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1. 发明公开

CN102822228A 预浸料用环氧树脂组合物、预浸料和多层印制电路布线板有权
公开(公告)号：CN102822228A
公开(公告)日：2012-12-12
申请号：CN201180015886.1
申请日：2011-03-22
申请人：松下电器产业株式会社
发明人：岩见知明 , 松本匡阳 , 阿部智之 , 米本神夫 , 藤原弘明
IPC分类号： C08G59/40 , C08J5/24 , C08K3/22 , C08K3/24 , C08L63/00 , H05K1/03 , H05K3/46
CPC分类号： C08L63/00 , C08G59/4021 , C08G59/621 , C08J5/24 , C08J2363/00 , C08K3/10 , C08K3/22 , C08K5/5313 , C08K5/5397 , C08K9/02 , H05K1/0326 , H05K1/0353 , H05K1/0366 , H05K1/0373 , H05K2201/012 , H05K2201/0209 , H05K2201/0227 , H05K2201/0263
摘要：本发明的目的在于提供一种预浸料用环氧树脂组合物，其特征在于，是将磷化合物、二官能环氧树脂、多官能环氧树脂、固化剂、无机填充剂、以及钼化合物作为必须成分的预浸料用环氧树脂组合物，其至少配合有预备反应环氧树脂、二官能环氧树脂或多官能环氧树脂、固化剂、无机填充剂、钼化合物；所述磷化合物是在分子内具有平均1.8个以上且小于3个的与环氧树脂具有反应性的酚性羟基、并且具有平均0.8个以上的磷元素的化合物，所述二官能环氧树脂是在分子内具有平均1.8个以上且小于2.6个的环氧基的环氧树脂，所述多官能环氧树脂是在1分子内含有平均2.8个以上的环氧基的环氧树脂；所述预备反应环氧树脂是预先使磷化合物、与二官能环氧树脂及多官能环氧树脂反应而得的环氧树脂，或者预先使磷化合物仅与二官能环氧树脂反应而得的环氧树脂。由此，本发明的目的在于提供燃烧时不会产生有害物质且阻燃性、耐热性、热时刚性均优异的、并且可用于孔位置精度优异的包括多层印制电路布线板在内的印制电路布线板的制造的预浸料用环氧树脂组合物，使用了该预浸料用环氧树脂组合物的预浸料，使用了该预浸料的多层印制电路布线板。

2. 发明授权

CN102822228B 预浸料用环氧树脂组合物、预浸料和多层印制电路布线板有权
公开(公告)号：CN102822228B
公开(公告)日：2015-03-25
申请号：CN201180015886.1
申请日：2011-03-22
申请人：松下电器产业株式会社
发明人：岩见知明 , 松本匡阳 , 阿部智之 , 米本神夫 , 藤原弘明
IPC分类号： C08G59/40 , C08J5/24 , C08K3/22 , C08K3/24 , C08L63/00 , H05K1/03 , H05K3/46
CPC分类号： C08L63/00 , C08G59/4021 , C08G59/621 , C08J5/24 , C08J2363/00 , C08K3/10 , C08K3/22 , C08K5/5313 , C08K5/5397 , C08K9/02 , H05K1/0326 , H05K1/0353 , H05K1/0366 , H05K1/0373 , H05K2201/012 , H05K2201/0209 , H05K2201/0227 , H05K2201/0263
摘要：本发明的目的在于提供一种预浸料用环氧树脂组合物，其特征在于，是将磷化合物、二官能环氧树脂、多官能环氧树脂、固化剂、无机填充剂、以及钼化合物作为必须成分的预浸料用环氧树脂组合物，其至少配合有预备反应环氧树脂、二官能环氧树脂或多官能环氧树脂、固化剂、无机填充剂、钼化合物；所述磷化合物是在分子内具有平均1.8个以上且小于3个的与环氧树脂具有反应性的酚性羟基、并且具有平均0.8个以上的磷元素的化合物，所述二官能环氧树脂是在分子内具有平均1.8个以上且小于2.6个的环氧基的环氧树脂，所述多官能环氧树脂是在1分子内含有平均2.8个以上的环氧基的环氧树脂；所述预备反应环氧树脂是预先使磷化合物、与二官能环氧树脂及多官能环氧树脂反应而得的环氧树脂，或者预先使磷化合物仅与二官能环氧树脂反应而得的环氧树脂。由此，本发明的目的在于提供燃烧时不会产生有害物质且阻燃性、耐热性、热时刚性均优异的、并且可用于孔位置精度优异的包括多层印制电路布线板在内的印制电路布线板的制造的预浸料用环氧树脂组合物，使用了该预浸料用环氧树脂组合物的预浸料，使用了该预浸料的多层印制电路布线板。

3. 发明申请

US20130096233A1 EPOXY RESIN COMPOSITION FOR PREPREG, PREPREG, AND MULTILAYER PRINTED CIRCUIT BOARD 有权
标题翻译： PREPREG，PREPREG和多层印刷电路板的环氧树脂组合物
公开(公告)号：US20130096233A1
公开(公告)日：2013-04-18
申请号：US13637629
申请日：2011-03-22
申请人： Tomoaki Iwami , Masaaki Matsumoto , Tomoyuki Abe , Tatsuo Yonemoto , Hiroaki Fujiwara
发明人： Tomoaki Iwami , Masaaki Matsumoto , Tomoyuki Abe , Tatsuo Yonemoto , Hiroaki Fujiwara
IPC分类号： C08L63/00 , C08K9/02 , C08K3/10 , C08K3/22
CPC分类号： C08L63/00 , C08G59/4021 , C08G59/621 , C08J5/24 , C08J2363/00 , C08K3/10 , C08K3/22 , C08K5/5313 , C08K5/5397 , C08K9/02 , H05K1/0326 , H05K1/0353 , H05K1/0366 , H05K1/0373 , H05K2201/012 , H05K2201/0209 , H05K2201/0227 , H05K2201/0263
摘要： The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.8 or more on average of epoxy groups in one molecule; a hardening agent; an inorganic filler; and a molybdenum compound, wherein the epoxy resin composition for a prepreg is obtained by blending a pre-reacted epoxy resin, which is obtained by reacting at least the phosphorus compound with the bifunctional epoxy resin and the multi-functional epoxy resin, or the bifunctional epoxy resin only in advance, the bifunctional epoxy resin or the multi-functional epoxy resin, the hardening agent, the inorganic filler, and the molybdenum compound, which is excellent in flame retardance, heat resistance, thermal stiffness, and excellent in hole position accuracy without the production of a harmful substance at the time of combustion, a prepreg using the epoxy resin composition for a prepreg, and a multilayer printed circuit board using the prepreg.
摘要翻译：本发明要解决的问题是提供一种用于预浸料的环氧树脂组合物，其用于制造含有多层印刷电路板的印刷电路板，其中预浸料的环氧树脂组合物的特征在于含有必要成分，平均分子中与环氧树脂反应的酚羟基平均为1.8以上且小于3的磷化合物，平均为磷成分为0.8以上的磷化合物; 分子中环氧基团平均为1.8以上且小于2.6的双官能环氧树脂; 在一个分子中含有2.8个或更多个平均环氧基的多官能环氧树脂; 硬化剂; 无机填料; 和钼化合物，其中预浸料用环氧树脂组合物通过将至少使磷化合物与双官能环氧树脂和多官能环氧树脂反应获得的预反应环氧树脂或双官能团环氧树脂仅提前，双功能环氧树脂或多功能环氧树脂，硬化剂，无机填料和钼化合物，其阻燃性，耐热性，热刚度优异，孔位精度优异在燃烧时不产生有害物质，使用该预浸料坯用环氧树脂组合物的预浸料坯和使用该预浸料坯的多层印刷电路板。

4. 发明授权

US09206308B2 Epoxy resin composition for prepreg, prepreg, and multilayer printed circuit board 有权
标题翻译：预浸料，预浸料和多层印刷电路板用环氧树脂组合物
公开(公告)号：US09206308B2
公开(公告)日：2015-12-08
申请号：US13637629
申请日：2011-03-22
申请人： Tomoaki Iwami , Masaaki Matsumoto , Tomoyuki Abe , Tatsuo Yonemoto , Hiroaki Fujiwara
发明人： Tomoaki Iwami , Masaaki Matsumoto , Tomoyuki Abe , Tatsuo Yonemoto , Hiroaki Fujiwara
IPC分类号： H05K1/03 , B32B27/04 , B32B27/20 , B32B27/26 , B32B27/38 , C08K3/10 , C08K3/22 , C08L63/00 , C08G59/22 , C08G59/30 , C08G59/38 , C08G59/62 , C08G59/40 , C08J5/24 , C08K9/02 , C08K5/5313 , C08K5/5397
CPC分类号： C08L63/00 , C08G59/4021 , C08G59/621 , C08J5/24 , C08J2363/00 , C08K3/10 , C08K3/22 , C08K5/5313 , C08K5/5397 , C08K9/02 , H05K1/0326 , H05K1/0353 , H05K1/0366 , H05K1/0373 , H05K2201/012 , H05K2201/0209 , H05K2201/0227 , H05K2201/0263
摘要： The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.8 or more on average of epoxy groups in one molecule; a hardening agent; an inorganic filler; and a molybdenum compound, wherein the epoxy resin composition for a prepreg is obtained by blending a pre-reacted epoxy resin, which is obtained by reacting at least the phosphorus compound with the bifunctional epoxy resin and the multi-functional epoxy resin, or the bifunctional epoxy resin only in advance, the bifunctional epoxy resin or the multi-functional epoxy resin, the hardening agent, the inorganic filler, and the molybdenum compound, which is excellent in flame retardance, heat resistance, thermal stiffness, and excellent in hole position accuracy without the production of a harmful substance at the time of combustion, a prepreg using the epoxy resin composition for a prepreg, and a multilayer printed circuit board using the prepreg.
摘要翻译：本发明要解决的问题是提供一种用于预浸料的环氧树脂组合物，其用于制造含有多层印刷电路板的印刷电路板，其中预浸料的环氧树脂组合物的特征在于含有必要成分，平均分子中与环氧树脂反应的酚羟基平均为1.8以上且小于3的磷化合物，平均为磷成分为0.8以上的磷化合物; 分子中环氧基团平均为1.8以上且小于2.6的双官能环氧树脂; 在一个分子中含有2.8个或更多个平均环氧基的多官能环氧树脂; 硬化剂; 无机填料; 和钼化合物，其中预浸料用环氧树脂组合物通过将至少使磷化合物与双官能环氧树脂和多官能环氧树脂反应获得的预反应环氧树脂或双官能团环氧树脂仅提前，双功能环氧树脂或多功能环氧树脂，硬化剂，无机填料和钼化合物，其阻燃性，耐热性，热刚度优异，孔位精度优异在燃烧时不产生有害物质，使用该预浸料坯用环氧树脂组合物的预浸料坯和使用该预浸料坯的多层印刷电路板。

5. 发明申请

US20160100480A1 TEXTILE INTEGRATION OF ELECTRONIC CIRCUITS 审中-公开
标题翻译：电子电路纺织整合
公开(公告)号：US20160100480A1
公开(公告)日：2016-04-07
申请号：US14752576
申请日：2015-06-26
申请人： IMEC vzw
发明人： Bjorn Van Keymeulen , Frederick Bossuyt , Thomas Vervust
IPC分类号： H05K1/03 , H05K3/00 , H05K3/46 , H05K1/02 , H05K3/32
CPC分类号： H05K1/038 , A41D1/002 , H05K1/0283 , H05K1/189 , H05K3/0026 , H05K3/321 , H05K3/46 , H05K2201/0263 , H05K2201/0969 , H05K2201/10977 , H05K2203/107
摘要： The present disclosure relates to a method of integrating a interposer device with a textile layer, wherein the interposer device is a stretchable interposer device comprising a stretchable electrically conductive structure with at least one contact pad for establishing at least one electrically conductive path towards the textile layer. The interposer device is arranged to be mechanically attached to a textile layer comprising a plurality of yarns, at least one of which is an electrically conductive yarn. An electrical connection is established between the at least one conductive yarn of the textile layer and the at least one contact pad, which electrical connection is established after the interposer device has been mechanically attached to the textile layer.
摘要翻译：本公开涉及一种将插入器装置与织物层整合的方法，其中所述插入器装置是可拉伸插入器装置，其包括具有至少一个接触垫的可拉伸导电结构，用于建立至少一个朝向织物层的导电路径。插入器装置被布置成机械地附接到包括多根纱线的织物层，其中至少一个是导电纱线。在织物层的至少一个导电纱线和至少一个接触垫片之间建立电连接，在插入器装置机械地附接到织物层之后，建立电连接。

6. 发明公开

EP2957154A1 TEXTILE INTEGRATION OF ELECTRONIC CIRCUITS 有权
标题翻译：集成在纺织品电子电路
公开(公告)号：EP2957154A1
公开(公告)日：2015-12-23
申请号：EP14703896.2
申请日：2014-02-12
申请人： IMEC VZW , Universiteit Gent
发明人： VAN KEYMEULEN, Bjorn , BOSSUYT, Frederick , VERVUST, Thomas
IPC分类号： H05K1/03 , H05K1/18 , D03D1/00 , A41D1/00
CPC分类号： H05K1/038 , A41D1/002 , H05K1/0283 , H05K1/189 , H05K3/0026 , H05K3/321 , H05K3/46 , H05K2201/0263 , H05K2201/0969 , H05K2201/10977 , H05K2203/107
摘要： The present disclosure relates to a method of integrating a interposer device with a textile layer, wherein the interposer device is a stretchable interposer device comprising a stretchable electrically conductive structure with at least one contact pad for establishing at least one electrically conductive path towards the textile layer. The interposer device is arranged to be mechanically attached to a textile layer comprising a plurality of yarns, at least one of which is an electrically conductive yarn. An electrical connection is established between the at least one conductive yarn of the textile layer and the at least one contact pad, which electrical connection is established after the interposer device has been mechanically attached to the textile layer.

7. 发明公开

EP2554561A1 EPOXY RESIN COMPOSITION FOR PREPREG, PREPREG, AND MULTILAYER PRINTED CIRCUIT BOARD 有权转让
标题翻译： EPOXIDHARZZUSAMMENSETZUNGFÜREIN PREPREG，PREPREG UND MEHRSCHICHTIGEBESTÜCKTELEITERPLATTE
公开(公告)号：EP2554561A1
公开(公告)日：2013-02-06
申请号：EP11759389.7
申请日：2011-03-22
申请人： Panasonic Corporation
发明人： IWAMI Tomoaki , MATSUMOTO Masaaki , ABE Tomoyuki , YONEMOTO Tatsuo , FUJIWARA Hiroaki
IPC分类号： C08G59/40 , C08J5/24 , C08K3/22 , C08K3/24 , C08L63/00 , H05K1/03 , H05K3/46
CPC分类号： C08L63/00 , C08G59/4021 , C08G59/621 , C08J5/24 , C08J2363/00 , C08K3/10 , C08K3/22 , C08K5/5313 , C08K5/5397 , C08K9/02 , H05K1/0326 , H05K1/0353 , H05K1/0366 , H05K1/0373 , H05K2201/012 , H05K2201/0209 , H05K2201/0227 , H05K2201/0263
摘要： The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.8 or more on average of epoxy groups in one molecule; a hardening agent; an inorganic filler; and a molybdenum compound, wherein the epoxy resin composition for a prepreg is obtained by blending a pre-reacted epoxy resin, which is obtained by reacting at least the phosphorus compound with the bifunctional epoxy resin and the multi-functional epoxy resin, or the bifunctional epoxy resin only in advance, the bifunctional epoxy resin or the multi-functional epoxy resin, the hardening agent, the inorganic filler, and the molybdenum compound, which is excellent in flame retardance, heat resistance, thermal stiffness, and excellent in hole position accuracy without the production of a harmful substance at the time of combustion, a prepreg using the epoxy resin composition for a prepreg, and a multilayer printed circuit board using the prepreg.
摘要翻译：本发明要解决的问题是提供一种预浸料用环氧树脂组合物，其用于制造含有多层印刷电路板的印刷电路板，其中预浸料的环氧树脂组合物的特征在于含有必要成分，平均分子中与环氧树脂反应的酚羟基平均为1.8以上且小于3的磷化合物，平均为磷成分为0.8以上的磷化合物; 分子中环氧基团平均为1.8以上且小于2.6的双官能环氧树脂; 在一个分子中含有2.8个或更多个环氧基的多官能环氧树脂; 硬化剂; 无机填料; 和钼化合物，其中预浸料用环氧树脂组合物是通过将至少使磷化合物与双官能环氧树脂和多官能环氧树脂反应获得的预反应环氧树脂或双官能团环氧树脂仅提前，双功能环氧树脂或多功能环氧树脂，硬化剂，无机填料和钼化合物，其阻燃性，耐热性，热刚性优异，孔位精度优异在燃烧时不产生有害物质，使用使用了预浸料的环氧树脂组合物的预浸料，以及使用该预浸料的多层印刷电路板。

8. 发明公开

EP2554561A4 EPOXY RESIN COMPOSITION FOR PREPREG, PREPREG, AND MULTILAYER PRINTED CIRCUIT BOARD 有权转让
标题翻译：用于预浸料预浸料和环氧树脂组合物的多层印刷电路板组装
公开(公告)号：EP2554561A4
公开(公告)日：2017-02-22
申请号：EP11759389
申请日：2011-03-22
申请人： PANASONIC IP MAN CO LTD
发明人： IWAMI TOMOAKI , MATSUMOTO MASAAKI , ABE TOMOYUKI , YONEMOTO TATSUO , FUJIWARA HIROAKI
IPC分类号： H05K1/03 , C08G59/40 , C08G59/62 , C08J5/24 , C08K5/5313 , C08K5/5397 , H05K1/02
CPC分类号： C08L63/00 , C08G59/4021 , C08G59/621 , C08J5/24 , C08J2363/00 , C08K3/10 , C08K3/22 , C08K5/5313 , C08K5/5397 , C08K9/02 , H05K1/0326 , H05K1/0353 , H05K1/0366 , H05K1/0373 , H05K2201/012 , H05K2201/0209 , H05K2201/0227 , H05K2201/0263
摘要： The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.8 or more on average of epoxy groups in one molecule; a hardening agent; an inorganic filler; and a molybdenum compound, wherein the epoxy resin composition for a prepreg is obtained by blending a pre-reacted epoxy resin, which is obtained by reacting at least the phosphorus compound with the bifunctional epoxy resin and the multi-functional epoxy resin, or the bifunctional epoxy resin only in advance, the bifunctional epoxy resin or the multi-functional epoxy resin, the hardening agent, the inorganic filler, and the molybdenum compound, which is excellent in flame retardance, heat resistance, thermal stiffness, and excellent in hole position accuracy without the production of a harmful substance at the time of combustion, a prepreg using the epoxy resin composition for a prepreg, and a multilayer printed circuit board using the prepreg.

9. 发明申请

WO2014124986A1 TEXTILE INTEGRATION OF ELECTRONIC CIRCUITS 审中-公开
标题翻译：电子电路纺织整合
公开(公告)号：WO2014124986A1
公开(公告)日：2014-08-21
申请号：PCT/EP2014/052753
申请日：2014-02-12
申请人： IMEC VZW , UNIVERSITEIT GENT
发明人： VAN KEYMEULEN, Bjorn , BOSSUYT, Frederick , VERVUST, Thomas
IPC分类号： H05K1/03 , H05K1/18 , D03D1/00 , A41D1/00
CPC分类号： H05K1/038 , A41D1/002 , H05K1/0283 , H05K1/189 , H05K3/0026 , H05K3/321 , H05K3/46 , H05K2201/0263 , H05K2201/0969 , H05K2201/10977 , H05K2203/107
摘要： The present disclosure relates to a method of integrating a interposer device with a textile layer, wherein the interposer device is a stretchable interposer device comprising a stretchable electrically conductive structure with at least one contact pad for establishing at least one electrically conductive path towards the textile layer. The interposer device is arranged to be mechanically attached to a textile layer comprising a plurality of yarns, at least one of which is an electrically conductive yarn. An electrical connection is established between the at least one conductive yarn of the textile layer and the at least one contact pad, which electrical connection is established after the interposer device has been mechanically attached to the textile layer.
摘要翻译：本公开涉及一种将插入器装置与织物层整合的方法，其中所述插入器装置是可拉伸插入器装置，其包括具有至少一个接触垫的可拉伸导电结构，用于建立至少一个朝向织物层的导电路径。插入器装置被布置成机械地附接到包括多根纱线的织物层，其中至少一个是导电纱线。在织物层的至少一个导电纱线和至少一个接触垫片之间建立电连接，在插入器装置机械地附接到织物层之后，建立电连接。

10. 发明申请

WO2011118584A1 プリプレグ用エポキシ樹脂組成物、プリプレグ、及び多層プリント配線板审中-公开
标题翻译： PREPREG，PREPREG和多层印刷电路板的环氧树脂组合物
公开(公告)号：WO2011118584A1
公开(公告)日：2011-09-29
申请号：PCT/JP2011/056841
申请日：2011-03-22
申请人：パナソニック電工株式会社 , 岩見知明 , 松本匡陽 , 阿部智之 , 米本神夫 , 藤原弘明
发明人：岩見　知明 , 松本　匡陽 , 阿部　智之 , 米本　神夫 , 藤原　弘明
IPC分类号： C08G59/40 , C08J5/24 , C08K3/22 , C08K3/24 , C08L63/00 , H05K1/03 , H05K3/46
CPC分类号： C08L63/00 , C08G59/4021 , C08G59/621 , C08J5/24 , C08J2363/00 , C08K3/10 , C08K3/22 , C08K5/5313 , C08K5/5397 , C08K9/02 , H05K1/0326 , H05K1/0353 , H05K1/0366 , H05K1/0373 , H05K2201/012 , H05K2201/0209 , H05K2201/0227 , H05K2201/0263
摘要：　分子内にエポキシ樹脂と反応性を有するフェノール性水酸基を平均１．８個以上３個未満有し、かつ、平均０．８個以上のリン元素を有するリン化合物、分子内にエポキシ基を平均１．８個以上２．６個未満有する２官能エポキシ樹脂、１分子内にエポキシ基を平均２．８個以上含む多官能エポキシ樹脂、硬化剤、無機充填剤、モリブデン化合物を必須成分とするプリプレグ用エポキシ樹脂組成物であって、少なくとも、リン化合物と、２官能エポキシ樹脂及び多官能エポキシ樹脂、または２官能エポキシ樹脂のみを予め反応させた予備反応エポキシ樹脂、２官能エポキシ樹脂または多官能エポキシ樹脂、硬化剤、無機充填剤、モリブデン化合物を配合することを特徴とし、燃焼時に有害な物質を生成することがなく、難燃性、耐熱性、熱時剛性に優れ、かつ、穴位置精度に優れた多層プリント配線板を含む、プリント配線板の製造に用いられるプリプレグ用エポキシ樹脂組成物、該プリプレグ用エポキシ樹脂組成物を用いたプリプレグ、該プリプレグを用いた多層プリント配線板を提供することを課題とする。
摘要翻译：本发明提供一种预浸料用环氧树脂组合物，其包含作为必要成分的磷化合物，其在分子内具有平均1.8以上且小于3个与环氧树脂反应的酚羟基，平均为 0.8以上的元素磷; 在分子内平均具有1.8以上且小于2.6个环氧基的双官能环氧树脂; 每分子平均具有2.8个或更多个环氧基的多官能环氧树脂; 固化剂; 无机填料; 和钼化合物。所述预浸料用环氧树脂组合物的特征在于至少组合：磷化合物; 双功能环氧树脂和多官能环氧树脂，或其中只有双官能环氧树脂预反应的预反应环氧树脂，双官能环氧树脂和/或多官能环氧树脂; 固化剂; 无机填料; 和钼化合物。因此，可以获得预浸料坯的环氧树脂组合物，其在燃烧时不产生有害物质，具有优异的框架延迟性，耐热性和热刚性，并且可用于制造印刷电路包括具有优异的孔位精度的多层印刷电路板。此外，可以获得使用上述预浸料用环氧树脂组合物的预浸料坯和使用所述预浸料坯的多层印刷电路板。

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