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1. 发明专利

JP2020092220A 導電性ボール検査リペア装置审中-公开
公开(公告)号：JP2020092220A
公开(公告)日：2020-06-11
申请号：JP2018229697
申请日：2018-12-07
申请人： ATHLETE FA KK
发明人： NAITO KENJI , KAWAKAMI TOMOKI
IPC分类号： H01L21/60 , H05K3/34
摘要：【課題】オペレーターが、少なくともリペア装置が修正する箇所を、視認できる。【解決手段】この発明は、検査装置2と、リペア装置3と、撮像装置4と、表示装置5と、を備える。撮像装置4は、リペア装置3に対して、オペレーターが位置する側に、配置されている。表示装置5は、表示装置5をZ方向に移動調整できかつZ軸回りに回動調整できる保持部50により、保持されている。この結果、この発明は、オペレーターが、少なくともリペア装置3が修正する箇所を、視認できる。【選択図】図1

2. 发明专利

JP2019004114A ボール供給装置及びボール搭載装置审中-公开
公开(公告)号：JP2019004114A
公开(公告)日：2019-01-10
申请号：JP2017119803
申请日：2017-06-19
申请人： ATHLETE FA KK
发明人： KOTAKE TOSHIYUKI , KOMATSU TAKAHIRO , NAGATA SEIJI
IPC分类号： H01L21/60
摘要：【課題】ボール搭載装置を停止させずにボール搭載装置へのボール供給が可能で、ボール表面に損傷を与えず、過不足なくボールを基板に搭載することが可能なボール供給装置及びボール搭載装置を提供すること。【解決手段】ボール供給装置10は、ボール搭載装置50から離れた位置に配置され、ボールタンク12と、ボール振込ヘッドユニット64A,64Bにボール11を供給するボール供給ノズル13と、ボールタンク12とボール供給ノズル13とを接続するボール移送用チューブ14と、圧縮気体によってボールタンク12からボール供給ノズル13にボール11を圧送し、圧送停止時にボール移送経路を常圧に高速で減圧する。ボール振込ヘッドユニット64A,64Bからのボール供給命令に基づき所定量のボール11を圧送するボール供給装置10、及びボール供給装置10からボールを供給されるボール搭載装置。【選択図】図3

3. 发明专利

JP2014030036A Method for mounting conductive ball on substrate 有权
标题翻译：在基板上安装导电球的方法
公开(公告)号：JP2014030036A
公开(公告)日：2014-02-13
申请号：JP2013190388
申请日：2013-09-13
申请人： Athlete Fa Kk , アスリートFa株式会社
发明人： ASANO KUNIKAZU , YAZAWA ICHIRO , TANIKAI TADASHI
IPC分类号： H05K3/34 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a method in which conductive balls are mounted on a substrate by a device for filling the conductive balls in a plurality of openings of a mask and a mounting period of time of the conductive balls can be shortened.SOLUTION: In a method for mounting conductive balls on a substrate, a plurality of heads are set so that in a forward route, a plurality of movement areas A1-A4 pass through a first opening group array 121 including several opening groups M arranged successively in the reciprocating direction, and in a backward route, the plurality of movement areas A1-A4 pass through a second opening group array 122 adjacent to the first opening group array 121 without overlapping with the forward route, and the movement areas A1-A4 are reciprocatingly moved to fill the conductive balls into openings.
摘要翻译：要解决的问题：提供一种通过用于在导电球的多个开口中填充导电球的装置将导电球安装在基板上的方法，并且可以缩短导电球的安装时间。解决方案：在将导电球安装在基板上的方法中，设置多个头部，使得在前进路径中，多个移动区域A1-A4穿过包括几个开口组M的第一开口组阵列，方向，并且在向后路径中，多个移动区域A1-A4通过与第一开口组阵列121相邻的第二开口组阵列122，而不与前向路线重叠，并且移动区域A1-A4往复移动到将导电球填充入开口。

4. 发明专利

JP2012134189A Heating apparatus and heating method 有权
标题翻译：加热装置和加热方法
公开(公告)号：JP2012134189A
公开(公告)日：2012-07-12
申请号：JP2010272372
申请日：2010-12-07
申请人： Athlete Fa Kk , アスリートFa株式会社
发明人： YAZAWA ICHIRO
IPC分类号： H05K3/34 , B23K1/008 , B23K1/06 , B23K31/02 , B23K101/42
摘要： PROBLEM TO BE SOLVED: To prevent a decrease in strength of soldering when an area to be soldered becomes small and an amount of flux is reduced, and to prevent occurrence of a soldering defect caused by reduction in size of a solder bump and warpage of a substrate.SOLUTION: A heating method includes: making the size of an area of an ultrasonic horn which mounts a substrate and performs solder reflow equal to or larger than the area of the substrate, sucking and fixing the substrate to the ultrasonic horn, and melting the solder while applying an ultrasonic vibration on the substrate in a thickness direction of the substrate. A conveyance arm method is used for conveying the substrate, the difference between a temperature of the substrate and temperatures of a pre-heating base, a heating base and a cooling base is reduced, and then the substrate is mounted on the pre-heating base, the heating base and the cooling base. Accordingly the warpage of the substrate is prevented.
摘要翻译：要解决的问题：为了防止当焊接区域变小并且焊剂量减少时焊接强度的降低，并且防止由焊料凸块的尺寸减小引起的焊接缺陷的发生，以及基板翘曲。解决方案：一种加热方法包括：使安装基板的超声波喇叭的面积大小，并进行等于或大于基板面积的回流焊，将基板吸附固定在超声波喇叭上，以及在衬底的厚度方向上对衬底施加超声波振动的同时熔化焊料。使用输送臂方法输送基板，降低基板的温度与预热基座，加热基座和冷却基座的温度之间的差异，然后将基板安装在预热基座，加热基座和冷却基座。因此，防止了基板的翘曲。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2009170688A Stage and ball mounting device using it 有权
标题翻译：使用它的阶段和球安装设备
公开(公告)号：JP2009170688A
公开(公告)日：2009-07-30
申请号：JP2008007750
申请日：2008-01-17
申请人： Athlete Fa Kk , アスリートFa株式会社
发明人： KAWAKAMI SHIGEAKI , TANIKAI TADASHI , KOTAKE TOSHIYUKI , ASANO KUNIKAZU , YAZAWA ICHIRO
IPC分类号： H01L21/60
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a stage capable of mounting and transferring a substrate and then overlaying a mask on the substrate in a good condition.
SOLUTION: This device includes: a substrate supporting table 42 having a substrate supporting surface 41 supporting a substrate; a first driving mechanism 44 vertically moving the substrate supporting table 42; a frame 52 which has an upper end surface 51 positioned at the periphery of the substrate supporting surface 41 and has a profile of rectangular form; and a second driving mechanism 54 vertically moving the frame 52. A thin plate-like mask is fixed above the place of moving end of a stage 10. A plurality of first suction holes 58, suction-adsorbing the mask when the frame 52 is moved upward with the second driving mechanism 54 under the mask and the upper end surface 51 is brought into contact with the mask, are provided along a pair of facing sides of the upper end surface 51 of the frame 52.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够安装和转移衬底，然后在良好状态下将掩模重叠在衬底上的阶段。解决方案：该装置包括：基板支撑台42，具有支撑基板的基板支撑表面41; 垂直移动基板支撑台42的第一驱动机构44; 框架52，其具有位于基板支撑表面41的周边的上端面51，并且具有矩形的轮廓; 以及垂直移动框架52的第二驱动机构54.薄板状掩模固定在台架10的移动端的位置上方。多个第一抽吸孔58，当框架52移动时吸附 - 掩模向上与掩模下方的第二驱动机构54和上端面51与掩模接触，沿着框架52的上端表面51的一对相对侧设置。版权所有（C））2009，JPO＆INPIT

6. 发明专利

JP2009141174A Ball loading method and ball loading apparatus 有权
标题翻译：球装载方法和球装载装置
公开(公告)号：JP2009141174A
公开(公告)日：2009-06-25
申请号：JP2007316744
申请日：2007-12-07
申请人： Athlete Fa Kk , アスリートFa株式会社
发明人： NAITO KENJI
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a ball loading method capable of suppressing occurrence of surplus ball phenomenon at a sucking head even if the number of sucking holes formed on the sucking head is large. SOLUTION: A ball loading apparatus 1 comprises a sucking head 8 where a plurality of sucking holes for sucking a ball 2 are formed, and a housing container 15 in which a plurality of balls 2 are housed before sucked into the plurality of sucking holes. The ball loading method which uses the ball loading apparatus to load the plurality of balls 2 sucked into the plurality of sucking holes on a substrate 3 includes an initial ball amount setting process which sets the number of balls 2 in the housing container 15 so that the number of balls 2 in the housing container 15 comes to be less than the number of sucking holes of the sucking head 8, a ball sucking process in which, after the initial ball amount setting process, the balls 2 are allowed to be sucked into the sucking holes while the balls 2 are supplied to the housing container 15, and a ball loading process in which, after the ball sucking process, the plurality of balls 2 sucked into the plurality of sucking holes are loaded on the substrate 3. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：即使在吸头上形成的吸入孔的数量大的情况下，也能够提供能够抑制吸头的剩余球现象发生的球装载方法。解决方案：球装载装置1包括：吸头8，其中形成有用于吸入球2的多个吸孔;以及容纳容器15，其中多个球2在吸入多个吸入之前被容纳孔。使用滚珠加载装置对被吸附在基板3上的多个吸孔中的多个滚珠2进行加载的滚珠加载方法包括初始球量设定处理，其将容纳容器15内的滚珠数2设定为使得容纳容器15中的球2的数量小于吸头8的吸入孔的数量，在初始球量设定处理之后，允许将球2吸入在将球2供给到容纳容器15的同时，将吸入孔，并且在将吸引多个吸引孔的多个滚珠2装载到基板3上之后，进行滚珠吸附处理。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2009071332A Apparatus for mounting a conductive ball 审中-公开
标题翻译：安装导电棒的装置
公开(公告)号：JP2009071332A
公开(公告)日：2009-04-02
申请号：JP2008318153
申请日：2008-12-15
申请人： Athlete Fa Kk , アスリートFa株式会社
发明人： NEHASHI TORU , KAWAKAMI SHIGEAKI
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide an apparatus of manufacturing a work with sufficient yield, having particles like conductive balls such as a solder ball, a gold ball, or a copper ball, used in mounting of a semiconductor device or an optical device, arranged with high reliability on a work such as a wafer in accordance with a desired pattern. SOLUTION: A ball mounter 1 for arranging conductive balls on a work 10 has a table 23 on which the work 10 is mounted, to be carried in an X-direction; and a print unit 26 and a ball mounting unit 27 arranged along the X-direction in which the table 23 is moved. The print unit 26 prints flux on the work 10 mounted on the table 23, through a mask for print, and the conductive balls are arranged by the ball mounting unit 27, on the work 10 mounted on the table 23 via a mask for mounting balls. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种以足够的产量制造工件的装置，具有用于安装半导体器件或光学器件的诸如焊球，金球或铜球等导电球的颗粒器件，按照期望的图案在诸如晶片的工件上高度可靠地布置。解决方案：用于在工件10上布置导电球的滚珠安装机1具有安装工件10的工作台23，以在X方向上承载; 以及沿台架23移动的X方向配置的打印单元26和球安装单元27。打印单元26通过用于打印的掩模在安装在台23上的工件10上打印通量，并且导电球通过球安装单元27布置在安装在桌子23上的工件10上，用于安装球。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2009032841A Method of mounting conductive ball on substrate 有权
标题翻译：导电柱安装在基板上的方法
公开(公告)号：JP2009032841A
公开(公告)日：2009-02-12
申请号：JP2007194097
申请日：2007-07-26
申请人： Athlete Fa Kk , アスリートFa株式会社
发明人： YAZAWA ICHIRO
IPC分类号： H01L21/60 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a method of mounting conductive balls on a substrate by a device for charging the conductive balls in a plurality of openings of a mask, the method capable of shortening the time needed to mount the conductive balls on one substrate. SOLUTION: The method includes moving a movement area A1 so that at least a part of a track T1 thereof overlaps in a plurality of charging areas D each including several opening groups M arrayed in series and provided in parallel to one another, and moving the movement area A1 through a connection area Dc between mutually adjacent charging areas D so that non-charging areas Dn through which the movement area A1 does not pass are formed between the mutually adjacent charging areas D. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种通过用于在掩模的多个开口中对导电球充电的装置将导电球安装在基板上的方法，该方法能够缩短将导电球安装所需的时间一个底物。解决方案：该方法包括移动移动区域A1，使得其轨道T1的至少一部分在多个充电区域D中重叠，每个充电区域D包括串联排列并且彼此平行设置的多个开放组M，以及通过相互相邻的充电区域D之间的连接区域Dc移动移动区域A1，使得相邻的充电区域D之间形成有移动区域A1不通过的非充电区域Dn。（C） 2009年，JPO＆INPIT

9. 发明专利

JP2008227118A Mounting device and its control method 有权
标题翻译：安装设备及其控制方法
公开(公告)号：JP2008227118A
公开(公告)日：2008-09-25
申请号：JP2007062769
申请日：2007-03-13
申请人： Athlete Fa Kk , アスリートFa株式会社
发明人： NAGATA SEIJI , ASANO KUNIKAZU , KOTAKE TOSHIYUKI
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a mounting device that highly accurately mounts balls onto a workpiece. SOLUTION: The mounting device has a base 2, a mask holder 22 for holding a mask 21 at a first position with respect to the base 2, a transfer stage 3 capable of moving a workpiece 90 to a prescribed position with respect to the base 2, first cameras 51a, 51b that detect a reference mark of the workpiece 90 in a state of being mounted on the transfer stage 3 so as to record the position of the workpiece 90 with respect to the transfer stage 3 as a workpiece reference position in a memory, a second camera 52 that acquires an image of each electrode, facing each minute opening, of the workpiece 90 via each minute opening of the mask 21 from above the mask 21 held by the mask holder 22, ball dispensers 23a, 23b for filling each ball Be into each minute opening of the mask 21 from above the mask 21 held by the mask holder 22, and a control unit capable of controlling a moving destination of the transfer stage 3. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种将球高精度地安装在工件上的安装装置。
解决方案：安装装置具有基座2，用于将掩模21相对于基座2保持在第一位置的掩模支架22，能够将工件90相对于基座2移动到规定位置的转印台3 基座2，第一相机51a，51b，其以安装在转印台3上的状态检测工件90的基准标记，以便将工件90相对于转印台3的位置记录为工件基准位于存储器中的第二相机52，通过由掩模保持器22保持的掩模21上的面罩21的上方，从掩模21的每个微小开口获取工件90面对每个微小开口的每个电极的图像的第二相机52， 23b用于将每个球填充到由掩模保持器22保持的掩模21上方的掩模21的每个分钟开口中，以及能够控制转印台3的移动目的地的控制单元。（C） 2008年，日本特许厅和INPIT

10. 发明专利

JP2008142775A Ball feeding device and ball depositing apparatus 审中-公开
标题翻译：球进料装置和球沉积装置
公开(公告)号：JP2008142775A
公开(公告)日：2008-06-26
申请号：JP2007308333
申请日：2007-11-29
申请人： Athlete Fa Kk , アスリートFa株式会社
发明人： KAWAKAMI SHIGEAKI , HAMA TETSUYA
IPC分类号： B23K3/06 , B23K101/42 , H01L21/60 , H01L23/12 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a ball feeding device for a ball forming a solder bump in a semiconductor wafer and an electronic circuit substrate, and to provide a ball depositing apparatus using the same.
SOLUTION: Regarding the ball feeding method, a ball feeding device 10 is rotated by 180°, and thereafter, the ball feeding device 10 is reversed and is returned to the original state, thus balls 20 are weighed, and are exhausted. The ball feeding device 10 is composed of: a ball weighing cavity 27 formed on one side of two plates; a ball separation/storage cavity 29; and a passage allowing them to communicate with each other. The ball depositing apparatus deposits the balls 20 fed from the ball feeding device 10 onto a substrate via the opening of a mask.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种在半导体晶片和电子电路基板中形成焊料凸块的球的送球装置，并提供使用该球的投球装置。＆lt; P＆gt;解决方案：关于送球方式，将送球装置10旋转180°，然后使球进给装置10反转回到初始状态，称重球20。球喂入装置10包括：形成在两个板的一侧的球体腔27; 球分离/储存腔29; 以及让他们相互沟通的通道。球沉积装置通过打开掩模将从喂球装置10进给的球20沉积到基底上。版权所有（C）2008，JPO＆INPIT

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