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1. 发明授权

US6001488A Composition of epoxy group-containing cycloolefin resin 失效
标题翻译：含环氧基的环烯烃树脂的组成
公开(公告)号：US6001488A
公开(公告)日：1999-12-14
申请号：US106179
申请日：1998-06-29
申请人： Hideaki Kataoka , Eiko Yuda , Shigemitsu Kamiya , Masahide Yamamoto , Yoshikatsu Ishizuki , Yasuhiro Yoneda , Daisuke Mizutani , Kishio Yokouchi
发明人： Hideaki Kataoka , Eiko Yuda , Shigemitsu Kamiya , Masahide Yamamoto , Yoshikatsu Ishizuki , Yasuhiro Yoneda , Daisuke Mizutani , Kishio Yokouchi
IPC分类号： C08F283/14 , C08G59/32 , C08G59/34 , C08G61/08 , C08L51/08 , G03F7/004 , G03F7/012 , G03F7/038 , H01B3/40 , H01B3/44 , B32B27/04 , B32B27/28 , C08F255/08 , C08L51/06
CPC分类号： C08G59/027 , C08F283/14 , C08G59/3218 , C08G61/08 , C08L51/08 , G03F7/0045 , G03F7/0125 , G03F7/038 , H01B3/40 , H01B3/441 , Y10S428/901 , Y10T428/31663
摘要： A resin composition comprising an epoxy group-containing cycloolefin resin and a crosslinking agent is provided. More specifically, a resin composition comprising an epoxy group-containing thermoplastic norbornene resin obtained by introducing epoxy groups into a thermoplastic norbornene resin, and as the crosslinking agent, a curing agent for epoxy resins or a photoreactive substance is provided. The resin composition is suitable for use as an insulating material.
摘要翻译：提供了包含含环氧基的环烯烃树脂和交联剂的树脂组合物。更具体地说，提供一种包含通过将环氧基引入到热塑性降冰片烯树脂中而获得的含环氧基的热塑性降冰片烯树脂和作为交联剂的环氧树脂或光反应性物质的固化剂的树脂组合物。树脂组合物适合用作绝缘材料。

2. 发明授权

US5895800A Composition of epoxy group-containing cycloolefin resin 失效
公开(公告)号：US5895800A
公开(公告)日：1999-04-20
申请号：US106180
申请日：1998-06-29
申请人： Hideaki Kataoka , Eiko Yuda , Shigemitsu Kamiya , Masahide Yamamoto , Yoshikatsu Ishizuki , Yasuhiro Yoneda , Daisuke Mizutani , Kishio Yokouchi
发明人： Hideaki Kataoka , Eiko Yuda , Shigemitsu Kamiya , Masahide Yamamoto , Yoshikatsu Ishizuki , Yasuhiro Yoneda , Daisuke Mizutani , Kishio Yokouchi
IPC分类号： C08F255/08 , C08F283/14 , C08G59/32 , C08G59/34 , C08G61/08 , C08L51/00 , C08L51/06 , C08L51/08 , G03F7/004 , G03F7/012 , G03F7/038 , H01B3/40 , H01B3/44 , H05K1/00 , H05K3/28
CPC分类号： C08G59/027 , C08F255/08 , C08F283/14 , C08G59/3218 , C08G61/08 , C08L51/00 , C08L51/06 , C08L51/08 , G03F7/0045 , G03F7/0125 , G03F7/038 , H01B3/40 , H01B3/441 , H05K3/285 , H05K3/4676
摘要： A resin composition comprising an epoxy group-containing cycloolefin resin and a crosslinking agent is provided. More specifically, a resin composition comprising an epoxy group-containing thermoplastic norbornene resin obtained by introducing epoxy groups into a thermoplastic norbornene resin, and as the crosslinking agent, a curing agent for epoxy resins or a photoreactive substance is provided. The resin composition is suitable for use as an insulating material.

3. 发明授权

US5783639A Composition of epoxy group-containing cycloolefin resin 失效
公开(公告)号：US5783639A
公开(公告)日：1998-07-21
申请号：US781385
申请日：1997-01-13
申请人： Hideaki Kataoka , Eiko Yuda , Shigemitsu Kamiya , Masahide Yamamoto , Yoshikatsu Ishizuki , Yasuhiro Yoneda , Daisuke Mizutani , Kishio Yokouchi
发明人： Hideaki Kataoka , Eiko Yuda , Shigemitsu Kamiya , Masahide Yamamoto , Yoshikatsu Ishizuki , Yasuhiro Yoneda , Daisuke Mizutani , Kishio Yokouchi
IPC分类号： C08F255/08 , C08F283/14 , C08G59/32 , C08G59/34 , C08G61/08 , C08L51/00 , C08L51/06 , C08L51/08 , G03F7/004 , G03F7/012 , G03F7/038 , H01B3/40 , H01B3/44 , H05K1/00 , H05K3/28
CPC分类号： C08G59/027 , C08F255/08 , C08F283/14 , C08G59/3218 , C08G61/08 , C08L51/00 , C08L51/06 , C08L51/08 , G03F7/0045 , G03F7/0125 , G03F7/038 , H01B3/40 , H01B3/441 , H05K3/285 , H05K3/4676
摘要： A resin composition comprising an epoxy group-containing cycloolefin resin and a crosslinking agent is provided. More specifically, a resin composition comprising an epoxy group-containing thermoplastic norbornene resin obtained by introducing epoxy groups into a thermoplastic norbornene resin, and as the crosslinking agent, a curing agent for epoxy resins or a photoreactive substance is provided. The resin composition is suitable for use as an insulating material.

4. 发明授权

US5886136A Pattern forming process 失效
标题翻译：图案形成过程
公开(公告)号：US5886136A
公开(公告)日：1999-03-23
申请号：US819111
申请日：1997-03-17
申请人： Akira Tanaka , Masami Koshiyama , Kei Sakamoto , Yasuhiro Yoneda , Kishio Yokouchi , Daisuke Mizutani , Yoshikatsu Ishizuki
发明人： Akira Tanaka , Masami Koshiyama , Kei Sakamoto , Yasuhiro Yoneda , Kishio Yokouchi , Daisuke Mizutani , Yoshikatsu Ishizuki
IPC分类号： C08G73/10 , G03F7/037 , H05K1/00 , H05K3/28 , C08G73/00
CPC分类号： C08G73/101 , C08G73/1025 , G03F7/037 , H05K3/287 , H05K3/4676
摘要： Disclosed herein is a pattern forming process comprising the steps of coating a substrate with a photosensitive resin composition comprising a polyamic compound having, at each terminal thereof, an actinic ray-sensitive functional group which has substituent groups each having a photopolymerizable carbon-carbon double bond, a photosensitive auxiliary having a photopolymerizable functional group, a photopolymerization initiator, and a solvent to form a film; subjecting the film to pattering exposure; and then developing the thus-exposed film with an alkaline developer or alkaline aqueous solution.
摘要翻译：本文公开了一种图案形成方法，其包括以下步骤：用包含聚酰胺化合物的感光性树脂组合物涂布基材，所述聚酰胺化合物的每个末端具有具有可光聚合碳 - 碳双键的取代基的光化射线敏感性官能团具有可光聚合官能团的光敏助剂，光聚合引发剂和溶剂形成膜; 使电影曝光; 然后用碱性显影剂或碱性水溶液显影这样暴露的薄膜。

5. 发明授权

US5777068A Photosensitive polyimide resin composition 失效
标题翻译：感光聚酰亚胺树脂组合物
公开(公告)号：US5777068A
公开(公告)日：1998-07-07
申请号：US527057
申请日：1995-09-12
申请人： Akira Tanaka , Satoshi Tazaki , Kei Sakamoto , Yasuhiro Yoneda , Kishio Yokouchi , Daisuke Mizutani , Yoshikatsu Ishizuki
发明人： Akira Tanaka , Satoshi Tazaki , Kei Sakamoto , Yasuhiro Yoneda , Kishio Yokouchi , Daisuke Mizutani , Yoshikatsu Ishizuki
IPC分类号： G03F7/037 , C08G73/10 , C08G69/26
CPC分类号： G03F7/037
摘要： Provided are photosensitive resin compositions comprising a polyamic compound having, at each terminal thereof, a specific actinic ray-sensitive functional group which has substituent groups each having a photopolymerizable carbon-carbon double bond, a photosensitive auxiliary having a photopolymerizable functional group and a solvent. The photosensitive resin compositions of the invention are excellent in resist properties such as sensitivity and good in storage stability and can provide a film small in residual stress.
摘要翻译：提供了含有聚酰胺化合物的光敏树脂组合物，其每个末端具有具有可光聚合碳 - 碳双键的取代基的特定光化射线敏感性官能团，具有光聚合官能团的光敏助剂和溶剂。本发明的感光性树脂组合物的抗敏性优异，例如灵敏度好，保存稳定性好，能够提供残留应力小的膜。

6. 发明授权

US5478972A Multilayer circuit board and a method for fabricating the same 失效
标题翻译：多层电路板及其制造方法
公开(公告)号：US5478972A
公开(公告)日：1995-12-26
申请号：US295461
申请日：1994-08-25
申请人： Daisuke Mizutani , Kishio Yokouchi
发明人： Daisuke Mizutani , Kishio Yokouchi
IPC分类号： H01L23/12 , H05K3/40 , H05K3/46 , H05K1/00
CPC分类号： H05K3/4632 , H05K3/4038 , H05K3/4617 , H05K2201/0129 , H05K2201/068 , H05K2201/10287 , H05K2203/0235
摘要： An interlayer connection wiring penetrating each of resin films constituting a multilayer circuit board and a surface wiring connected to the interlayer connection wiring are formed in predetermined positions on surfaces of each resin film. The resin films are laminated while being positioned so that the interlayer connection wiring of one of each adjacent pair of the circuit bases is superposed on a part of the surface wiring of the other, and are thereafter treated under a high-temperature and high-pressure condition to be combined with each other. If a resin film formed of a thermoplastic resin is adopted, the laminated resin films are combined by intermixing the interfaces of each adjacent pair of resin films. As the resin films shrink when the laminated resin films is cooled to ordinary temperature, a compressive force is applied to the contact surfaces of the interlayer connection wiring and the surface wiring. A resin block in which metal wires disposed parallel to each other are embedded is sliced perpendicularly to the metal wires to form resin films each having interlayer connection wiring elements with projections formed on opposite end portions of each wiring element. The projections are utilized to ensure reliable connections between the interlayer connection wiring of one of each adjacent pair of resin films and the surface wiring formed on the other.
摘要翻译：在每个树脂膜的表面上的预定位置处形成穿过构成多层电路板的树脂膜和连接到层间连接布线的表面布线的层间连接布线。树脂膜被定位成层叠，使得相邻的一对电路基板中的一个的层间连接布线叠置在另一个的表面布线的一部分上，然后在高温高压条件相互结合。如果采用由热塑性树脂形成的树脂膜，则通过混合每个相邻树脂膜的界面来组合层压树脂膜。当层压树脂膜冷却至常温时树脂薄膜收缩，对层间连接布线和表面布线的接触面施加压缩力。嵌入彼此平行布置的金属线的树脂块与金属线垂直地切割，以形成树脂膜，每个树脂膜具有形成在每个布线元件的相对端部上的突起的层间连接布线元件。这些突起用于确保每个相邻的一对树脂膜中的一个的层间连接布线与另一个树脂膜之间形成的表面布线之间的可靠连接。

7. 发明授权

US5386430A Excimer laser processing method and apparatus 失效
标题翻译：准分子激光加工方法和装置
公开(公告)号：US5386430A
公开(公告)日：1995-01-31
申请号：US92498
申请日：1993-07-16
申请人： Yasuo Yamagishi , Kanae Shimizu , Daisuke Mizutani , Tamotsu Owada , Yoshikatsu Ishizuki , Hideya Hashii
发明人： Yasuo Yamagishi , Kanae Shimizu , Daisuke Mizutani , Tamotsu Owada , Yoshikatsu Ishizuki , Hideya Hashii
IPC分类号： B23K26/00 , B23K26/03 , B23K26/06 , B23K26/38 , B23K26/40 , B23K101/42 , H01L21/768 , H01L23/522 , H05K1/02 , H05K3/00 , H01S3/22 , B05D3/06 , B29C37/00 , B23K
CPC分类号： B23K26/032 , B23K26/123 , B23K26/402 , H05K3/0035 , B23K2203/42 , H05K1/0269 , H05K2203/0207 , H05K2203/056 , H05K2203/163
摘要： An excimer laser ablation processing for forming via holes in a resin film by irradiation of an excimer laser wherein, the emission of light caused during the decomposition of the resin during the processing is detected, its intensity is measured, and the endpoint of the processing is judged or a comparison is made of the positions of light emission and the design positions for processing to examine for the presence of defects. Provision is made of a means for measuring the intensity and a means for judging the endpoint of the processing from the changes in the intensity of light emission during the processing.
摘要翻译：一种准分子激光烧蚀处理，用于通过照射准分子激光器在树脂膜中形成通孔，其中检测在处理期间树脂分解期间引起的光的发射，测量其强度，并且处理的终点为判断或比较发光的位置和处理的设计位置以检查是否存在缺陷。提供了用于测量强度的装置和用于根据处理期间的发光强度的变化来判断处理的端点的装置。

8. 发明授权

US5429709A Method of manufacturing polyimide multilayer printed wiring boards 失效
标题翻译：制造聚酰亚胺多层印刷线路板的方法
公开(公告)号：US5429709A
公开(公告)日：1995-07-04
申请号：US228347
申请日：1994-04-15
申请人： Daisuke Mizutani , Yoshikatsu Ishizuki
发明人： Daisuke Mizutani , Yoshikatsu Ishizuki
IPC分类号： H01L21/48 , H05K1/03 , H05K3/06 , H05K3/46 , B44C1/22 , C23F1/02
CPC分类号： H05K3/467 , H01L21/4857 , H05K1/0346 , H05K3/067 , Y10T428/24917
摘要： An etching process of a conductive layer in manufacturing polyimide multilayer printed wiring boards comprises the steps of dipping in an alkali aqueous solution for patterning the conductive layer, dipping in an acid aqueous solution for neutralizing the alkali residue, and washing with water thereby washing off the alkali residue. A curing process for each of polyimide layers is controlled so as to obtain a polyimide conversion ratio ranging between 60% and 100% after an initial curing process, and to obtain a polyimide conversion ratio close to 100% after formation of an uppermost polyimide layer.
摘要翻译：在制造聚酰亚胺多层印刷线路板中的导电层的蚀刻工艺包括以下步骤：浸渍在用于图案化导电层的碱性水溶液中，浸渍在酸性水溶液中以中和碱性残留物，并用水洗涤，从而洗涤碱残渣。控制每个聚酰亚胺层的固化过程，以便在初始固化过程之后获得在60％至100％之间的聚酰亚胺转化率，并且在形成最上面的聚酰亚胺层之后获得接近100％的聚酰亚胺转化率。

9. 发明申请

US20050098882A1 Multilayer wiring circuit board 有权
标题翻译：多层布线电路板
公开(公告)号：US20050098882A1
公开(公告)日：2005-05-12
申请号：US11017785
申请日：2004-12-22
申请人： Toshihiro Kusagaya , Yasuhiro Yoneda , Daisuke Mizutani , Kazuhiko Iijima , Yuji Suwa
发明人： Toshihiro Kusagaya , Yasuhiro Yoneda , Daisuke Mizutani , Kazuhiko Iijima , Yuji Suwa
IPC分类号： H05K1/02 , H05K1/11 , H05K3/00 , H05K3/46 , H01L21/44 , H01L23/48 , H01L29/76 , H01L31/062
CPC分类号： H05K3/4641 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/01087 , H05K1/0216 , H05K1/113 , H05K3/0035 , H05K3/4602 , H05K3/4623 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4688 , H05K2201/0129 , H05K2201/0154 , H05K2201/09309 , H05K2201/09518 , H05K2201/09536 , H05K2201/096 , H05K2203/1394
摘要： An inexpensive multilayer wiring circuit board capable of conducting high frequency switching operation on the circuit while the generation of high frequency noise is being suppressed by reducing the inductance of the circuit in provided. A multilayer wiring circuit board comprising: an uppermost layer designated as a first layer on which parts are mounted; a second layer on which one of a ground layer and an electric power source layer is arranged; a third layer on which the other is arranged; and an insulating layer arranged between the ground layer and the electric power source layer. A resin layer having a thermoplastic adhesion property on both faces is used as material of the insulating layer arranged between the electric power source layer and the ground layer.
摘要翻译：能够通过降低所提供的电路的电感来抑制在产生高频噪声的同时对电路进行高频开关动作的便宜的多层布线电路板。一种多层布线电路板，包括：被指定为第一层的最上层，其上安装有部件; 布置有接地层和电源层中的一个的第二层; 另一个排列在其上的第三层; 以及布置在接地层和电源层之间的绝缘层。作为在电源层和接地层之间配置的绝缘层的材料，使用两面具有热塑性粘合性的树脂层。

10. 发明授权

US07671281B2 Multilayer wiring circuit board 有权
标题翻译：多层布线电路板
公开(公告)号：US07671281B2
公开(公告)日：2010-03-02
申请号：US10254565
申请日：2002-09-26
申请人： Toshihiro Kusagaya , Yasuhiro Yoneda , Daisuke Mizutani , Kazuhiko Iijima , Yuji Suwa
发明人： Toshihiro Kusagaya , Yasuhiro Yoneda , Daisuke Mizutani , Kazuhiko Iijima , Yuji Suwa
IPC分类号： H05K1/16
CPC分类号： H05K3/4641 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2924/01087 , H05K1/0216 , H05K1/113 , H05K3/0035 , H05K3/4602 , H05K3/4623 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4688 , H05K2201/0129 , H05K2201/0154 , H05K2201/09309 , H05K2201/09518 , H05K2201/09536 , H05K2201/096 , H05K2203/1394
摘要： An inexpensive multilayer wiring circuit board capable of conducting high frequency switching operation on the circuit while the generation of high frequency noise is being suppressed by reducing the inductance of the circuit in provided. A multilayer wiring circuit board with an uppermost layer designated as a first layer on which parts are mounted; a second layer on which one of a ground layer and an electric power source layer is arranged; a third layer on which the other is arranged; and an insulating layer arranged between the ground layer and the electric power source layer. A resin layer having a thermoplastic adhesion property on both faces is used as material of the insulating layer arranged between the electric power source layer and the ground layer.
摘要翻译：能够通过降低所提供的电路的电感来抑制在产生高频噪声的同时对电路进行高频开关动作的便宜的多层布线电路板。一种多层布线电路板，其最上层被指定为安装有部件的第一层; 布置有接地层和电源层中的一个的第二层; 另一个排列在其上的第三层; 以及布置在接地层和电源层之间的绝缘层。作为在电源层和接地层之间配置的绝缘层的材料，使用两面具有热塑性粘合性的树脂层。

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