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    • 3. 发明申请
    • EPOXY RESIN COMPOSITION FOR PREPREG, PREPREG, AND MULTILAYER PRINTED CIRCUIT BOARD
    • PREPREG,PREPREG和多层印刷电路板的环氧树脂组合物
    • US20130096233A1
    • 2013-04-18
    • US13637629
    • 2011-03-22
    • Tomoaki IwamiMasaaki MatsumotoTomoyuki AbeTatsuo YonemotoHiroaki Fujiwara
    • Tomoaki IwamiMasaaki MatsumotoTomoyuki AbeTatsuo YonemotoHiroaki Fujiwara
    • C08L63/00C08K9/02C08K3/10C08K3/22
    • C08L63/00C08G59/4021C08G59/621C08J5/24C08J2363/00C08K3/10C08K3/22C08K5/5313C08K5/5397C08K9/02H05K1/0326H05K1/0353H05K1/0366H05K1/0373H05K2201/012H05K2201/0209H05K2201/0227H05K2201/0263
    • The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.8 or more on average of epoxy groups in one molecule; a hardening agent; an inorganic filler; and a molybdenum compound, wherein the epoxy resin composition for a prepreg is obtained by blending a pre-reacted epoxy resin, which is obtained by reacting at least the phosphorus compound with the bifunctional epoxy resin and the multi-functional epoxy resin, or the bifunctional epoxy resin only in advance, the bifunctional epoxy resin or the multi-functional epoxy resin, the hardening agent, the inorganic filler, and the molybdenum compound, which is excellent in flame retardance, heat resistance, thermal stiffness, and excellent in hole position accuracy without the production of a harmful substance at the time of combustion, a prepreg using the epoxy resin composition for a prepreg, and a multilayer printed circuit board using the prepreg.
    • 本发明要解决的问题是提供一种用于预浸料的环氧树脂组合物,其用于制造含有多层印刷电路板的印刷电路板,其中预浸料的环氧树脂组合物的特征在于含有 必要成分,平均分子中与环氧树脂反应的酚羟基平均为1.8以上且小于3的磷化合物,平均为磷成分为0.8以上的磷化合物; 分子中环氧基团平均为1.8以上且小于2.6的双官能环氧树脂; 在一个分子中含有2.8个或更多个平均环氧基的多官能环氧树脂; 硬化剂; 无机填料; 和钼化合物,其中预浸料用环氧树脂组合物通过将至少使磷化合物与双官能环氧树脂和多官能环氧树脂反应获得的预反应环氧树脂或双官能团 环氧树脂仅提前,双功能环氧树脂或多功能环氧树脂,硬化剂,无机填料和钼化合物,其阻燃性,耐热性,热刚度优异,孔位精度优异 在燃烧时不产生有害物质,使用该预浸料坯用环氧树脂组合物的预浸料坯和使用该预浸料坯的多层印刷电路板。
    • 9. 发明申请
    • File management method
    • 文件管理方式
    • US20050193030A1
    • 2005-09-01
    • US11066235
    • 2005-02-25
    • Tomoyuki Abe
    • Tomoyuki Abe
    • G06F12/00G06F17/30H04N5/76H04N5/907
    • G06F16/10
    • In a file management method, a management entry is recorded in a predetermined position, and creation or deletion of a file is carried out. During file creation or deletion, data relating to the management entry and a file deletion destination entry of a file to be deleted or a file creation destination entry of a file to be created are updated, whereby the latest link is created among the management entry, the deletion entry, and the unused entry. So, even when a deletion entry or an unused entry is located in a backward position in the directory, these entries can be speedily detected during file formation regardless of the number of files.
    • 在文件管理方法中,将管理条目记录在预定位置,并执行文件的创建或删除。 在文件创建或删除期间,更新与要删除的文件的管理条目和文件删除目的地条目相关的数据或要创建的文件的文件创建目的地条目,由此在管理条目中创建最新链接, 删除条目和未使用的条目。 因此,即使删除条目或未使用的条目位于目录中的后退位置,也可以在文件形成期间快速检测这些条目,而不管文件数量。