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1. 发明专利

JP2006019417A Ball detecting method and ball detecting device 有权
标题翻译：球检测方法和球检测装置
公开(公告)号：JP2006019417A
公开(公告)日：2006-01-19
申请号：JP2004194324
申请日：2004-06-30
申请人： Athlete Fa Kk , Unkai Sato , アスリートFa株式会社 , 運海佐藤
发明人： SATO UNKAI , FUJIMORI YOSHIHARU , KAWAKAMI SHIGEAKI , NAITO KENJI
IPC分类号： H01L23/12 , H01L21/60 , H05K3/00
CPC分类号： H01L24/75 , H01L24/81 , H01L2224/14 , H01L2924/14 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a ball detecting method and a ball mounting head which are surely capable of detecting excessive balls adhered to the ball line-up surface of the ball mounting head in a ball mounting device. SOLUTION: The ball mounting head is constituted of a ball line-up unit 4, a light shielding unit and a light shielding type light sensor consisting of a light emitting unit 1 and a light receiving unit 2. The light shielding unit is constituted of a light shielding plate 12 for shielding light against normal balls 6 arrayed on the ball line-up surface 5, and a driving device 9 for driving the light shielding plate up-and-down. The back noise of output of the light sensor can be remarkably reduced by the light shielding plate. The ball detecting method is carried out by sampling the output of light receiving unit by a predetermined number of times and the average value of the results of samplings is operated as the back noise and a difference between the output from the light receiving unit obtained through the sampling and the back noise is operated. The value of difference is compared with a threshold value to judge the existence or absence of the balls. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种球检测方法和球安装头，其可以在球安装装置中能够检测粘附到球安装头的球排列表面的过量球。
解决方案：球安装头由球形阵列单元4，遮光单元和由发光单元1和光接收单元2组成的遮光型光传感器构成。遮光单元由遮光板12构成，该遮光板12用于遮蔽与排列在球形阵列表面5上的普通球6的光，以及用于上下驱动遮光板的驱动装置9。通过遮光板可以显着降低光传感器的输出的背噪音。球检测方法是通过对光接收单元的输出进行采样预定次数进行的，并且采样结果的平均值作为背噪声操作，并且通过所述光接收单元得到的光接收单元的输出之间的差采样和背噪声操作。将差值与阈值进行比较，以判断球的存在或不存在。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2009170688A Stage and ball mounting device using it 有权
标题翻译：使用它的阶段和球安装设备
公开(公告)号：JP2009170688A
公开(公告)日：2009-07-30
申请号：JP2008007750
申请日：2008-01-17
申请人： Athlete Fa Kk , アスリートFa株式会社
发明人： KAWAKAMI SHIGEAKI , TANIKAI TADASHI , KOTAKE TOSHIYUKI , ASANO KUNIKAZU , YAZAWA ICHIRO
IPC分类号： H01L21/60
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a stage capable of mounting and transferring a substrate and then overlaying a mask on the substrate in a good condition.
SOLUTION: This device includes: a substrate supporting table 42 having a substrate supporting surface 41 supporting a substrate; a first driving mechanism 44 vertically moving the substrate supporting table 42; a frame 52 which has an upper end surface 51 positioned at the periphery of the substrate supporting surface 41 and has a profile of rectangular form; and a second driving mechanism 54 vertically moving the frame 52. A thin plate-like mask is fixed above the place of moving end of a stage 10. A plurality of first suction holes 58, suction-adsorbing the mask when the frame 52 is moved upward with the second driving mechanism 54 under the mask and the upper end surface 51 is brought into contact with the mask, are provided along a pair of facing sides of the upper end surface 51 of the frame 52.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够安装和转移衬底，然后在良好状态下将掩模重叠在衬底上的阶段。解决方案：该装置包括：基板支撑台42，具有支撑基板的基板支撑表面41; 垂直移动基板支撑台42的第一驱动机构44; 框架52，其具有位于基板支撑表面41的周边的上端面51，并且具有矩形的轮廓; 以及垂直移动框架52的第二驱动机构54.薄板状掩模固定在台架10的移动端的位置上方。多个第一抽吸孔58，当框架52移动时吸附 - 掩模向上与掩模下方的第二驱动机构54和上端面51与掩模接触，沿着框架52的上端表面51的一对相对侧设置。版权所有（C））2009，JPO＆INPIT

3. 发明专利

JP2009071332A Apparatus for mounting a conductive ball 审中-公开
标题翻译：安装导电棒的装置
公开(公告)号：JP2009071332A
公开(公告)日：2009-04-02
申请号：JP2008318153
申请日：2008-12-15
申请人： Athlete Fa Kk , アスリートFa株式会社
发明人： NEHASHI TORU , KAWAKAMI SHIGEAKI
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide an apparatus of manufacturing a work with sufficient yield, having particles like conductive balls such as a solder ball, a gold ball, or a copper ball, used in mounting of a semiconductor device or an optical device, arranged with high reliability on a work such as a wafer in accordance with a desired pattern. SOLUTION: A ball mounter 1 for arranging conductive balls on a work 10 has a table 23 on which the work 10 is mounted, to be carried in an X-direction; and a print unit 26 and a ball mounting unit 27 arranged along the X-direction in which the table 23 is moved. The print unit 26 prints flux on the work 10 mounted on the table 23, through a mask for print, and the conductive balls are arranged by the ball mounting unit 27, on the work 10 mounted on the table 23 via a mask for mounting balls. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种以足够的产量制造工件的装置，具有用于安装半导体器件或光学器件的诸如焊球，金球或铜球等导电球的颗粒器件，按照期望的图案在诸如晶片的工件上高度可靠地布置。解决方案：用于在工件10上布置导电球的滚珠安装机1具有安装工件10的工作台23，以在X方向上承载; 以及沿台架23移动的X方向配置的打印单元26和球安装单元27。打印单元26通过用于打印的掩模在安装在台23上的工件10上打印通量，并且导电球通过球安装单元27布置在安装在桌子23上的工件10上，用于安装球。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2008142775A Ball feeding device and ball depositing apparatus 审中-公开
标题翻译：球进料装置和球沉积装置
公开(公告)号：JP2008142775A
公开(公告)日：2008-06-26
申请号：JP2007308333
申请日：2007-11-29
申请人： Athlete Fa Kk , アスリートFa株式会社
发明人： KAWAKAMI SHIGEAKI , HAMA TETSUYA
IPC分类号： B23K3/06 , B23K101/42 , H01L21/60 , H01L23/12 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a ball feeding device for a ball forming a solder bump in a semiconductor wafer and an electronic circuit substrate, and to provide a ball depositing apparatus using the same.
SOLUTION: Regarding the ball feeding method, a ball feeding device 10 is rotated by 180°, and thereafter, the ball feeding device 10 is reversed and is returned to the original state, thus balls 20 are weighed, and are exhausted. The ball feeding device 10 is composed of: a ball weighing cavity 27 formed on one side of two plates; a ball separation/storage cavity 29; and a passage allowing them to communicate with each other. The ball depositing apparatus deposits the balls 20 fed from the ball feeding device 10 onto a substrate via the opening of a mask.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种在半导体晶片和电子电路基板中形成焊料凸块的球的送球装置，并提供使用该球的投球装置。＆lt; P＆gt;解决方案：关于送球方式，将送球装置10旋转180°，然后使球进给装置10反转回到初始状态，称重球20。球喂入装置10包括：形成在两个板的一侧的球体腔27; 球分离/储存腔29; 以及让他们相互沟通的通道。球沉积装置通过打开掩模将从喂球装置10进给的球20沉积到基底上。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2007005676A Electronic component jointing equipment 有权
标题翻译：电子元件接头设备
公开(公告)号：JP2007005676A
公开(公告)日：2007-01-11
申请号：JP2005186180
申请日：2005-06-27
申请人： Athlete Fa Kk , アスリートFa株式会社
发明人： KAWAKAMI SHIGEAKI
IPC分类号： H01L21/60
CPC分类号： H01L2224/75
摘要： PROBLEM TO BE SOLVED: To provide a distinct structure of an electronic component jointing equipment which can stabilize a connection between a terminal and an electrode, and can ensure jointing strength between a substrate and the electronic component.
SOLUTION: The jointing equipment 1 includes a vibration head 7 which pressure-joints the terminal of the substrate 2 and the electrode on the electronic component 4, and a substrate-mounting table 10, and is constructed so that the equipment 1 pressure-joints the terminal and the electrode by using vibration and hardens insulating resin to make the substrate 2 and the electrode 4 adhered. The substrate-mounting table 10 includes a mounting jig 32 formed with the mounting surface 32a of the substrate 2, and a heater 33 which heats the mounting jig 32. The width H1 of transfer direction of the mounting surface 32a, which is located farther upstream in the transfer direction V than a position A, when the terminal and the electrode are press-jointed, is formed in arrangement spacing P of the insulating resin on the substrate 2 or smaller.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供能够稳定端子和电极之间的连接的电子部件接合设备的不同结构，并且可以确保基板和电子部件之间的接合强度。解决方案：接合设备1包括将基板2的端子和电子部件4上的电极压接的振动头7和基板安装台10，并且被构造成使得设备1的压力通过使用振动和硬化绝缘树脂来连接端子和电极，以使基板2和电极4粘附。基板安装台10包括形成有基板2的安装面32a的安装夹具32和加热安装夹具32的加热器33.位于更上游的安装面32a的传送方向的宽度H1 在传送方向V上比位置A，当端子和电极被压接时，形成在基板2上的绝缘树脂的布置间隔P或更小。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2006175471A Ball supplying method, ball supplying apparatus, and ball arranging apparatus 审中-公开
标题翻译：球供应方法，球供应装置和球安装装置
公开(公告)号：JP2006175471A
公开(公告)日：2006-07-06
申请号：JP2004370609
申请日：2004-12-22
申请人： Athlete Fa Kk , アスリートFa株式会社
发明人： KAWAKAMI SHIGEAKI , HAMA TETSUYA
IPC分类号： B23K3/06 , B23K101/42 , H01L21/60 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a ball supplying method and a ball supplying apparatus for supplying balls to form solder bumps on semi-conductor wafers and electronic circuit substrates, and further to provide a ball arranging apparatus using them.
SOLUTION: In the ball supplying method, the balls are measured and discharged from the ball supplying apparatus by turning the ball supplying apparatus by 180°, and then by returning it to the original state through turning it in the opposite direction. The ball supplying apparatus is composed of a ball storing section, a ball measuring section, and a motor for turning the ball storing section and the ball measuring section. The ball measuring section is composed of a ball measuring cavity, a ball separating and storing cavity, and an exit. The ball storing section is communicated with the exit via a hollow pipe.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种球供给方法和用于提供球以在半导体晶片和电子电路基板上形成焊料凸块的球供给装置，并且还提供使用它们的球配置装置。＆lt; P＆gt;解决方案：在球的供给方法中，通过将球供给装置转动180°，从球供给装置测量并排出球，然后通过使其向相反方向转动而将其返回到原始状态。球供给装置由球储存部，球测量部和用于转动球存储部和球测量部的马达构成。球测量部分由球体测量腔，球分离储存腔和出口构成。球储存部通过中空管与出口连通。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2011244013A Device for mounting conductive ball 有权
标题翻译：用于安装导电球的装置
公开(公告)号：JP2011244013A
公开(公告)日：2011-12-01
申请号：JP2011180810
申请日：2011-08-22
申请人： Athlete Fa Kk , アスリートFa株式会社
发明人： NEHASHI TORU , KAWAKAMI SHIGEAKI
IPC分类号： H01L21/60 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a device for mounting a conductive ball which can load a conductive ball to multiple openings of a mask more accurately without many failures.SOLUTION: A mounting device 1 loads a conductive ball 15 to the multiple openings of a mask 11 which are provided with the multiple openings for positioning the conductive ball 15 in a state where the mask 11 is set on a substrate 10. An optical sensor 65 to detect the density of the conductive ball 15 of an action region 26 is provided on the undersurface of a head 20 of the mounting device 1. This optical sensor 65 detects the presence of a region 26a of the action region 26 where the conductive ball exists and the presence of a region 26b where the conductive ball does not exist.
摘要翻译：要解决的问题：提供一种用于安装导电球的装置，其可以更准确地将导电球加载到掩模的多个开口，而没有许多故障。解决方案：安装装置1将导电球15装载到掩模11的多个开口，该掩模11设置有多个开口，用于将掩模11设置在基板10上的状态下定位导电球15。用于检测作用区域26的导电球15的密度的光学传感器65设置在安装装置1的头部20的下表面上。该光学传感器65检测作用区域26的区域26a的存在，其中导电球存在，并且存在导电球不存在的区域26b。版权所有（C）2012，JPO＆INPIT

8. 发明专利

JP2009049076A Device and mask for filling conductive ball 有权
标题翻译：用于填充导电球的装置和面罩
公开(公告)号：JP2009049076A
公开(公告)日：2009-03-05
申请号：JP2007211696
申请日：2007-08-15
申请人： Athlete Fa Kk , アスリートFa株式会社
发明人： NEHASHI TORU , KAWAKAMI SHIGEAKI
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a device capable of shortening time required to mount conductive balls to one substrate.
SOLUTION: This filling device 10 has a holder 130 for holding a mask 110 on a substrate 100, a plurality of heads 141 provided along the X direction, and a moving device 150 for moving a plurality of the heads 141 in the Y direction. The mask 110 held by the holder 130 includes a plurality of mask patterns forming an arrangement of a plurality of openings. A plurality of the mask patterns corresponds to a plurality of the electrode patterns of the substrate. The mask 110 held by the holder 130 also includes a plurality of groove-shaped first recessed parts 121 extending in the Y direction in parallel with its top face 110a. Each recessed part 121 has a depth at least corresponding to the radius of the conductive ball.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供能够缩短将导电球安装到一个基板所需的时间的装置。解决方案：该填充装置10具有用于在基板100上保持掩模110的保持器130，沿着X方向设置的多个头141，以及用于使Y中的多个头141移动的移动装置150 方向。由保持器130保持的掩模110包括形成多个开口的布置的多个掩模图案。多个掩模图案对应于基板的多个电极图案。由保持器130保持的掩模110还包括与其顶面110a平行地沿Y方向延伸的多个凹槽状的第一凹部121。每个凹部121具有至少对应于导电球的半径的深度。版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2008211258A Bonding device for electronic component 有权
标题翻译：电子元件的接合装置
公开(公告)号：JP2008211258A
公开(公告)日：2008-09-11
申请号：JP2008149691
申请日：2008-06-06
申请人： Athlete Fa Kk , アスリートFa株式会社
发明人： NEHASHI TORU , KAWAKAMI SHIGEAKI , SHIMIZU HIROYUKI
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To prevent damages to a substrate when bonding electronic components such as IC chips onto a flexible substrate by oscillation.
SOLUTION: A method of bonding electronic components has processes in which: a head 2 holds an electronic component 12; the held electronic component 12 moves to a first predetermined position; a flexible substrate 11 having flexibility is adopted as a substrate and the flexible substrate 11 moves to a second predetermined position; a substrate mounting table 6 holds the flexible substrate 11 with a surface roughness of a mounting face 6a being 0.01 to 0.5 μm for the purpose of mounting the flexible substrate 11; the electronic component 12 and flexible substrate 11 are pressure-bonded by oscillation of either the head 2 or substrate mounting table 6 or both; the electronic component 12 turns from a holding state by the head 2 to a non-holding state; and the flexible substrate 11 turns from the holding state by the substrate mounting table 6 to the non-holding state.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了防止在通过振荡将诸如IC芯片的电子部件接合到柔性基板上时损坏基板。解决方案：电子部件的接合方法具有以下处理：头部2保持电子部件12; 保持电子部件12移动到第一预定位置; 采用具有柔性的柔性基板11作为基板，柔性基板11移动到第二预定位置; 为了安装柔性基板11，基板安装台6将安装面6a的表面粗糙度保持为0.01〜0.5μm的柔性基板11; 电子部件12和柔性基板11通过头部2或基板安装台6或两者的振荡而被压接; 电子部件12由头部2从保持状态转变为非保持状态; 并且柔性基板11从保持状态由基板安装台6转动到非保持状态。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2007227965A Bonding method 审中-公开
标题翻译：结合方法
公开(公告)号：JP2007227965A
公开(公告)日：2007-09-06
申请号：JP2007115151
申请日：2007-04-25
申请人： Athlete Fa Kk , アスリートFa株式会社
发明人： NEHASHI TORU , KAWAKAMI SHIGEAKI , SHIMIZU HIROYUKI
IPC分类号： H01L21/603 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a bonding method which can improve the accuracy of position adjustment between a vibration head for an electronic part and a COF tape.
SOLUTION: This bonding method comprises the following steps of: simultaneously taking images of an electric part held by a vibration head and a resin substrate held on a substrate mounting table with a camera unit 17 comprising an optical system 18 and an imaging portion 19; processing images picked up; making position adjustment of the electric part and the resin substrate by moving the substrate mounting table; and pressure welding the electric part to the resin substrate. In a more detail, the bonding method comprises the following processes: an electric part travelling process to a first predetermined position; a resin substrate transferred process to a second predetermined position; a holding process of the resin substrate on a substrate mounting table; an imaging process of the electric part and the resin substrate with a camera unit 17 in which a thickness of an optical system 18 is thinner than that of an imaging portion 19; a camera unit 17 evacuating process from the image taking position; a pressure welding process for connecting the electric part to the resin substrate; and a process of keeping the resin substrate held on the substrate mounting table away from the substrate mounting table.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够提高电子部件的振动头与COF带之间的位置调整精度的接合方法。解决方案：该接合方法包括以下步骤：利用包括光学系统18和成像部分的相机单元17同时拍摄由振动头和保持在基板安装台上的树脂基板保持的电气部件的图像 19; 处理图像拾起; 通过移动基板安装台来对电气部件和树脂基板进行位置调整; 并将电气部件压接在树脂基板上。更详细地说，接合方法包括以下处理：将电子部件行进处理到第一预定位置; 将树脂基板转印到第二预定位置; 树脂基板在基板安装台上的保持过程; 具有照相机单元17的电气部件和树脂基板的成像处理，其中光学系统18的厚度比成像部分19的厚度薄; 相机单元17从图像拍摄位置排除处理; 用于将电气部件连接到树脂基板的压接工序; 以及保持树脂基板保持在基板安装台上远离基板安装台的过程。版权所有（C）2007，JPO＆INPIT

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