. In this case, the anisotropic layer is laminated so that the high rigidity modulus orientation direction is different according to layer.
摘要翻译：本发明的目的在于提供一种具有高谐振频率，高抗冲击性和低刚性的磁头悬架，其极大地有助于磁盘装置的改进。在振荡型致动器中，具有数据读/写头滑块1的头悬架的弹簧臂的至少一部分由刚性根据方向变化的各向异性层制成。在这种情况下，层叠各向异性层，使得高刚性模量取向方向根据层不同。

2. 发明授权

US6001488A Composition of epoxy group-containing cycloolefin resin 失效
标题翻译：含环氧基的环烯烃树脂的组成
公开(公告)号：US6001488A
公开(公告)日：1999-12-14
申请号：US106179
申请日：1998-06-29
申请人： Hideaki Kataoka , Eiko Yuda , Shigemitsu Kamiya , Masahide Yamamoto , Yoshikatsu Ishizuki , Yasuhiro Yoneda , Daisuke Mizutani , Kishio Yokouchi
发明人： Hideaki Kataoka , Eiko Yuda , Shigemitsu Kamiya , Masahide Yamamoto , Yoshikatsu Ishizuki , Yasuhiro Yoneda , Daisuke Mizutani , Kishio Yokouchi
IPC分类号： C08F283/14 , C08G59/32 , C08G59/34 , C08G61/08 , C08L51/08 , G03F7/004 , G03F7/012 , G03F7/038 , H01B3/40 , H01B3/44 , B32B27/04 , B32B27/28 , C08F255/08 , C08L51/06
CPC分类号： C08G59/027 , C08F283/14 , C08G59/3218 , C08G61/08 , C08L51/08 , G03F7/0045 , G03F7/0125 , G03F7/038 , H01B3/40 , H01B3/441 , Y10S428/901 , Y10T428/31663
摘要： A resin composition comprising an epoxy group-containing cycloolefin resin and a crosslinking agent is provided. More specifically, a resin composition comprising an epoxy group-containing thermoplastic norbornene resin obtained by introducing epoxy groups into a thermoplastic norbornene resin, and as the crosslinking agent, a curing agent for epoxy resins or a photoreactive substance is provided. The resin composition is suitable for use as an insulating material.
摘要翻译：提供了包含含环氧基的环烯烃树脂和交联剂的树脂组合物。更具体地说，提供一种包含通过将环氧基引入到热塑性降冰片烯树脂中而获得的含环氧基的热塑性降冰片烯树脂和作为交联剂的环氧树脂或光反应性物质的固化剂的树脂组合物。树脂组合物适合用作绝缘材料。

3. 发明申请

US20050098882A1 Multilayer wiring circuit board 有权
标题翻译：多层布线电路板
公开(公告)号：US20050098882A1
公开(公告)日：2005-05-12
申请号：US11017785
申请日：2004-12-22
申请人： Toshihiro Kusagaya , Yasuhiro Yoneda , Daisuke Mizutani , Kazuhiko Iijima , Yuji Suwa
发明人： Toshihiro Kusagaya , Yasuhiro Yoneda , Daisuke Mizutani , Kazuhiko Iijima , Yuji Suwa
IPC分类号： H05K1/02 , H05K1/11 , H05K3/00 , H05K3/46 , H01L21/44 , H01L23/48 , H01L29/76 , H01L31/062
CPC分类号： H05K3/4641 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/01087 , H05K1/0216 , H05K1/113 , H05K3/0035 , H05K3/4602 , H05K3/4623 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4688 , H05K2201/0129 , H05K2201/0154 , H05K2201/09309 , H05K2201/09518 , H05K2201/09536 , H05K2201/096 , H05K2203/1394
摘要： An inexpensive multilayer wiring circuit board capable of conducting high frequency switching operation on the circuit while the generation of high frequency noise is being suppressed by reducing the inductance of the circuit in provided. A multilayer wiring circuit board comprising: an uppermost layer designated as a first layer on which parts are mounted; a second layer on which one of a ground layer and an electric power source layer is arranged; a third layer on which the other is arranged; and an insulating layer arranged between the ground layer and the electric power source layer. A resin layer having a thermoplastic adhesion property on both faces is used as material of the insulating layer arranged between the electric power source layer and the ground layer.
摘要翻译：能够通过降低所提供的电路的电感来抑制在产生高频噪声的同时对电路进行高频开关动作的便宜的多层布线电路板。一种多层布线电路板，包括：被指定为第一层的最上层，其上安装有部件; 布置有接地层和电源层中的一个的第二层; 另一个排列在其上的第三层; 以及布置在接地层和电源层之间的绝缘层。作为在电源层和接地层之间配置的绝缘层的材料，使用两面具有热塑性粘合性的树脂层。

4. 发明授权

US5886136A Pattern forming process 失效
标题翻译：图案形成过程
公开(公告)号：US5886136A
公开(公告)日：1999-03-23
申请号：US819111
申请日：1997-03-17
申请人： Akira Tanaka , Masami Koshiyama , Kei Sakamoto , Yasuhiro Yoneda , Kishio Yokouchi , Daisuke Mizutani , Yoshikatsu Ishizuki
发明人： Akira Tanaka , Masami Koshiyama , Kei Sakamoto , Yasuhiro Yoneda , Kishio Yokouchi , Daisuke Mizutani , Yoshikatsu Ishizuki
IPC分类号： C08G73/10 , G03F7/037 , H05K1/00 , H05K3/28 , C08G73/00
CPC分类号： C08G73/101 , C08G73/1025 , G03F7/037 , H05K3/287 , H05K3/4676
摘要： Disclosed herein is a pattern forming process comprising the steps of coating a substrate with a photosensitive resin composition comprising a polyamic compound having, at each terminal thereof, an actinic ray-sensitive functional group which has substituent groups each having a photopolymerizable carbon-carbon double bond, a photosensitive auxiliary having a photopolymerizable functional group, a photopolymerization initiator, and a solvent to form a film; subjecting the film to pattering exposure; and then developing the thus-exposed film with an alkaline developer or alkaline aqueous solution.
摘要翻译：本文公开了一种图案形成方法，其包括以下步骤：用包含聚酰胺化合物的感光性树脂组合物涂布基材，所述聚酰胺化合物的每个末端具有具有可光聚合碳 - 碳双键的取代基的光化射线敏感性官能团具有可光聚合官能团的光敏助剂，光聚合引发剂和溶剂形成膜; 使电影曝光; 然后用碱性显影剂或碱性水溶液显影这样暴露的薄膜。

5. 发明授权

US5895800A Composition of epoxy group-containing cycloolefin resin 失效
公开(公告)号：US5895800A
公开(公告)日：1999-04-20
申请号：US106180
申请日：1998-06-29
申请人： Hideaki Kataoka , Eiko Yuda , Shigemitsu Kamiya , Masahide Yamamoto , Yoshikatsu Ishizuki , Yasuhiro Yoneda , Daisuke Mizutani , Kishio Yokouchi
发明人： Hideaki Kataoka , Eiko Yuda , Shigemitsu Kamiya , Masahide Yamamoto , Yoshikatsu Ishizuki , Yasuhiro Yoneda , Daisuke Mizutani , Kishio Yokouchi
IPC分类号： C08F255/08 , C08F283/14 , C08G59/32 , C08G59/34 , C08G61/08 , C08L51/00 , C08L51/06 , C08L51/08 , G03F7/004 , G03F7/012 , G03F7/038 , H01B3/40 , H01B3/44 , H05K1/00 , H05K3/28
CPC分类号： C08G59/027 , C08F255/08 , C08F283/14 , C08G59/3218 , C08G61/08 , C08L51/00 , C08L51/06 , C08L51/08 , G03F7/0045 , G03F7/0125 , G03F7/038 , H01B3/40 , H01B3/441 , H05K3/285 , H05K3/4676
摘要： A resin composition comprising an epoxy group-containing cycloolefin resin and a crosslinking agent is provided. More specifically, a resin composition comprising an epoxy group-containing thermoplastic norbornene resin obtained by introducing epoxy groups into a thermoplastic norbornene resin, and as the crosslinking agent, a curing agent for epoxy resins or a photoreactive substance is provided. The resin composition is suitable for use as an insulating material.

6. 发明授权

US07671281B2 Multilayer wiring circuit board 有权
标题翻译：多层布线电路板
公开(公告)号：US07671281B2
公开(公告)日：2010-03-02
申请号：US10254565
申请日：2002-09-26
申请人： Toshihiro Kusagaya , Yasuhiro Yoneda , Daisuke Mizutani , Kazuhiko Iijima , Yuji Suwa
发明人： Toshihiro Kusagaya , Yasuhiro Yoneda , Daisuke Mizutani , Kazuhiko Iijima , Yuji Suwa
IPC分类号： H05K1/16
CPC分类号： H05K3/4641 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/01087 , H05K1/0216 , H05K1/113 , H05K3/0035 , H05K3/4602 , H05K3/4623 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4688 , H05K2201/0129 , H05K2201/0154 , H05K2201/09309 , H05K2201/09518 , H05K2201/09536 , H05K2201/096 , H05K2203/1394
摘要： An inexpensive multilayer wiring circuit board capable of conducting high frequency switching operation on the circuit while the generation of high frequency noise is being suppressed by reducing the inductance of the circuit in provided. A multilayer wiring circuit board with an uppermost layer designated as a first layer on which parts are mounted; a second layer on which one of a ground layer and an electric power source layer is arranged; a third layer on which the other is arranged; and an insulating layer arranged between the ground layer and the electric power source layer. A resin layer having a thermoplastic adhesion property on both faces is used as material of the insulating layer arranged between the electric power source layer and the ground layer.
摘要翻译：能够通过降低所提供的电路的电感来抑制在产生高频噪声的同时对电路进行高频开关动作的便宜的多层布线电路板。一种多层布线电路板，其最上层被指定为安装有部件的第一层; 布置有接地层和电源层中的一个的第二层; 另一个排列在其上的第三层; 以及布置在接地层和电源层之间的绝缘层。作为在电源层和接地层之间配置的绝缘层的材料，使用两面具有热塑性粘合性的树脂层。

7. 发明授权

US5777068A Photosensitive polyimide resin composition 失效
标题翻译：感光聚酰亚胺树脂组合物
公开(公告)号：US5777068A
公开(公告)日：1998-07-07
申请号：US527057
申请日：1995-09-12
申请人： Akira Tanaka , Satoshi Tazaki , Kei Sakamoto , Yasuhiro Yoneda , Kishio Yokouchi , Daisuke Mizutani , Yoshikatsu Ishizuki
发明人： Akira Tanaka , Satoshi Tazaki , Kei Sakamoto , Yasuhiro Yoneda , Kishio Yokouchi , Daisuke Mizutani , Yoshikatsu Ishizuki
IPC分类号： G03F7/037 , C08G73/10 , C08G69/26
CPC分类号： G03F7/037
摘要： Provided are photosensitive resin compositions comprising a polyamic compound having, at each terminal thereof, a specific actinic ray-sensitive functional group which has substituent groups each having a photopolymerizable carbon-carbon double bond, a photosensitive auxiliary having a photopolymerizable functional group and a solvent. The photosensitive resin compositions of the invention are excellent in resist properties such as sensitivity and good in storage stability and can provide a film small in residual stress.
摘要翻译：提供了含有聚酰胺化合物的光敏树脂组合物，其每个末端具有具有可光聚合碳 - 碳双键的取代基的特定光化射线敏感性官能团，具有光聚合官能团的光敏助剂和溶剂。本发明的感光性树脂组合物的抗敏性优异，例如灵敏度好，保存稳定性好，能够提供残留应力小的膜。

8. 发明授权

US07253023B2 Multilayer wiring circuit board 有权
标题翻译：多层布线电路板
公开(公告)号：US07253023B2
公开(公告)日：2007-08-07
申请号：US11017785
申请日：2004-12-22
申请人： Toshihiro Kusagaya , Yasuhiro Yoneda , Daisuke Mizutani , Kazuhiko Iijima , Yuji Suwa
发明人： Toshihiro Kusagaya , Yasuhiro Yoneda , Daisuke Mizutani , Kazuhiko Iijima , Yuji Suwa
IPC分类号： H01L21/44
CPC分类号： H05K3/4641 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/01087 , H05K1/0216 , H05K1/113 , H05K3/0035 , H05K3/4602 , H05K3/4623 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4688 , H05K2201/0129 , H05K2201/0154 , H05K2201/09309 , H05K2201/09518 , H05K2201/09536 , H05K2201/096 , H05K2203/1394
摘要： An inexpensive multilayer wiring circuit board capable of conducting high frequency switching operation on the circuit while the generation of high frequency noise is being suppressed by reducing the inductance of the circuit in provided. A multilayer wiring circuit board comprising: an uppermost layer designated as a first layer on which parts are mounted; a second layer on which one of a ground layer and an electric power source layer is arranged; a third layer on which the other is arranged; and an insulating layer arranged between the ground layer and the electric power source layer. A resin layer having a thermoplastic adhesion property on both faces is used as material of the insulating layer arranged between the electric power source layer and the ground layer.
摘要翻译：能够通过降低所提供的电路的电感来抑制在产生高频噪声的同时对电路进行高频开关动作的便宜的多层布线电路板。一种多层布线电路板，包括：被指定为第一层的最上层，其上安装有部件; 布置有接地层和电源层中的一个的第二层; 另一个排列在其上的第三层; 以及布置在接地层和电源层之间的绝缘层。作为在电源层和接地层之间配置的绝缘层的材料，使用两面具有热塑性粘合性的树脂层。

9. 发明授权

US5783639A Composition of epoxy group-containing cycloolefin resin 失效
公开(公告)号：US5783639A
公开(公告)日：1998-07-21
申请号：US781385
申请日：1997-01-13
申请人： Hideaki Kataoka , Eiko Yuda , Shigemitsu Kamiya , Masahide Yamamoto , Yoshikatsu Ishizuki , Yasuhiro Yoneda , Daisuke Mizutani , Kishio Yokouchi
发明人： Hideaki Kataoka , Eiko Yuda , Shigemitsu Kamiya , Masahide Yamamoto , Yoshikatsu Ishizuki , Yasuhiro Yoneda , Daisuke Mizutani , Kishio Yokouchi
IPC分类号： C08F255/08 , C08F283/14 , C08G59/32 , C08G59/34 , C08G61/08 , C08L51/00 , C08L51/06 , C08L51/08 , G03F7/004 , G03F7/012 , G03F7/038 , H01B3/40 , H01B3/44 , H05K1/00 , H05K3/28
CPC分类号： C08G59/027 , C08F255/08 , C08F283/14 , C08G59/3218 , C08G61/08 , C08L51/00 , C08L51/06 , C08L51/08 , G03F7/0045 , G03F7/0125 , G03F7/038 , H01B3/40 , H01B3/441 , H05K3/285 , H05K3/4676
摘要： A resin composition comprising an epoxy group-containing cycloolefin resin and a crosslinking agent is provided. More specifically, a resin composition comprising an epoxy group-containing thermoplastic norbornene resin obtained by introducing epoxy groups into a thermoplastic norbornene resin, and as the crosslinking agent, a curing agent for epoxy resins or a photoreactive substance is provided. The resin composition is suitable for use as an insulating material.

10. 发明授权

US07851707B2 Circuit board and method for manufacturing the same 有权
标题翻译：电路板及其制造方法
公开(公告)号：US07851707B2
公开(公告)日：2010-12-14
申请号：US11591559
申请日：2006-11-02
申请人： Daisuke Mizutani , Tatsuhiko Tajima
发明人： Daisuke Mizutani , Tatsuhiko Tajima
IPC分类号： H05K1/03
CPC分类号： H05K1/024 , H05K1/0298 , H05K2201/0187 , H05K2201/0195 , H05K2201/0209 , Y10T29/49126
摘要： A circuit board for reducing a transmission loss and a method for manufacturing the circuit board. In the circuit board including a ground layer and power layer facing each other, a wiring layer disposed between the ground layer and the power layer, and an insulating section formed between the ground layer and the power layer so as to sandwich the wiring layer therebetween, a low dielectric loss layer having a dielectric tangent lower than that of the insulating section is formed at least on an upper or lower surface of the wiring layer. According to such a circuit board, the low dielectric loss layer is formed on an interface between the insulating section and the wiring layer, and therefore, a transmission loss in a high frequency region is reduced.
摘要翻译：一种用于降低传输损耗的电路板和一种用于制造电路板的方法。在包括接地层和功率层相对的电路板中，布置在接地层和功率层之间的布线层以及形成在接地层和功率层之间以将布线层夹在其间的绝缘部分，至少在布线层的上表面或下表面上形成具有低于绝缘部分的介电切线的低介电损耗层。根据这种电路板，低介电损耗层形成在绝缘部分和布线层之间的界面上，因此降低了高频区域的传输损耗。

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