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    • 2. 发明授权
    • Graphite and/or graphene semiconductor devices
    • 石墨和/或石墨烯半导体器件
    • US08890277B2
    • 2014-11-18
    • US13577964
    • 2011-03-14
    • Arthur Foster HebardSefaattin Tongay
    • Arthur Foster HebardSefaattin Tongay
    • H01L29/47H01L29/812H01L29/778H01L29/872H01L29/16H01L29/20
    • H01L29/1606H01L29/1608H01L29/2003H01L29/47H01L29/475H01L29/7786H01L29/78H01L29/812H01L29/872
    • Various embodiments are provided for graphite and/or graphene based semiconductor devices. In one embodiment, a semiconductor device includes a semiconductor layer and a semimetal stack. In another embodiment, the semiconductor device includes a semiconductor layer and a zero gap semiconductor layer. The semimetal stack/zero gap semiconductor layer is formed on the semiconductor layer, which forms a Schottky barrier. In another embodiment, a semiconductor device includes first and second semiconductor layers and a semimetal stack. In another embodiment, a semiconductor device includes first and second semiconductor layers and a zero gap semiconductor layer. The first semiconductor layer includes a first semiconducting material and the second semi conductor layer includes a second semiconducting material formed on the first semiconductor layer. The semimetal stack/zero gap semiconductor layer is formed on the second semiconductor layer, which forms a Schottky barrier.
    • 提供了用于石墨和/或石墨烯的半导体器件的各种实施例。 在一个实施例中,半导体器件包括半导体层和半金属叠层。 在另一实施例中,半导体器件包括半导体层和零间隙半导体层。 半导体层/零间隙半导体层形成在形成肖特基势垒的半导体层上。 在另一个实施例中,半导体器件包括第一和第二半导体层以及半金属叠层。 在另一个实施例中,半导体器件包括第一和第二半导体层和零间隙半导体层。 第一半导体层包括第一半导体材料,第二半导体层包括在第一半导体层上形成的第二半导体材料。 在形成肖特基势垒的第二半导体层上形成半金属层/零间隙半导体层。