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    • 5. 发明授权
    • Glass header structure for a semiconductor pressure transducer
    • 半导体压力传感器的玻璃头结构
    • US4764747A
    • 1988-08-16
    • US124089
    • 1987-11-23
    • Anthony D. KurtzJoseph R. MallonTimothy A. Nunn
    • Anthony D. KurtzJoseph R. MallonTimothy A. Nunn
    • G01L9/00G01L1/22
    • G01L19/0645G01L19/147
    • A glass header structure for a pressure transducer employs a cylindrical member fabricated from a borosilicate glass having a thermal expansion coefficient which matches silicon. The glass header has a central aperture which extends from the top to the bottom surface. Positioned about the central aperture are four smaller apertures located at 90 degree intervals and each containing an elongated terminal pin. The pins are of a nail head configuration with a flat top head of a larger diameter than the diameter of the apertures and of the main pin body. Affixed to the flat top surfaces of the terminal pins by means of ball bonding are wires which connect to the terminal areas of a semiconductor pressure transducer which is mounted over the central aperture of the header. In this manner, the glass header serves to electrically and mechanically isolate the semiconductor transducer from the external environment and to further provide isolation of the transducer from voltage and heating effects which are produced during the assembly process necessary to fabricate a complete transducer unit.
    • 用于压力传感器的玻璃头部结构采用由具有与硅相匹配的热膨胀系数的硼硅酸盐玻璃制成的圆柱形构件。 玻璃头部具有从顶部延伸到底部表面的中心孔。 围绕中心孔定位的是四个较小的孔,位于90度的间隔处,每个孔包含细长的端子销。 销具有指甲头构型,其具有直径大于孔和主销体直径的平顶头。 通过滚珠接合固定在端子销的平坦顶面上的是连接到安装在集管的中心孔上的半导体压力传感器的端子区域的导线。 以这种方式,玻璃接头用于将半导体换能器与外部环境电气和机械隔离,并进一步提供换能器与制造完整换能器单元所需组装过程中产生的电压和加热效应的隔离。