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1. 发明专利

JP2007046156A Apparatus for electroless deposition of metal onto semiconductor substrate 审中-公开
标题翻译：用于金属沉积在半导体基板上的电沉积装置
公开(公告)号：JP2007046156A
公开(公告)日：2007-02-22
申请号：JP2006186953
申请日：2006-07-06
申请人： Applied Materials Inc , アプライドマテリアルズインコーポレイテッドApplied Materials,Incorporated
发明人： LUBOMIRSKY DMITRY , SHANMUGASUNDRAM ARULKUMAR , PANCHAM IAN A
IPC分类号： C23C18/31 , C23C18/16 , H01L21/02
摘要： PROBLEM TO BE SOLVED: To provide an integrated electroless deposition apparatus that can deposit a uniform layer with minimum defects. SOLUTION: An electroless deposition system and an electroless deposition station are provided. The system includes a processing mainframe, at least one substrate cleaning station positioned on the mainframe, and an electroless deposition station positioned on the mainframe. The electroless deposition station includes an environmentally controlled processing enclosure, a first processing station configured to clean and activate the surface of the substrate, a second processing station configured to electrolessly deposit a layer onto the surface of the substrate, and a substrate shuttle positioned to transfer the substrate between the first and second processing stations. The electroless deposition station also includes various fluid delivery devices and substrate temperature controlling devices to perform a contamination-free and uniform electroless deposition process. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够以最小缺陷沉积均匀层的集成无电沉积装置。解决方案：提供无电沉积系统和无电沉积站。该系统包括处理主机，位于主机上的至少一个基板清洗台和位于主机上的无电沉积站。无电沉积站包括环境受控的处理外壳，第一处理站被配置为清洁和激活基板的表面;第二处理站，被配置为将层无电沉积到基板的表面上;以及基板梭，第一和第二处理站之间的基板。无电沉积站还包括各种流体输送装置和基板温度控制装置，以执行无污染和均匀的无电沉积工艺。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2013102226A Method of monitoring substrates in polishing apparatus and method of transferring substrates in polishing system 审中-公开
标题翻译：抛光装置中基板的监测方法及抛光系统中基板的传输方法
公开(公告)号：JP2013102226A
公开(公告)日：2013-05-23
申请号：JP2013024581
申请日：2013-02-12
申请人： Applied Materials Inc , アプライドマテリアルズインコーポレイテッドApplied Materials,Incorporated
发明人： PINSON JAY D II , SHANMUGASUNDRAM ARULKUMAR , ARONSON ARNOLD , LUM RODNEY
IPC分类号： H01L21/304 , B24B37/34 , B65G49/07 , H01L21/00 , H01L21/677
CPC分类号： H01L21/67219 , B24B37/345
摘要： PROBLEM TO BE SOLVED: To provide a method of monitoring two or more substrates in a polishing apparatus.SOLUTION: A method of monitoring two or more substrates in a polishing apparatus comprises the steps of: moving a first substrate in a first direction to move the first substrate into a buffer station disposed next to a monitoring system; moving the first substrate in a second direction perpendicular to the first direction to apply a monitoring process to the first substrate; taking out a second substrate to move it into the buffer station; and taking out the first substrate from the buffer station.
摘要翻译：要解决的问题：提供一种在抛光装置中监测两个或更多个基板的方法。解决方案：一种在抛光设备中监测两个或更多个基板的方法，包括以下步骤：沿第一方向移动第一基板以使第一基板移动到靠近监视系统设置的缓冲站中; 在垂直于第一方向的第二方向上移动第一衬底以对第一衬底施加监测过程; 取出第二基板将其移入缓冲站; 并从缓冲站中取出第一个底物。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2008032719A Raman spectroscopy as integrated chemical measurement 审中-公开
标题翻译：拉曼光谱作为一体化学测量
公开(公告)号：JP2008032719A
公开(公告)日：2008-02-14
申请号：JP2007195454
申请日：2007-07-27
申请人： Applied Materials Inc , アプライドマテリアルズインコーポレイテッドApplied Materials,Incorporated
发明人： FANG HONGBIN , GOLDEN JOSH , WEIDMAN TIMOTHY , WANG YAXIN , SHANMUGASUNDRAM ARULKUMAR
IPC分类号： G01N21/65 , C23C18/16
摘要： PROBLEM TO BE SOLVED: To provide a method measuring a metallic solution concentration and a reducing solution concentration in a non-electrolysis plating solution. SOLUTION: By applying Raman spectroscopy, the concentration of each solution in a non-electrolysis plating solution is measured, after mixing. By measuring the concentration of each solution, before providing, into a plating bath, it is possible to prepare the concentration of each solution to obtain the target concentration of each solution. Furthermore, each solution can be analyzed individually with Raman spectroscopy prior to mixing with other solutions. Based on the Raman spectroscopic measurement values of each solution before mixing, the target component concentration can be obtained, by preparing individual component forming each solution prior to mixing. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：待解决的问题：提供一种测量非电解电镀溶液中的金属溶液浓度和还原溶液浓度的方法。解决方案：通过拉曼光谱法，混合后测量非电解电镀溶液中各溶液的浓度。通过测量每种溶液的浓度，在提供给镀浴之前，可以制备每种溶液的浓度以获得每种溶液的目标浓度。此外，在与其他溶液混合之前，可以使用拉曼光谱分析每种溶液。基于混合前的各溶液的拉曼光谱测定值，通过在混合前制备形成各溶液的各成分，可以得到目标成分浓度。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2001127139A MULTIPLE HANDLING ROBOT BLADE FOR SEMICONDUCTOR TREATING DEVICE 失效
公开(公告)号：JP2001127139A
公开(公告)日：2001-05-11
申请号：JP2000276738
申请日：2000-09-12
申请人： APPLIED MATERIALS INC
发明人： SHANMUGASUNDRAM ARULKUMAR , MICHAEL P KARAJIMU
IPC分类号： B25J15/06 , B25J17/02 , B65G49/07 , H01L21/677 , H01L21/68 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To obtain a robot assembly having a multiple handling robot blade which can support one or more substrates. SOLUTION: A treatment system having a robot assembly containing a multiple handling robot blade 94 which can support a substrate by at least two surfaces and a related method by which one or more substrates are transferred in the system are embodied. The system can support an untreated substrate on the blade 94 until a treated substrate is taken out from the position to which the untreated substrate is transported. Since a robot 72 which exchanges the treated substrate with the untreated substrate reduces required motions and shortens the swapping time, the throughput rate of the treatment system is increased.

5. 发明专利

JP2001135603A METHOD AND APPARATUS FOR TRANSFERRING SEMICONDUCTOR SUBSTRATE USING INPUT MODULE 失效
公开(公告)号：JP2001135603A
公开(公告)日：2001-05-18
申请号：JP2000180247
申请日：2000-06-15
申请人： APPLIED MATERIALS INC
发明人： GARRY C ETTINGER , GREGG WIIZU , SHANMUGASUNDRAM ARULKUMAR
IPC分类号： H01L21/677 , B24B37/34 , H01L21/304 , H01L21/673 , H01L21/687
摘要： PROBLEM TO BE SOLVED: To provide a technique for facilitating substrate transfer between modules of a semiconductor processing system. SOLUTION: A method and an apparatus for processing semiconductor substrate is specified to polish substrates or substrate wafers in a polishing system. In an embodiment, the system has one or more polishing modules, input module, and first and second robots, and provides a compact polishing system having minimal tool footprint. The first robot transfers the substrate to an input module, and the second robot carries the substrate between the input module and one or more polishing modules. In another embodiment, the first and the second robots have a rotating actuator connected to a gripper capable of orientating movement between the horizontal and vertical directions. The input module maintains the substrate in the vertical direction.

6. 发明专利

JP2002208544A CONTROL FOR EACH EXECUTION OF SEMICONDUCTOR TREATMENT TOOL BASED ON MIRROR IMAGE TARGET 审中-公开
公开(公告)号：JP2002208544A
公开(公告)日：2002-07-26
申请号：JP2001246707
申请日：2001-08-15
申请人： APPLIED MATERIALS INC
发明人： LYMBEROPOULOS DIMITRIS , REISS TERRY , SHANMUGASUNDRAM ARULKUMAR
IPC分类号： H01L21/302 , G05B19/418 , H01L21/00 , H01L21/02 , H01L21/304 , H01L21/306 , H01L21/3065
摘要： PROBLEM TO BE SOLVED: To provide a new technique for minimizing variation for each execution in the processing result of a semiconductor assembly tool. SOLUTION: Variation in the semiconductor assembly tool for each execution is minimized by a mirror image target. The target indicates a desired processing result from the operation of the tool. The mirror image target is generated by adding the target to the difference between output from previous execution and the target in the tool. The prediction of tool performance is made based on the modeling engine of a data center using a reference library for correlating operation parameters to the processing result being observed in the previous execution in the tool. The mirror image target vector is compared with the reference library, and becomes a base for generating a recipe for successive execution. The recipe automatically returns the operation of the tool to the target.

7. 发明专利

JP2000340534A BUFFER STATION OF CMP SYSTEM 失效
公开(公告)号：JP2000340534A
公开(公告)日：2000-12-08
申请号：JP2000101559
申请日：2000-04-03
申请人： APPLIED MATERIALS INC
发明人： PINSON JAY D II , SHANMUGASUNDRAM ARULKUMAR , ARONSON ARNOLD , LUM RODNEY
IPC分类号： B24B37/34 , B65G49/07 , H01L21/00 , H01L21/304 , H01L21/677 , B24B37/04 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a CMP tool equipped with a buffer station which supports one or more substrates for improving the tool throughput. SOLUTION: A buffer station 32 is arranged inside or adjacent to a chemical and mechanical polishing system 10, where the buffer station 32 is provided with two or more substrate support bodies which are located adjacent to a test station 20 to support substrates. Two or more of the substrate support bodies are mounted on a mounting plate linked to an actuator which moves a pair of substrate supporting bodies, so as to enable them to approach each other or recede from each other.

8. 发明专利

AT362127T 未知
公开(公告)号：AT362127T
公开(公告)日：2007-06-15
申请号：AT02746974
申请日：2002-07-12
申请人： APPLIED MATERIALS INC
发明人： REISS TERRY , SHANMUGASUNDRAM ARULKUMAR , SCHWARM ALEXANDER
IPC分类号： G05B19/418 , H01L21/02 , G05B23/02 , G06F19/00 , H01L21/00 , H01L21/66
摘要： Semiconductor wafers are processed in conjunction with a manufacturing execution system using a run-to-run controller and a fault detection system. A recipe is received from the manufacturing execution system by the run-to-run controller for controlling a tool. The recipe includes a setpoint for obtaining one or more target wafer properties. Processing of the wafers is monitored by measuring processing attributes including fault conditions and wafer properties using the fault detection system and one or more sensors. Setpoints of the recipe may be modified at the run-to-run controller according to the processing attributes to maintain the target wafer properties, except in cases when a fault condition is detected by the fault detection system. Thus, data acquired in the presence of tool or wafer fault conditions are not used for feedback purposes. In addition, fault detection models may be used to define a range of conditions indicative of a fault condition. In these cases, the fault detection models may be modified to incorporate, as parameters, setpoints of a recipe modified by a run-to-run controller.

9. 发明申请

WO2006081290A3 APPARATUS FOR ELECTROLESS DEPOSITION OF METALS ONTO SEMICONDUCTOR SUBSTRATES 审中-公开
标题翻译：用于电沉积金属到半导体衬底的装置
公开(公告)号：WO2006081290A3
公开(公告)日：2009-04-16
申请号：PCT/US2006002619
申请日：2006-01-23
申请人： APPLIED MATERIALS INC , LUBOMIRSKY DMITRY , SHANMUGASUNDRAM ARULKUMAR , ELLWANGER RUSSELL , PANCHAM IAN A , CHEBOLI RAMAKRISHNA , WEIDMAN TIMOTHY W
发明人： LUBOMIRSKY DMITRY , SHANMUGASUNDRAM ARULKUMAR , ELLWANGER RUSSELL , PANCHAM IAN A , CHEBOLI RAMAKRISHNA , WEIDMAN TIMOTHY W
IPC分类号： C23C18/16 , B05D3/10 , C23F1/00 , H01L21/00 , H01L21/306 , H01L21/687
CPC分类号： H01L21/67155 , C23C18/1628 , H01L21/67167 , H01L21/6719 , H01L21/6723
摘要： An electroless deposition system is provided. The system includes a processing mainframe, at least one substrate cleaning station positioned on the mainframe, and an electroless deposition station positioned on the mainframe. The electroless deposition station includes an environmentally controlled processing enclosure, a first processing station configured to clean and activate a surface of a substrate, a second processing station configured to electrolessly deposit a layer onto the surface of the substrate, and a substrate transfer shuttle positioned to transfer substrates between the first and second processing stations. The system also includes a substrate transfer robot positioned on the mainframe and configured to access an interior of the processing enclosure. The system also includes a substrate a fluid delivery system that is configured to deliver a processing fluid by use of a spraying process to a substrate mounted in the processing enclosure.
摘要翻译：提供无电沉积系统。该系统包括处理主机，位于主机上的至少一个基板清洗台和位于主机上的无电沉积站。无电沉积站包括环境受控的处理外壳，被配置为清洁和激活基板的表面的第一处理站，被配置为将层无电沉积到基板的表面上的第二处理站，以及位于在第一和第二处理站之间传送衬底。该系统还包括位于主机上并被配置为进入处理外壳的内部的基板传送机器人。该系统还包括一个流体输送系统，该流体输送系统被配置成通过使用喷射过程将处理流体输送到安装在处理外壳中的基底。

10. 发明公开

EP1694885A4 MULTI-CHEMISTRY PLATING SYSTEM 审中-公开
标题翻译：具有多chemisms金属分离系统
公开(公告)号：EP1694885A4
公开(公告)日：2007-12-19
申请号：EP04760000
申请日：2004-04-16
申请人： APPLIED MATERIALS INC , ELLWANGER RUSSELL C
发明人： YANG MICHAEL X , XI MING , BRITCHER ERIC B , DONOSO BERNARDO , PANG LILY L , SHERMAN SVETLANA , HO HENRY , NGUYEN ANH N , LERNER ALEXANDER N , D AMBRA ALLEN L , SHANMUGASUNDRAM ARULKUMAR , ISHIKAWA TETSUYA , RABINOVICH YEVGENIY , LUBOMIRSKY DMITRY , MOK YEUK-FAI EDWIN , NGUYEN SON T
IPC分类号： C25D7/12 , B08B3/02 , C25D5/00 , C25D17/00 , C25D17/02 , C25D19/00 , C25D21/00 , C25D21/08 , H01L21/00 , H01L21/68 , H01L21/683 , H01L21/687
CPC分类号： H01L21/67167 , B08B3/02 , C25D5/003 , C25D7/123 , C25D17/001 , C25D17/002 , C25D21/02 , C25D21/08 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/67109 , H01L21/6719 , H01L21/67196 , H01L21/6723 , H01L21/68 , H01L21/6838 , H01L21/68707
摘要： Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.

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