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    • 5. 发明申请
    • PHASE CHANGE MEMORY AND MANUFACTURING METHOD THEREOF
    • 相变记忆及其制造方法
    • US20080029752A1
    • 2008-02-07
    • US11771601
    • 2007-06-29
    • Ilya KarpovCharles KuoYudong KimGreg Atwood
    • Ilya KarpovCharles KuoYudong KimGreg Atwood
    • H01L21/06H01L29/00
    • H01L45/04H01L27/2427H01L45/06H01L45/1233H01L45/126H01L45/141H01L45/144H01L45/1683
    • Both a chalcogenide select device (24, 120) and a chalcogenide memory element (40, 130) are formed within vias within dielectrics (18, 22). As a result, the chalcogenides is effectively trapped within the vias and no glue or adhesion layer is needed. Moreover, delamination problems are avoided. A lance material (30) is formed within the same via (31) with the memory element (40, 130). In one embodiment, the lance material is made thinner by virtue of the presence of a sidewall spacer (28); in another embodiment no sidewall spacer is utilized. A relatively small area of contact between the chalcogenide (40) used to form a memory element (130) and the lance material (30) is achieved by providing a pin hole opening in a dielectric (34), which separates the chalcogenide and the lance material.
    • 在电介质(18,22)内的通孔内形成硫族化物选择装置(24,120)和硫族化物存储元件(40,130)。 结果,硫属化物被有效地捕获在通孔内,并且不需要胶或粘合层。 此外,避免了分层问题。 在与存储元件(40,130)相同的通孔(31)内形成喷枪材料(30)。 在一个实施例中,由于存在侧壁间隔件(28),喷枪材料制成更薄。 在另一个实施例中,没有使用侧壁间隔物。 用于形成存储元件(130)的硫族化物(40)与喷枪材料(30)之间的相对小的接触面积是通过在电介质(34)中设置一个针孔开口来实现的,该电介质(34)将硫族化物和喷枪 材料。
    • 9. 发明授权
    • Structured, electrically-formed floating gate for flash memories
    • 用于闪存的结构化,电气形式的浮动栅极
    • US07847333B2
    • 2010-12-07
    • US12055216
    • 2008-03-25
    • Charles KuoYudong Kim
    • Charles KuoYudong Kim
    • H01L29/788
    • H01L21/28273B82Y10/00H01L27/115H01L27/11521H01L29/6653H01L29/66553
    • Semiconductor memory devices and methods to fabricate thereof are described. A first gate base is formed on a first insulating layer on a substrate. A first gate fin is formed on the first gate base. The first gate fin has a top and sidewalls. Next, a second insulating layer is formed on the top and sidewalls of the first gate fin and portions of the first gate base. A second gate is formed on the second insulating layer. Source and drain regions are formed in the substrate at opposite sides of the first gate base. In one embodiment, the first gate fin includes an undoped polysilicon and the first gate base includes an n-type polysilicon. In another embodiment, the first gate fin includes an undoped amorphous silicon and the first gate base includes an n-type amorphous silicon.
    • 描述半导体存储器件及其制造方法。 在基板上的第一绝缘层上形成第一栅极基底。 第一栅极鳍形成在第一栅极基底上。 第一个门鳍具有顶部和侧壁。 接下来,在第一栅极鳍的顶部和侧壁以及第一栅极基底的一部分上形成第二绝缘层。 第二栅极形成在第二绝缘层上。 源极和漏极区域形成在第一栅极基极的相对侧的衬底中。 在一个实施例中,第一栅极鳍包括未掺杂多晶硅,第一栅极基底包括n型多晶硅。 在另一个实施例中,第一栅极鳍包括未掺杂的非晶硅,第一栅极基底包括n型非晶硅。