专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20030154002A1 Method and apparatus for aligning a cassette handler 审中-公开
标题翻译：用于对准盒式处理器的方法和装置
公开(公告)号：US20030154002A1
公开(公告)日：2003-08-14
申请号：US10322694
申请日：2002-12-17
申请人： Applied Materials, Inc.
发明人： Alan Rick Lappen , Keith P. Weigman , Ronald Vern Schauer
IPC分类号： G06F007/00
CPC分类号： H01L21/6732 , H01L21/67775 , H01L21/681
摘要： Methods and apparatuses for aligning workpiece and cassette handlers in an automated workpiece handling system are provided. The apparatus comprises an alignment pin and a frame adapted to be supported by a cassette handler support surface. The frame has first and second apertures defined by first and second alignment surfaces which are adapted to receive the alignment pin. The robot blade has a blade aperture which is defined by a blade alignment surface which is adapted to receive the alignment pin when the robot blade is positioned in a first predetermined position when the pin is received by the first aperture and the blade aperture. The blade alignment surface is further adapted to receive the alignment pin when the robot blade is positioned in a second predetermined position when the pin is received by the second aperture and the blade aperture.
摘要翻译：提供了将自动化工件处理系统中的工件和盒式处理机对准的方法和装置。该装置包括对准销和适于由盒式处理器支撑表面支撑的框架。框架具有由适于接收对准销的第一和第二对准表面限定的第一和第二孔。所述机器人刀片具有刀片孔，所述刀片孔由刀片对准表面限定，当所述销被所述第一孔和所述刀片孔接收时，所述刀片对准表面适于在所述机器人刀片定位在第一预定位置时接收所述对准销。当所述销被所述第二孔和所述刀片孔接收时，所述刀片对准表面还适于在所述机器人刀片定位在第二预定位置时接收所述对准销。

2. 发明申请

US20020189122A1 Variable method and apparatus for alignment of automated workpiece handling systems 有权
标题翻译：用于自动化工件处理系统对准的可变方法和装置
公开(公告)号：US20020189122A1
公开(公告)日：2002-12-19
申请号：US09881855
申请日：2001-06-13
申请人： APPLIED MATERIALS, INC.
发明人： Alan Rick Lappen
IPC分类号： G01D021/00
CPC分类号： H01L21/68
摘要： An alignment tool, method and system are provided for aligning a robot blade and a cassette in a workpiece handling system, in which the tool comprises a frame or fixture adapted to emulate a plurality of different types of cassettes. The frame is adapted to be supported by a cassette handler system and includes a plurality of alignment and registration surfaces adapted to emulate corresponding alignment and registration surfaces of a cassette. A removable H bar may be attached to the frame in a plurality of selectable positions to emulate one or more of a plurality of different cassette H bar positions of different types of cassettes. A kit of selectable and removable rear guide rails permit one pair of rear guide rails to be substituted for another pair of rear guide rails to permit the frame to emulate the particular rear guide rail arrangement of a plurality of different cassettes.
摘要翻译：提供了一种对准工具，方法和系统，用于将机器人刀片和盒子对准在工件处理系统中，其中工具包括适于模拟多种不同类型的盒的框架或夹具。框架适于由盒式处理器系统支撑，并且包括适于模拟盒的相应对准和配准表面的多个对准和配准表面。可拆卸的H杆可以在多个可选择的位置附接到框架，以模拟不同类型的盒的多个不同的盒H杆位置中的一个或多个。一组可选择和可拆卸的后导轨允许一对后导轨代替另一对后导轨，以允许框架模拟多个不同盒的特定后导轨装置。

3. 发明申请

US20020021959A1 Method and apparatus for alignment of automated workpiece handling systems 有权
标题翻译：自动化工件处理系统对准的方法和装置
公开(公告)号：US20020021959A1
公开(公告)日：2002-02-21
申请号：US09881854
申请日：2001-06-13
申请人： APPLIED MATERIALS, INC.
发明人： Ronald Vern Schauer , Alan Rick Lappen
IPC分类号： B65G049/07
CPC分类号： H01L21/67265 , B23Q3/186 , B23Q17/24 , H01L21/67259 , H01L21/6732 , H01L21/67775 , H01L21/681 , Y10S414/137
摘要： An alignment tool, method and system are provided for aligning a robot blade in a workpiece handling system, in which the tool comprises a frame or fixture adapted to be supported by a transfer chamber support surface or other support surface in the system, in which the frame has one or more non-contact distance sensors positioned to measure the distance of a workpiece or robot blade from the sensor or a predetermined reference point or surface. In one embodiment, the frame is used to align a robot blade relative to a robot support alignment surface in a robot chamber. In another embodiment, the frame emulates a workpiece cassette and the distance sensors provide an output to align the robot blade to a cassette support alignment surface. As a consequence, accidental scratching and breakage of workpieces such as semiconductor wafers and display substrates may be reduced or eliminated. In another embodiment, positions of distance sensors may be readily repositioned to accommodate alignment procedures for different sized wafers or other workpieces.
摘要翻译：提供了一种对准工具，方法和系统，用于将机器人刀片对准在工件处理系统中，其中工具包括适于由系统中的传送室支撑表面或其他支撑表面支撑的框架或固定件，其中框架具有一个或多个非接触距离传感器，其定位成测量工件或机器人刀片与传感器或预定参考点或表面的距离。在一个实施例中，框架用于将机器人刀片相对于机器人腔室中的机器人支撑对准表面对准。在另一个实施例中，框架模拟工件盒，并且距离传感器提供将机器人刀片对准盒支撑对准表面的输出。因此，可以减少或消除诸如半导体晶片和显示器基板的工件的意外划伤和破损。在另一个实施例中，距离传感器的位置可以容易地重新定位以适应不同大小的晶片或其它工件的对准程序。

4. 发明申请

US20030110611A1 Method and apparatus for alignment of carriers, carrier handlers and semiconductor handling equipment 失效
标题翻译：用于对准载体，载体处理器和半导体处理设备的方法和装置
公开(公告)号：US20030110611A1
公开(公告)日：2003-06-19
申请号：US10021998
申请日：2001-12-14
申请人： Applied Materials, Inc.
发明人： Alan Rick Lappen , Ronald Vern Schauer
IPC分类号： B25B027/14 , B23Q003/00
CPC分类号： H01L21/68 , Y10T29/49895 , Y10T29/49899 , Y10T29/49902 , Y10T29/53052 , Y10T29/53978
摘要： A carrier alignment tool system in accordance with a preferred embodiment of the present invention provides a tool and method of using the tool, which emulates the door of a substrate carrier having a removable door. The tool permits the alignment between a door opener mechanism and the load-port or other handler, on which a carrier is to be supported to be tested and corrected, until proper alignment is achieved prior to beginning substrate processing.
摘要翻译：根据本发明的优选实施例的载体对准工具系统提供了使用该工具的工具和方法，其模拟具有可拆卸门的基板载体的门。该工具允许门开启机构与负载端口或其他处理器之间的对准，在载体端口或其他处理器上载体被支撑以进行测试和校正，直到在开始基板处理之前实现适当的对准。

5. 发明申请

US20030173490A1 Facilities connection box for pre-facilitation of wafer fabrication equipment 失效
标题翻译：设备接线盒，用于晶片制造设备的预先利用
公开(公告)号：US20030173490A1
公开(公告)日：2003-09-18
申请号：US10335968
申请日：2003-01-02
申请人： Applied Materials, Inc.
发明人： Alan Rick Lappen , Ronald V. Schauer
IPC分类号： F16M001/00
CPC分类号： H01L21/67196 , B23Q1/01 , H01L21/67017 , Y10S414/135 , Y10T137/5762 , Y10T137/87249 , Y10T137/87885
摘要： A facilities connection box is provided to accommodate pre-plumbing of facilities lines required in connection with an installation of semiconductor device manufacturing equipment. The facilities connection box accommodates termination of double-containment facilities lines that are adapted to carry hazardous materials required for operation of the semiconductor device manufacturing equipment. Each double-containment facilities line is terminated in an isolation compartment of the facilities connection box. Each isolation compartment has an entry port adapted to couple to an incoming double-containment line and an exit port adapted to permit egress from the isolation compartment of a respective outgoing line.
摘要翻译：提供设施连接箱以适应与半导体装置制造设备的安装有关的设备线的预管道。设备接线盒适用于适用于运载半导体器件制造设备所需的危险材料的双重收容设备线路的终端。每个双重收容设施线路终端在设施接线盒的隔离隔间中。每个隔离隔间具有入口端口，其适于联接到输入的双包容线路和适于允许从相应输出线路的隔离隔间出口的出口端口。

6. 发明申请

US20030083776A1 Method and apparatus for aligning a cassette 失效
公开(公告)号：US20030083776A1
公开(公告)日：2003-05-01
申请号：US10303516
申请日：2002-11-25
申请人： Applied Materials, Inc.
发明人： Ronald Vern Schauer , Alan Rick Lappen , David L. Tuttle
IPC分类号： G06F007/00
CPC分类号： H01L21/6732 , B23Q3/186 , B23Q17/24 , H01L21/67259 , H01L21/67265 , H01L21/67379 , H01L21/67775 , H01L21/68 , H01L21/681 , Y10S414/136
摘要： An alignment tool, method and system are provided for aligning a cassette handler to a robot blade in a workpiece handling system, in which the tool comprises a frame or fixture adapted to be supported by the cassette handler support surface, in which the frame has one or more distance sensors positioned to measure the distance of a workpiece or robot blade from the sensor or a predetermined reference point or surface. In a preferred embodiment, the frame emulates a workpiece cassette and the distance sensors provide a numerical output of the distance to the workpiece. As explained in greater detail below, these distance measurements facilitate accurately leveling and aligning the cassette handler support surface relative to a workpiece supported by the robot blade such that when the frame is replaced by an actual workpiece cassette, the workpiece cassette will also be level and aligned with respect to the robot blade and the workpiece held by the blade. As a consequence, accidental scratching and breakage of workpieces such as semiconductor wafers and display substrates may be reduced or eliminated.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式