专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2004222441A Method for manufacturing metal strip for commutator 审中-公开
公开(公告)号：JP2004222441A
公开(公告)日：2004-08-05
申请号：JP2003008203
申请日：2003-01-16
申请人： Asmo Co Ltd , Hitachi Cable Ltd , アスモ株式会社 , 日立電線株式会社
发明人： MORIAI HIDESUMI , HAGIWARA NOBORU , TERADA YUICHI , SUGANO KAZUNOBU
IPC分类号： H01R39/04 , H01R43/08 , H02K13/00
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a metal strip for a commutator capable of effectively and easily manufacturing the metal strip having a projection with its tip swollen.
SOLUTION: A projection 16 having a recess 17 at its top is formed into the metal strip 15 by using a grooved roll 11 formed with a protrusion 13 at the bottom of a groove 12, and the tip side 20 of the projection 16 is protruded outwardly by crushing the top of the projection 16 by roll 18, to manufacture the metal strip for the resin-molded commutator having the projection 16 with its tip 21 swollen.
COPYRIGHT: (C)2004,JPO&NCIPI

2. 发明专利

JP2004216434A Manufacturing method of metal bar for commutator 审中-公开
公开(公告)号：JP2004216434A
公开(公告)日：2004-08-05
申请号：JP2003008202
申请日：2003-01-16
申请人： Asmo Co Ltd , Hitachi Cable Ltd , アスモ株式会社 , 日立電線株式会社
发明人： MORIAI HIDESUMI , HAGIWARA NOBORU , TERADA YUICHI , SUGANO KAZUNOBU
IPC分类号： B21B1/08 , B21B27/02 , B21H8/00 , B21H8/02
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a metal bar for a commutator which can efficiently manufacture the metal bar having a projected part with a bulged tip and facilitates smooth release of the metal bar from a grooved roll.
SOLUTION: The projected part 16 with a recessed portion 17 on the top is formed on the metal bar 15 by employing the grooved roll 11 having a protrusion 13 on the bottom of the groove 12, whose width w becomes narrower toward the bottom of the groove 12. Then. the top of the projected part 16 is crushed by the roll 18 so that the side portion 20 of the top of the projected part 16 is extruded outward. In this way the metal bar for the commutator having the projected part 16 with the bulged portion 21 on the top is manufactured.
COPYRIGHT: (C)2004,JPO&NCIPI

3. 发明专利

JP2012122094A Copper alloy material for electric and electronic component 审中-公开
标题翻译：电力电子元器件铜合金材料
公开(公告)号：JP2012122094A
公开(公告)日：2012-06-28
申请号：JP2010273453
申请日：2010-12-08
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： YAMAMOTO YOSHINORI , HAGIWARA NOBORU
IPC分类号： C22C9/04 , C22C9/00 , C22C9/06 , H01B1/02
摘要： PROBLEM TO BE SOLVED: To provide a copper alloy material for electric and electronic components that stably suppresses growth of an intermetallic compound and increases reliability of solder joining.SOLUTION: The copper alloy material for electric and electronic components contains one of or both of Fe and Co in total 0.3-1 mass% and also contains 0.1-0.3 mass% of P, 0.15-3 mass% of Zn, and 0.02-0.3 mass% of Sn, and the remainder includes Cu and inevitable impurities. The mass ratios of the components have the following relations: (Fe+Co)/P=(3 to 10), Zn/(Fe+Co)≥0.5, and Sn/(Fe+Co)≤0.5.
摘要翻译：解决的问题：提供稳定抑制金属间化合物生长的电气电子部件用铜合金材料，提高焊接接合的可靠性。解决方案：用于电气和电子部件的铜合金材料含有总计为0.3-1质量％的Fe和Co中的一种或两种，并且还含有0.1-0.3质量％的P，0.15-3质量％的Zn，以及 0.02〜0.3质量％的Sn，余量包括Cu和不可避免的杂质。组分的质量比具有以下关系：（Fe + Co）/ P =（3〜10），Zn /（Fe + Co）≥0.5，Sn /（Fe + Co）≤0.5。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2012117124A Rolled copper foil 有权
标题翻译：卷绕铜箔
公开(公告)号：JP2012117124A
公开(公告)日：2012-06-21
申请号：JP2010268945
申请日：2010-12-02
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： MUROGA TAKEMI , SEKI SOSHI , HAGIWARA NOBORU
IPC分类号： C22C9/00 , B21B3/00 , C22C9/01 , C22C9/06 , H01B1/02 , H01B5/02
摘要： PROBLEM TO BE SOLVED: To provide a rolled copper foil which can exert stable, excellent properties for a bending fatigue life even after application of heat treatment in a range of wide temperature conditions.SOLUTION: The rolled copper foil includes: copper (Cu) as the main component with inevitable impurities; titanium (Ti); silver (Ag); and one or more kinds of additive elements selected from an elemental group excluding copper (Cu) and silver (Ag), which has a face-centered cubic crystal structure, and also has the value of stacking fault energy higher than that of copper (Cu).
摘要翻译：要解决的问题：即使在宽温度范围内进行热处理之后，也可以提供即使在热处理后也能发挥稳定，优异的弯曲疲劳寿命性能的轧制铜箔。解决方案：轧制铜箔包括：铜（Cu）作为主要成分，具有不可避免的杂质; 钛（Ti）; 银（Ag）; 以及选自除了铜（Cu）和银（Ag）的元素基以外的具有面心立方晶体结构的一种或多种添加元素，并且还具有比铜（Cu ）。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2012001780A Copper alloy material for electric/electronic component, and method of manufacturing the same 审中-公开
标题翻译：电/电子元件用铜合金材料及其制造方法
公开(公告)号：JP2012001780A
公开(公告)日：2012-01-05
申请号：JP2010139248
申请日：2010-06-18
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： YAMAMOTO YOSHINORI , HAGIWARA NOBORU
IPC分类号： C22C9/00 , C22C9/02 , C22C9/04 , C22C9/06 , C22F1/00 , C22F1/08 , H01B1/02
摘要： PROBLEM TO BE SOLVED: To provide a copper alloy material for an electric/electronic component having high strength and high conductivity and capable of securing a uniform etching property even in half etching, and to provide a method of manufacturing the same.SOLUTION: There is provided the copper alloy material including a copper alloy containing either Fe or Co, or both of Fe and Co of 0.1-1.0 mass% in total, and containing 0.02-0.3 mass% of P, wherein a mass ratio (Fe+Co)/P of the total of Fe and Co to P is 3-10, and having a residual part constituted of Cu and unavoidable impurities, wherein the ratio of the number of crystallized products and deposits each having a particle size of ≥100 nm among crystallized products and deposits each having a particle size of ≥10 nm in the copper alloy is ≤1.0%.
摘要翻译：解决的问题：提供一种具有高强度和高导电性的电气/电子部件的铜合金材料，并且即使在半蚀刻中也能够确保均匀的蚀刻性能，并提供其制造方法。解决方案：提供铜合金材料，其包含Fe或Co，或总共为0.1-1.0质量％的Fe和Co两者的铜合金，并且含有0.02-0.3质量％的P，其中质量 Fe和Co与P的总量的比（Fe + Co）/ P为3-10，并且具有由Cu和不可避免的杂质构成的残留部分，其中每个具有粒径的结晶产物和沉积物的数量在铜合金中，结晶化物和粒径≥10nm的沉积物中≥100nm的厚度≤1.0％。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2010248592A Method for producing copper alloy and copper alloy 有权
标题翻译：生产铜合金和铜合金的方法
公开(公告)号：JP2010248592A
公开(公告)日：2010-11-04
申请号：JP2009101298
申请日：2009-04-17
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： YAMAMOTO YOSHINORI , HAGIWARA NOBORU
IPC分类号： C22F1/08 , B21B1/22 , B21B3/00 , C22C9/00 , C22C9/02 , C22C9/04 , C22C9/10 , C22F1/00 , H01B1/02 , H01B5/02
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a copper alloy which has the electric conductivity, strength and bendability, which are higher than those of the conventional copper alloy, and which is excellent in stress relaxation resistance and to provide the copper alloy. SOLUTION: The method for producing the copper alloy contains: a raw material preparation step of preparing a copper alloy containing metallic elements; a casting step of melting the copper alloy containing metallic elements to cast an ingot; a plate-like member formation step of forming a plate-like member from the ingot; a cold rolling step of cold-rolling the plate-like member to form a first metal plate; a first heat treatment step of heat-treating the first metal plate to form a fist heat-treated metal plate; a rolling step of cold-rolling the fist heat-treated metal plate by the machining degree predetermined per one pass to form a second metal plate; and a second heat treatment step of heat-treating the second metal plate while imparting tension to the second metal plate. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有比常规铜合金高的导电性，强度和弯曲性的铜合金的制造方法，其耐应力松弛性优异，并且提供铜合金。解决方案：铜合金的制造方法包括：制备含有金属元素的铜合金的原料制备步骤; 熔化包含金属元素的铜合金铸造锭的铸造步骤; 从所述锭形成板状构件的板状构件形成工序; 冷轧所述板状构件以形成第一金属板的冷轧步骤; 对第一金属板进行热处理以形成第一热处理金属板的第一热处理步骤; 轧制步骤，通过每一次预定的加工程度对第一热处理金属板进行冷轧，以形成第二金属板; 以及第二热处理步骤，在对第二金属板施加张力的同时对第二金属板进行热处理。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2010202946A Copper alloy material and method for producing copper alloy material 有权
标题翻译：铜合金材料和生产铜合金材料的方法
公开(公告)号：JP2010202946A
公开(公告)日：2010-09-16
申请号：JP2009051563
申请日：2009-03-05
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： MUROGA TAKEMI , HAGIWARA NOBORU , YAMAMOTO YOSHINORI
IPC分类号： C22C9/06 , C22C9/00 , C22C9/02 , C22C9/04 , C22F1/00 , C22F1/08 , H01B1/02
CPC分类号： C22C9/06 , C22C9/04 , C22F1/08
摘要： PROBLEM TO BE SOLVED: To provide a copper alloy material which has high strength, high proof stress, high conductivity and satisfactory bending workability.
SOLUTION: The copper alloy material is provided with rolled faces, and the rolled faces have a plurality of crystal planes parallel to the rolled faces. The plurality of crystal planes include at least one crystal plane selected from the group consisting of the {011} plane, the {1nn} plane (wherein, n is the integer of ≥1), the {11m} plane (wherein, m is the integer of ≥1), the {023} plane, the {012} plane and the {135} plane. In the rolled faces, in a reverse pole figure obtained by crystal diffraction measurement for the rolled faces with the rolled faces as standards, the diffraction intensity in the reverse pole figure of the plurality of rolled faces satisfies the relations of the {011} plane>{155} plane>{133} plane, also, the {011} plane>{023} plane>{012} plane, and also, the {011} plane>{135} plane>{112} plane.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供具有高强度，高应力，高导电性和令人满意的弯曲加工性的铜合金材料。解决方案：铜合金材料设置有轧制面，轧制面具有与轧制面平行的多个晶面。多个晶面包括至少一个选自ä011}平面，ä1nn}面（其中，n为≥1的整数）的晶面，ä11m}面（其中，m为 ≥1），ä023}平面，ä012}平面和ä135}平面。在轧制面中，在以轧制面作为标准的轧制面的晶体衍射测定得到的反极图中，多个轧制面的反极图中的衍射强度满足ä011}面>ä155的关系平面>ä133}平面，ä011}平面>ä023}平面>ä012}平面，以及ä011}平面>ä135}平面>ä112}平面。版权所有（C）2010，JPO＆INPIT

8. 发明专利

JP2009132965A Copper alloy material for electrical and electronic parts 有权
标题翻译：铜合金材料电气和电子部件
公开(公告)号：JP2009132965A
公开(公告)日：2009-06-18
申请号：JP2007309651
申请日：2007-11-30
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： YAMAMOTO YOSHINORI , HAGIWARA NOBORU , FUYU KEIHEI
IPC分类号： C22C9/00 , C22F1/00 , C22F1/08 , H01B1/02 , H01B5/02
摘要： PROBLEM TO BE SOLVED: To provide a copper alloy material for electrical and electronic parts which combines high electric conductivity, stress relaxation resistance and bendability.
SOLUTION: This alloy material is a Cu-Cr-Zr based copper alloy material for electrical and electronic parts characterized in that: it has an alloy composition consisting of, by mass, 0.1 to 0.4% Cr, 0.02 to 0.2% Zr and the balance Cu with inevitable impurities; orientation distribution density of Brass orientation in the texture of the alloy is ≤20; and the sum of the respective orientation distribution densities of Brass orientation, S orientation and Copper orientation ranges from 10 to 50.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种结合高导电性，耐应力松弛性和弯曲性的电气和电子部件的铜合金材料。解决方案：该合金材料是用于电气和电子部件的Cu-Cr-Zr基铜合金材料，其特征在于：其具有以质量计含有0.1至0.4％的Cr，0.02至0.2％的Zr 余量为Cu与不可避免的杂质; 合金质地中黄铜取向的取向分布密度≤20; 黄铜取向，S取向和铜取向的取向分布密度的总和为10〜50。（C）2009，JPO＆INPIT

9. 发明专利

JP2013057110A Method for producing copper alloy for electric and electronic part 有权
标题翻译：用于生产电气和电子部件的铜合金的方法
公开(公告)号：JP2013057110A
公开(公告)日：2013-03-28
申请号：JP2011196939
申请日：2011-09-09
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： KUJI TOMOYA , HAGIWARA NOBORU
IPC分类号： C22F1/08 , C22C9/00 , C22F1/00 , H01R13/03
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a copper alloy for electric and electronic parts which satisfies required characteristics, such as strength, electric conductivity, and heat resistance, of CDA Alloy194 used for a lead frame and the like, and which further shortens the production method.SOLUTION: After ingot which contains, in mass, 1.8-2.6% of Fe, 0.01-0.15% of P, and 0.005-0.2% of Zn, with the balance comprising Cu and unavoidable impurities is subjected to hot rolling, the ingot is processed until a desired sheet thickness is obtained by being sequentially subjected to the steps of the first cold rolling, the first heat treatment, the second cold rolling, the second heat treatment, the third cold rolling, and the third heat treatment. The first annealing in the second heat treatment is performed by the annealing at a temperature of T°C included in a temperature range of 650-750°C for a time of t minutes which is obtained when tobtained from the following formula is multiplied by 1-5, and the degree of processing of the third cold rolling is 70-85%. t1=(T+273)/{1.2×10*exp(-25,632/(T+273))}.
摘要翻译：解决的问题：为了提供一种满足用于引线框架等的CDA Alloy194等要求的强度，导电性和耐热性等特性的电气电子部件用铜合金的制造方法，进一步缩短生产方式。解决方案：将含有1.8-2.6％的Fe，0.01-0.15％的P和0.005-0.2％的Zn（余量包含Cu和不可避免的杂质）的锭进行热轧后，通过依次经受第一次冷轧，第一次热处理，第二次冷轧，第二次热处理，第三次冷轧和第三次热处理的步骤，直到获得所需的板厚。第二热处理中的第一退火是通过在包含在650-750℃的温度范围内的T℃的温度下退火t分钟来进行的，当t 1 乘以1-5，第三次冷轧的加工度为70-85％。 t1 =（T + 273）/ä1.2×10 14 * exp（-25,632 /（T + 273））}。版权所有（C）2013，JPO＆INPIT

10. 发明专利

JP2012117123A Rolled copper foil 有权
标题翻译：卷绕铜箔
公开(公告)号：JP2012117123A
公开(公告)日：2012-06-21
申请号：JP2010268944
申请日：2010-12-02
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： MUROGA TAKEMI , SEKI SOSHI , HAGIWARA NOBORU
IPC分类号： C22C9/00 , B21B3/00 , C22C9/01 , C22C9/06 , H01B5/02
摘要： PROBLEM TO BE SOLVED: To provide a rolled copper foil which can exert stable, excellent properties for a bending fatigue life even after application of heat treatment in the range of wide temperature conditions.SOLUTION: The rolled copper foil includes: copper (Cu) as the main component with inevitable impurities; boron (B); silver (Ag); and one or more kinds of additive elements selected from an elemental group excluding copper (Cu) and silver (Ag), which has a face-centered cubic crystal structure and also has the value of stacking fault energy higher than that of copper (Cu).

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式