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1. 发明授权

US5986875A Puncture resistant electrostatic chuck 失效
标题翻译：耐刺穿静电卡盘
公开(公告)号：US5986875A
公开(公告)日：1999-11-16
申请号：US015802
申请日：1998-01-29
申请人： Arik Donde , Hyman J. Levinstein , Robert W. Wu , Andreas Hegedus , Edwin C. Weldon , Shamouil Shamouilian , Jon T. Clinton , Surinder S. Bedi
发明人： Arik Donde , Hyman J. Levinstein , Robert W. Wu , Andreas Hegedus , Edwin C. Weldon , Shamouil Shamouilian , Jon T. Clinton , Surinder S. Bedi
IPC分类号： B23Q3/15 , H01L21/683 , H02N13/00
CPC分类号： H01L21/6831 , H01L21/6833 , H02N13/00 , Y10T279/23
摘要： A puncture resistant electrostatic chuck (20) is described. The chuck (20) comprises at least one electrode (25); and a composite insulator (30) covering the electrode. The composite insulator comprises a matrix material having a conformal holding surface (50) capable of conforming to the substrate (35) under application of an electrostatic force generated by the electrode to reduce leakage of heat transfer fluid held between the substrate and the holding surface. A hard puncture resistant layer, such a layer of fibers or an aromatic polyamide layer, is positioned below the holding surface (50) and is sufficiently hard to increase the puncture resistance of the composite insulator.
摘要翻译：描述了一种抗穿刺静电卡盘（20）。卡盘（20）包括至少一个电极（25）; 和覆盖电极的复合绝缘体（30）。复合绝缘体包括具有能够在施加电极产生的静电力的同时保持基板（35）的共形保持表面（50）的基体材料，以减少保持在基板和保持表面之间的传热流体的泄漏。这种纤维层或芳香族聚酰胺层的耐穿刺层位于保持面（50）的下方，并且足够难以提高复合绝缘子的抗穿刺性。

2. 发明授权

US5729423A Puncture resistant electrostatic chuck 失效
公开(公告)号：US5729423A
公开(公告)日：1998-03-17
申请号：US755716
申请日：1996-11-25
申请人： Arik Donde , Hyman J. Levinstein , Robert W. Wu , Andreas Hegedus , Edwin C. Weldon , Shamouil Shamouilian , Jon T. Clinton , Surinder S. Bedi
发明人： Arik Donde , Hyman J. Levinstein , Robert W. Wu , Andreas Hegedus , Edwin C. Weldon , Shamouil Shamouilian , Jon T. Clinton , Surinder S. Bedi
IPC分类号： B23Q3/15 , H01L21/683 , H02N13/00
CPC分类号： H01L21/6831 , H01L21/6833 , H02N13/00 , Y10T279/23
摘要： A puncture resistant electrostatic chuck (20) is described. The chuck (20) comprises at least one electrode (25); and a composite insulator (30) covering the electrode. The composite insulator comprises a matrix material having a conformal holding surface (50) capable of conforming to the substrate (35) under application of an electrostatic force generated by the electrode to reduce leakage of heat transfer fluid held between the substrate and the holding surface. A hard puncture resistant layer, such a layer of fibers or an aromatic polyamide layer, is positioned below the holding surface (50) and is sufficiently hard to increase the puncture resistance of the composite insulator.

3. 发明授权

US06721162B2 Electrostatic chuck having composite dielectric layer and method of manufacture 有权
标题翻译：具有复合介电层的静电吸盘及其制造方法
公开(公告)号：US06721162B2
公开(公告)日：2004-04-13
申请号：US10095914
申请日：2002-03-12
申请人： Edwin C. Weldon , Kenneth S. Collins , Arik Donde , Brian Lue , Dan Maydan , Robert J. Steger , Timothy Dyer , Ananda H. Kumar , Alexander M. Veytser , Kadthala R. Narendrnath , Semyon L. Kats , Arnold Kholodenko , Shamouil Shamouilian , Dennis S. Grimard
发明人： Edwin C. Weldon , Kenneth S. Collins , Arik Donde , Brian Lue , Dan Maydan , Robert J. Steger , Timothy Dyer , Ananda H. Kumar , Alexander M. Veytser , Kadthala R. Narendrnath , Semyon L. Kats , Arnold Kholodenko , Shamouil Shamouilian , Dennis S. Grimard
IPC分类号： H02N1300
CPC分类号： H01J37/321 , C23C16/4586 , H01J2237/2001 , H01L21/6831 , H01L21/6833 , Y10T279/23
摘要： An electrostatic chuck has an electrode capable of being electrically charged to electrostatically hold a substrate. A composite layer covers the electrode. The composite layer comprises (1) a first dielectric material covering a central portion of the electrode, and (2) a second dielectric material covering a peripheral portion of the electrode, the second dielectric material having a different composition than the composition of the first dielectric material. The chuck is useful in a plasma process chamber to process substrates, such as semiconductor wafers.
摘要翻译：静电吸盘具有能够带电的电极，以静电保持基板。复合层覆盖电极。复合层包括（1）覆盖电极的中心部分的第一电介质材料，和（2）覆盖电极的周边部分的第二电介质材料，第二电介质材料的组成不同于第一电介质的组成材料。卡盘在等离子体处理室中可用于处理诸如半导体晶片的基板。

4. 发明授权

US6108189A Electrostatic chuck having improved gas conduits 失效
标题翻译：静电吸盘具有改进的气体导管
公开(公告)号：US6108189A
公开(公告)日：2000-08-22
申请号：US965690
申请日：1997-11-06
申请人： Edwin C. Weldon , Kenneth S. Collins , Arik Donde , Brian Lue , Dan Maydan , Robert J. Steger , Timothy Dyer , Ananda H. Kumar , Alexander M. Veytser , Kadthala R. Narendrnath , Semyon L. Kats , Arnold Kholodenko , Shamouil Shamouilian , Dennis S. Grimard
发明人： Edwin C. Weldon , Kenneth S. Collins , Arik Donde , Brian Lue , Dan Maydan , Robert J. Steger , Timothy Dyer , Ananda H. Kumar , Alexander M. Veytser , Kadthala R. Narendrnath , Semyon L. Kats , Arnold Kholodenko , Shamouil Shamouilian , Dennis S. Grimard
IPC分类号： B23Q3/15 , C23C16/458 , H01L21/683 , H02N13/00
CPC分类号： H01J37/321 , C23C16/4586 , H01L21/6831 , H01L21/6833 , H01J2237/2001 , Y10T279/23
摘要： An electrostatic chuck 100 useful for holding a substrate 55 in a high density plasma, comprises a dielectric covered electrode 110 having at least one heat transfer gas flow conduit 150 therein. An electrical isolator 200 comprising dielectric material is positioned in the gas flow conduit 150 to (i) electrically isolate the gas in the conduit from the plasma or electrode 110, and (ii) allow passage of heat transfer gas through the conduit. Preferably, the dielectric material comprises a plasma-deactivating material that has a high surface area that reduces plasma formation of gas passing through the conduit 150 in a plasma process. A semiconducting dielectric member 115 useful for rapidly charging and discharging electrostatic chucks is also described.
摘要翻译：用于将衬底55保持在高密度等离子体中的静电卡盘100包括其中具有至少一个传热气体流动管道150的电介质覆盖电极110。包括电介质材料的电隔离器200定位在气流导管150中以（i）将导管中的气体与等离子体或电极110电隔离，和（ii）允许传热气体通过导管。优选地，电介质材料包括具有高表面积的等离子体钝化材料，其在等离子体工艺中减少通过导管150的气体的等离子体形成。还描述了一种用于快速充放电静电卡盘的半导体电介质部件115。

5. 发明授权

US06414834B1 Dielectric covered electrostatic chuck 有权
标题翻译：介质覆盖静电卡盘
公开(公告)号：US06414834B1
公开(公告)日：2002-07-02
申请号：US09596108
申请日：2000-06-16
申请人： Edwin C. Weldon , Kenneth S. Collins , Arik Donde , Brian Lue , Dan Maydan , Robert J. Steger , Timothy Dyer , Ananda H. Kumar , Alexander M. Veytser , Kadthala R. Narendrnath , Semyon L. Kats , Arnold Kholodenko , Shamouil Shamouilian , Dennis S. Grimard
发明人： Edwin C. Weldon , Kenneth S. Collins , Arik Donde , Brian Lue , Dan Maydan , Robert J. Steger , Timothy Dyer , Ananda H. Kumar , Alexander M. Veytser , Kadthala R. Narendrnath , Semyon L. Kats , Arnold Kholodenko , Shamouil Shamouilian , Dennis S. Grimard
IPC分类号： H02N1300
CPC分类号： H01J37/321 , C23C16/4586 , H01J2237/2001 , H01L21/6831 , H01L21/6833 , Y10T279/23
摘要： An electrostatic chuck 100 useful for holding a substrate 55 in a high density plasma, comprises an electrode 110 at least partially covered by a semiconducting dielectric 115, wherein the semiconducting dielectric 115 may have an electrical resistance of from about 5×109 &OHgr;cm to about 8×1010 &OHgr;cm.
摘要翻译：用于将衬底55保持在高密度等离子体中的静电卡盘100包括至少部分被半导体电介质115覆盖的电极110，其中半导体电介质115可具有约5×10 9欧姆到约8×10 10欧姆·厘米的电阻。

6. 发明授权

US5904776A Conduits for flow of heat transfer fluid to the surface of an electrostatic chuck 失效
标题翻译：用于将传热流体流动到静电卡盘表面的导管
公开(公告)号：US5904776A
公开(公告)日：1999-05-18
申请号：US924976
申请日：1997-09-08
申请人： Arik Donde , Dan Maydan , Robert J. Steger , Edwin C. Weldon , Brian Lue , Timothy Dyer
发明人： Arik Donde , Dan Maydan , Robert J. Steger , Edwin C. Weldon , Brian Lue , Timothy Dyer
IPC分类号： B23Q3/15 , C23C16/458 , H01L21/683 , C23C16/00
CPC分类号： H01J37/321 , C23C16/4586 , H01L21/6831 , H01L21/6833 , H01J2237/2001 , Y10T29/49002 , Y10T29/49826 , Y10T29/49885
摘要： The present invention discloses a two basic structures (including multiple variations within one of the basic structures) and methods for fabrication of the structures which facilitate the flow of cooling gas or other heat transfer fluid to the surface of an electrostatic chuck. The basic structures address both the problem of breakdown of a heat transfer gas in an RF plasma environment and the problem of arcing between a semiconductor substrate and the conductive pedestal portion of the electrostatic chuck in such an RF plasma environment.
摘要翻译：本发明公开了两种基本结构（包括一种基本结构内的多种变型）以及用于制造促进冷却气体或其它传热流体流向静电卡盘表面的结构的方法。基本结构既解决了RF等离子体环境中的传热气体的分解问题，又涉及这种RF等离子体环境中的半导体基板与静电卡盘的导电基座部分之间的电弧放电的问题。

7. 发明授权

US5720818A Conduits for flow of heat transfer fluid to the surface of an electrostatic chuck 失效
公开(公告)号：US5720818A
公开(公告)日：1998-02-24
申请号：US639596
申请日：1996-04-26
申请人： Arik Donde , Dan Maydan , Robert J. Steger , Edwin C. Weldon , Brian Lue , Timothy Dyer
发明人： Arik Donde , Dan Maydan , Robert J. Steger , Edwin C. Weldon , Brian Lue , Timothy Dyer
IPC分类号： B23Q3/15 , C23C16/458 , H01L21/683 , C23C16/00
CPC分类号： H01J37/321 , C23C16/4586 , H01L21/6831 , H01L21/6833 , H01J2237/2001 , Y10T29/49002 , Y10T29/49826 , Y10T29/49885
摘要： The present invention discloses a two basic structures (including multiple variations within one of the basic structures) and methods for fabrication of the structures which facilitate the flow of cooling gas or other heat transfer fluid to the surface of an electrostatic chuck. The basic structures address both the problem of breakdown of a heat transfer gas in an RF plasma environment and the problem of arcing between a semiconductor substrate and the conductive pedestal portion of the electrostatic chuck in such an RF plasma environment.

8. 发明申请

US20160315521A1 Transportation device with reciprocating part and kinetic storage 审中-公开
公开(公告)号：US20160315521A1
公开(公告)日：2016-10-27
申请号：US14696440
申请日：2015-04-26
申请人： Arik Donde , Gideon Gimlan
发明人： Gideon Gimlan , Arik Donde
IPC分类号： H02K7/02 , B62M6/40
CPC分类号： H02K7/025 , B60L7/14 , B60L15/2009 , B60L15/2054 , B60L50/30 , B60L50/40 , B60L50/51 , B60L58/12 , B60L58/21 , B60L58/26 , B60L2200/12 , B60L2220/46 , B60L2240/12 , B60L2240/423 , B60L2240/545 , B60L2240/547 , B60L2240/549 , B60L2250/10 , B60L2270/145 , B62K3/002 , B62M1/105 , B62M1/14 , B62M1/28 , B62M6/45 , B62M19/00 , H02K7/1853 , H02K7/1861 , Y02E60/16 , Y02T10/641 , Y02T10/645 , Y02T10/7005 , Y02T10/7022 , Y02T10/7027 , Y02T10/7033 , Y02T10/7044 , Y02T10/7061 , Y02T10/72 , Y02T10/7275
摘要： Manual drive energy is input into a transport device of one embodiment by linearly reciprocating a first drive member that couples by way of a ratchet mechanism (or other mechanical motion rectifier means) and a mechanical motion amplifier means to one or more faster spinning flywheel masses. The one or more flywheel masses are formed in part by a combination electric motor/generator and it has rechargeable electric batteries distributively provided about a flywheel mass portion thereof. Tapered roller bearings having ferromagnetic material are interposed between the one or more flywheel masses and/or between one of the flywheels and a stationary frame of the transport device so as to repeatedly make and break closed magnetic flux conducting loops and thus provide at least one of an electric motoring and electricity generating function.

9. 发明授权

US06182851B2 Vacuum processing chambers and method for producing 失效
标题翻译：真空处理室及其制造方法
公开(公告)号：US06182851B2
公开(公告)日：2001-02-06
申请号：US09151187
申请日：1998-09-10
申请人： Arik Donde
发明人： Arik Donde
IPC分类号： B65D2504
CPC分类号： H01L21/67109 , B29C47/00 , B29C47/0023 , H01J37/16 , H01J37/32458 , H01L21/67028 , Y10S29/047 , Y10S220/916 , Y10T29/49826
摘要： A structure and method are present where a sidewall of a load lock chamber is formed by extrusion, to produce a reproducible tubular structure to form the walls of a vacuum chamber with greatly improved vacuum performance. The use of an extruded structure reduces the dimensional variability, increases the uniformity of a surface finish, and provides uniform top and bottom sealing arrangements, which allow full and easy access to the inside of the sidewalls for cleaning. In another arrangement heat transfer fluid passages can be formed in the wall of the chamber simultaneously as the wall of the chamber is extruded. Heating of cooling liquid can then be circulated through the passages in the wall of the chamber to heat the walls of the chamber as sometimes required to prevent condensation on the inside of the chamber walls, or provide cooling as is required for cool down of a wafer, after processing at an elevated temperature.
摘要翻译：存在一种结构和方法，其中通过挤压形成负载锁定室的侧壁，以产生可再现的管状结构以形成具有极大改善的真空性能的真空室的壁。挤压结构的使用减小了尺寸变化性，增加了表面光洁度的均匀性，并且提供了均匀的顶部和底部密封装置，其允许完全和容易地进入侧壁的内部进行清洁。在另一种布置中，当室的壁被挤出时，传热流体通道可以同时形成在腔室的壁中。然后可以将冷却液体的加热循环通过室的壁中的通道，以加热室的壁，以防止室壁内部的冷凝，或者提供如冷却晶片所需的冷却在高温下加工后。

10. 发明授权

US07528349B1 Temperature stabilization for substrate processing 有权
标题翻译：基板加工温度稳定
公开(公告)号：US07528349B1
公开(公告)日：2009-05-05
申请号：US11532748
申请日：2006-09-18
申请人： Yehiel Gotkis , Arik Donde , Vincenzo Lordi
发明人： Yehiel Gotkis , Arik Donde , Vincenzo Lordi
IPC分类号： H05B3/68 , F26B19/00
CPC分类号： H01L21/67103 , G03F7/70716 , G03F7/70875 , H01L21/67109
摘要： A temperature stabilization system, method, composition of matter and substrate processing system are disclosed. A heat absorbing material is disposed in thermal contact with a substrate. The heat absorbing material is characterized by a solid-liquid phase transition temperature that is in a desired temperature range for material processing the substrate. When the substrate is subjected to material processing that results in heat transfer into or out of the substrate the solid-liquid phase transition of the heat absorbing material stabilizes the temperature of the substrate.
摘要翻译：公开了温度稳定系统，方法，物质组成和衬底处理系统。吸热材料与衬底热接触地设置。吸热材料的特征在于固液相转变温度在用于材料加工基材的期望温度范围内。当基板经受导致热传递到基板中的材料加工时，吸热材料的固 - 液相变使基板的温度稳定。

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