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1. 发明申请

US20120305033A1 PARALLEL SINGLE SUBSTRATE MARANGONI MODULE 有权
标题翻译：并行单基板MARANGONI模块
公开(公告)号：US20120305033A1
公开(公告)日：2012-12-06
申请号：US13488329
申请日：2012-06-04
申请人： Arthur Keigler , Daniel L. Goodman , David G. Guarnaccia
发明人： Arthur Keigler , Daniel L. Goodman , David G. Guarnaccia
IPC分类号： B08B3/00
CPC分类号： H01L21/67757 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/67057 , H01L21/67173 , H01L21/6776 , H01L21/67781 , H01L21/68 , H01L21/68707
摘要： A substrate drying apparatus for drying a width of a surface of a substrate in a liquid. The substrate drying apparatus has a liquid tank containing the liquid. An injection nozzle is coupled to the liquid tank, the injection nozzle having a continuous knife edge injection surface across the width of the surface of the substrate. A drain is coupled to the injection nozzle, the drain having a continuous drain surface substantially parallel to the continuous knife edge injection surface and across the width of the surface of the substrate. The liquid forms a meniscus between the continuous drain surface and the width of the surface of the substrate. The injection nozzle directs a vapor at the meniscus.
摘要翻译：一种用于干燥液体中基底表面的宽度的基片干燥装置。基板干燥装置具有容纳液体的液体槽。注射喷嘴连接到液体罐，注射喷嘴具有穿过基底表面的宽度的连续刀刃注射表面。排水口连接到注射喷嘴，排水管具有基本上平行于连续的刀刃注入表面并跨过衬底的表面宽度的连续排水表面。液体在连续排水表面和基板表面的宽度之间形成弯液面。注射喷嘴在弯液面处引导蒸气。

2. 发明授权

US09508582B2 Parallel single substrate marangoni module 有权
标题翻译：平行单基质马兰戈尼模块
公开(公告)号：US09508582B2
公开(公告)日：2016-11-29
申请号：US13488329
申请日：2012-06-04
申请人： Arthur Keigler , Daniel L. Goodman , David G. Guarnaccia
发明人： Arthur Keigler , Daniel L. Goodman , David G. Guarnaccia
IPC分类号： H01L21/67 , H01L21/677 , H01L21/68 , H01L21/687
CPC分类号： H01L21/67757 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/67057 , H01L21/67173 , H01L21/6776 , H01L21/67781 , H01L21/68 , H01L21/68707
摘要： A substrate drying apparatus for drying a width of a surface of a substrate in a liquid. The substrate drying apparatus has a liquid tank containing the liquid. An injection nozzle is coupled to the liquid tank, the injection nozzle having a continuous knife edge injection surface across the width of the surface of the substrate. A drain is coupled to the injection nozzle, the drain having a continuous drain surface substantially parallel to the continuous knife edge injection surface and across the width of the surface of the substrate. The liquid forms a meniscus between the continuous drain surface and the width of the surface of the substrate. The injection nozzle directs a vapor at the meniscus.
摘要翻译：一种用于干燥液体中基底表面的宽度的基片干燥装置。基板干燥装置具有容纳液体的液体槽。注射喷嘴连接到液体罐，注射喷嘴具有穿过基底表面的宽度的连续刀刃注射表面。排水口连接到注射喷嘴，排水管具有基本上平行于连续的刀刃注入表面并穿过衬底的表面的宽度的连续排水表面。液体在连续排水表面和基板表面的宽度之间形成弯液面。注射喷嘴在弯液面处引导蒸气。

3. 发明申请

US20120305192A1 PARALLEL SINGLE SUBSTRATE PROCESSING FLUID JET MODULE 审中-公开
标题翻译：平行单基板加工流体喷射模块
公开(公告)号：US20120305192A1
公开(公告)日：2012-12-06
申请号：US13488354
申请日：2012-06-04
申请人： ARTHUR KEIGLER , Freeman Fisher , Daniel L. Goodman
发明人： ARTHUR KEIGLER , Freeman Fisher , Daniel L. Goodman
IPC分类号： B05B1/02 , B08B3/02 , C25D17/00
CPC分类号： H01L21/67757 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/67057 , H01L21/67173 , H01L21/6776 , H01L21/67781 , H01L21/68 , H01L21/68707
摘要： A system for fluid processing one or more substrate surfaces arrayed in a fluid. The system has a process module with a frame and a plurality of fluid jet elements to inject a fluid at the substrate surfaces without contacting the substrate surfaces. A substrate holder assembly has a holder frame and a number of substrate holders, each of which is coupled to the holder frame and configured to hold a substrate so that a different substrate is held by each substrate holder of the substrate holder assembly for transport therewith as a unit to and from the process module. The substrate holder assembly and each substrate holder of the substrate holder assembly are removably coupled to the process module frame and, when coupled to the process module frame, each substrate holder is independently moveable and positionable relative to the other substrate holders of the substrate holder assembly.
摘要翻译：一种用于流体处理排列在流体中的一个或多个衬底表面的系统。该系统具有一个具有框架和多个流体喷射元件的过程模块，以在衬底表面上注入流体而不接触衬底表面。衬底保持器组件具有保持器框架和多个衬底保持器，每个衬底保持器联接到保持器框架并且构造成保持衬底，使得不同的衬底由衬底保持器组件的每个衬底保持器保持以便作为来往和来自过程模块的单元。衬底保持器组件和衬底保持器组件的每个衬底保持器可移除地耦合到过程模块框架，并且当耦合到过程模块框架时，每个衬底保持器可独立地相对于衬底保持器组件的其他衬底保持器可移动和定位。

4. 发明申请

US20120305193A1 PARALLEL SINGLE SUBSTRATE PROCESSING AGITATION MODULE 审中-公开
标题翻译：并行单基板处理激励模块
公开(公告)号：US20120305193A1
公开(公告)日：2012-12-06
申请号：US13488416
申请日：2012-06-04
申请人： Arthur Keigler , Freeman Fisher , Daniel L. Goodman
发明人： Arthur Keigler , Freeman Fisher , Daniel L. Goodman
IPC分类号： B05C13/02 , B08B3/04 , C25D17/00
CPC分类号： H01L21/67757 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/67057 , H01L21/67173 , H01L21/6776 , H01L21/67781 , H01L21/68 , H01L21/68707
摘要： A system for fluid processing one or more substrate surfaces arrayed in a fluid. The system has a process module with a frame and a plurality of agitation members to fluid process the substrate surfaces without contacting the substrate surfaces. A substrate holder assembly has a holder frame and a number of substrate holders, each of which is coupled to the holder frame and configured to hold a substrate so that a different substrate is held by each substrate holder of the substrate holder assembly for transport therewith as a unit to and from the process module. The substrate holder assembly and each substrate holder of the substrate holder assembly are removably coupled to the process module frame and, when coupled to the process module frame, each substrate holder is independently moveable and positionable relative to the other substrate holders of the substrate holder assembly.
摘要翻译：一种用于流体处理排列在流体中的一个或多个衬底表面的系统。该系统具有一个具有框架和多个搅拌构件的过程模块，用于在不接触衬底表面的情况下流体地处理衬底表面。衬底保持器组件具有保持器框架和多个衬底保持器，每个衬底保持器联接到保持器框架并且构造成保持衬底，使得不同的衬底由衬底保持器组件的每个衬底保持器保持以便作为来往和来自过程模块的单元。衬底保持器组件和衬底保持器组件的每个衬底保持器可移除地联接到过程模块框架，并且当耦合到过程模块框架时，每个衬底保持器可独立地相对于衬底保持器组件的其他衬底保持器可移动和定位。

5. 发明授权

US09293356B2 Parallel single substrate processing system 有权
标题翻译：平行单基板加工系统
公开(公告)号：US09293356B2
公开(公告)日：2016-03-22
申请号：US13488343
申请日：2012-06-04
申请人： Arthur Keigler , Freeman Fisher , Daniel L. Goodman , Jonathan Haynes
发明人： Arthur Keigler , Freeman Fisher , Daniel L. Goodman , Jonathan Haynes
IPC分类号： B23Q1/25 , H01L21/677 , H01L21/67 , H01L21/68 , H01L21/687
CPC分类号： H01L21/67757 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/67057 , H01L21/67173 , H01L21/6776 , H01L21/67781 , H01L21/68 , H01L21/68707
摘要： A system for fluid processing substrate surfaces arrayed in a fluid having a process section with a frame having a plurality of process elements to process the substrate surfaces without contacting the substrate surfaces. A substrate holder assembly having a holder frame and a number of substrate holders, each of which is coupled to the holder frame and is configured for holding a substrate so that each substrate holder holds a different substrate for transport as a unit with the substrate holder assembly to and from the process section. The substrate holder assembly and each substrate holder are removably coupled to the process section frame, and the substrate holders of the substrate holder assembly are movable relative to the holder frame and positionable in repeatable alignment with respect to a predetermined feature of the process section and independent of positioning of the holder frame with respect to the process section.
摘要翻译：一种用于流体处理衬底表面的系统，其布置在具有工艺部分的流体中，所述工艺部分具有框架，所述框架具有多个处理元件，以处理所述衬底表面而不接触所述衬底表面。一种衬底保持器组件，其具有保持器框架和多个衬底保持器，每个衬底保持器联接到保持器框架并且构造成用于保持衬底，使得每个衬底保持器保持不同的衬底以作为与衬底保持器组件往返于过程部分。衬底保持器组件和每个衬底保持器可移除地联接到处理部分框架，并且衬底保持器组件的衬底保持器相对于保持器框架可移动并且可相对于工艺段的预定特征可重复地对准并且独立地保持框架相对于处理部分的定位。

6. 发明申请

US20120308345A1 PARALLEL SINGLE SUBSTRATE PROCESSING SYSTEM 有权
标题翻译：平行单基板加工系统
公开(公告)号：US20120308345A1
公开(公告)日：2012-12-06
申请号：US13488090
申请日：2012-06-04
申请人： Arthur Keigler , Freeman Fisher , Daniel L. Goodman
发明人： Arthur Keigler , Freeman Fisher , Daniel L. Goodman
IPC分类号： B65G49/00
CPC分类号： H01L21/67757 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/67057 , H01L21/67173 , H01L21/6776 , H01L21/67781 , H01L21/68 , H01L21/68707
摘要： A system for processing surfaces of substrates having a process module having a process module frame and a plurality of process elements to process the substrate surfaces without contacting the substrate surfaces. A plurality of substrate holder assemblies, each having a number of substrate holders, each of which is removably coupled to the process module frame, each substrate holder configured to hold a substrate. The process module frame has alignment features aligning the substrate holders in the substrate holder assembly in repeatable alignment with respect to each of the process elements with each of the process elements located between the substrates. A loader module is configured to unload processed substrates from each of the substrate holder assemblies and load unprocessed substrates to each of the substrate holder assemblies. A transporter is configured to transport the substrate holder assemblies to and from the process module and the loader module.
摘要翻译：一种用于处理具有处理模块的基板的表面的系统，该处理模块具有处理模块框架和多个处理元件，以在不接触基板表面的情况下处理基板表面。多个衬底保持器组件，每个衬底保持器组件具有多个衬底保持器，每个衬底保持器可移除地联接到过程模块框架，每个衬底保持器被构造成保持衬底。过程模块框架具有对准特征，其中衬底保持器组件中的衬底保持器相对于每个工艺元件可重复地对准，每个工艺元件位于衬底之间。装载器模块被配置为从每个基板保持器组件卸载经处理的基板，并且将未处理的基板装载到每个基板保持器组件。传送器构造成将基板保持器组件传送到过程模块和加载器模块。

7. 发明授权

US09449862B2 Parallel single substrate processing system 有权
标题翻译：平行单基板加工系统
公开(公告)号：US09449862B2
公开(公告)日：2016-09-20
申请号：US13488090
申请日：2012-06-04
申请人： Arthur Keigler , Freeman Fisher , Daniel L. Goodman
发明人： Arthur Keigler , Freeman Fisher , Daniel L. Goodman
IPC分类号： H01L21/67 , H01L21/677 , H01L21/68 , H01L21/687
CPC分类号： H01L21/67757 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/67057 , H01L21/67173 , H01L21/6776 , H01L21/67781 , H01L21/68 , H01L21/68707
摘要： A system for processing surfaces of substrates having a process module having a process module frame and a plurality of process elements to process the substrate surfaces without contacting the substrate surfaces. A plurality of substrate holder assemblies, each having a number of substrate holders, each of which is removably coupled to the process module frame, each substrate holder configured to hold a substrate. The process module frame has alignment features aligning the substrate holders in the substrate holder assembly in repeatable alignment with respect to each of the process elements with each of the process elements located between the substrates. A loader module is configured to unload processed substrates from each of the substrate holder assemblies and load unprocessed substrates to each of the substrate holder assemblies. A transporter is configured to transport the substrate holder assemblies to and from the process module and the loader module.
摘要翻译：一种用于处理具有处理模块的基板的表面的系统，该处理模块具有处理模块框架和多个处理元件，以在不接触基板表面的情况下处理基板表面。多个衬底保持器组件，每个衬底保持器组件具有多个衬底保持器，每个衬底保持器可移除地联接到过程模块框架，每个衬底保持器被构造成保持衬底。过程模块框架具有对准特征，其中衬底保持器组件中的衬底保持器相对于每个工艺元件可重复地对准，每个工艺元件位于衬底之间。装载器模块被配置为从每个基板保持器组件卸载经处理的基板，并且将未处理的基板装载到每个基板保持器组件。传送器构造成将基板保持器组件传送到过程模块和加载器模块。

8. 发明申请

US20120306137A1 PARALLEL SINGLE SUBSTRATE PROCESSING SYSTEM 有权
标题翻译：平行单基板加工系统
公开(公告)号：US20120306137A1
公开(公告)日：2012-12-06
申请号：US13488343
申请日：2012-06-04
申请人： Arthur Keigler , Freeman Fisher , Daniel L. Goodman , Jonathan Haynes
发明人： Arthur Keigler , Freeman Fisher , Daniel L. Goodman , Jonathan Haynes
IPC分类号： B23Q1/25
CPC分类号： H01L21/67757 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/67057 , H01L21/67173 , H01L21/6776 , H01L21/67781 , H01L21/68 , H01L21/68707
摘要： A system for fluid processing substrate surfaces arrayed in a fluid having a process section with a frame having a plurality of process elements to process the substrate surfaces without contacting the substrate surfaces. A substrate holder assembly having a holder frame and a number of substrate holders, each of which is coupled to the holder frame and is configured for holding a substrate so that each substrate holder holds a different substrate for transport as a unit with the substrate holder assembly to and from the process section. The substrate holder assembly and each substrate holder are removably coupled to the process section frame, and the substrate holders of the substrate holder assembly are movable relative to the holder frame and positionable in repeatable alignment with respect to a predetermined feature of the process section and independent of positioning of the holder frame with respect to the process section.
摘要翻译：一种用于流体处理衬底表面的系统，其布置在具有工艺部分的流体中，所述工艺部分具有框架，所述框架具有多个处理元件，以处理所述衬底表面而不接触所述衬底表面。一种衬底保持器组件，其具有保持器框架和多个衬底保持器，每个衬底保持器联接到保持器框架并且构造成用于保持衬底，使得每个衬底保持器保持不同的衬底以作为与衬底保持器组件往返于过程部分。衬底保持器组件和每个衬底保持器可移除地联接到处理部分框架，并且衬底保持器组件的衬底保持器相对于保持器框架可移动并且可相对于工艺段的预定特征可重复地对准并且独立地保持框架相对于处理部分的定位。

9. 发明授权

US5891292A Method of making fiber reinforced composites and coatings 失效
标题翻译：制造纤维增强复合材料和涂料的方法
公开(公告)号：US5891292A
公开(公告)日：1999-04-06
申请号：US692149
申请日：1996-08-05
申请人： Daniel L. Goodman , Guiseppe R. Palmese
发明人： Daniel L. Goodman , Guiseppe R. Palmese
IPC分类号： B32B7/12 , C08J5/24 , B32B31/00
CPC分类号： B32B7/12 , C08J5/24
摘要： The present invention describes materials and methods for forming radiation curable polymer network materials, including coatings, pre-pregs and fiber-reinforced composites. The polymer network materials of the present invention exhibit much lower shrinkage after radiation curing than previous materials and methods, improving the adhesion associated with coatings and pre-pregs, and part fit-up when used to make composite articles.The present invention also describes an improved method for bonding together articles made by the materials and method of the invention, which results in high-strength bonds between articles.
摘要翻译：本发明描述了用于形成可辐射固化的聚合物网络材料的材料和方法，包括涂层，预浸料和纤维增强复合材料。本发明的聚合物网络材料在辐射固化后表现出比以前的材料和方法低得多的收缩率，改善与涂层和预浸料相关的粘附性，以及当用于制造复合制品时的部分装配。本发明还描述了一种用于将由本发明的材料和方法制成的制品粘合在一起的改进方法，其导致制品之间的高强度粘合。

10. 发明授权

US6110318A System for selective electron beam irradiation 失效
公开(公告)号：US6110318A
公开(公告)日：2000-08-29
申请号：US979271
申请日：1997-11-26
申请人： Daniel L. Goodman
发明人： Daniel L. Goodman
IPC分类号： B29C35/08 , B29C65/00 , B29C65/14 , B32B31/28 , B29C71/04
CPC分类号： B29C65/14 , B29C35/08 , B29C65/1403 , B29C65/1435 , B29C65/1454 , B29C65/1483 , B29C65/4845 , B29C66/545 , B29C66/93431 , B29C66/93441 , B29C2035/0877 , B29C66/863 , B29C66/929 , B29C66/939 , B29C66/94 , H01J2237/20228 , H01J2237/31
摘要： Provided is the ability to selectively irradiate a designated irradiation target portion of a target material with a beam of electrons. Target material is moved at a substantially constant velocity in one direction along a path that is intersected by an electron beam. The electron beam is translated in a direction transverse to the direction of the target material movement to intersect the designated portion of the target. This enables the designated target portion, e.g., a target irradiation path, to be followed by the electron beam as the target material moves past the beam. Also provided is control of electron beam dose delivered to the designated irradiation target portion. Here, as a target material is moved along the path, the electron beam is also scanned in a direction parallel with the direction of target material movement to control the electron beam dwell time at points along the designated irradiation target portion, to deliver a specified electron beam dose to points along the designated portion of the target material. This scanning can control the electron beam dwell time to deliver a substantially uniform electron beam dose or to deliver an electron beam dose that falls within a specified range of allowable electron beam doses. Also provided is the ability to control the electron beam in response to feedback signals. Here the actual position of the electron beam intersection with the target is detected, and the electron beam translation is adjusted in response to the detected intersection position to maintain intersection of the electron beam with the designated portion of the target material. Additionally, the electron beam scanning can be adjusted in response to the detected intersection position to maintain delivery of the specified electron beam dose to the designated target portion. Preferably, sensors are positioned in a spaced relationship with the designated target portion, e.g., on the target material, in a configuration that defines the designated portion as a path between the sensors.

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