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1. 发明授权

US06369416B1 Semiconductor device with contacts having a sloped profile 有权
标题翻译：具有倾斜轮廓的触头的半导体器件
公开(公告)号：US06369416B1
公开(公告)日：2002-04-09
申请号：US09404394
申请日：1999-09-23
申请人： Angela T. Hui , Tuan Duc Pham , Mark T. Ramsbey , Yu Sun
发明人： Angela T. Hui , Tuan Duc Pham , Mark T. Ramsbey , Yu Sun
IPC分类号： H01L2976
CPC分类号： H01L27/115 , H01L21/76804
摘要： A method and system for providing a contact in a semiconductor device including a plurality of gates is disclosed. The method and system include providing an insulating layer substantially surrounding at least a portion of the plurality of gates and providing at least one contact within the insulating layer. The contact has a side defining a sloped profile. The sloped profile includes an angle between the side of the contact and a surface of the substrate that is less than approximately eighty-eight degrees.
摘要翻译：公开了一种用于在包括多个栅极的半导体器件中提供接触的方法和系统。该方法和系统包括提供基本上围绕多个栅极的至少一部分的绝缘层，并且在绝缘层内提供至少一个触点。触点具有限定倾斜轮廓的侧面。倾斜轮廓包括接触侧面和基体表面之间的角度小于大约八十八度。

2. 发明授权

US06342415B1 Method and system for providing reduced-sized contacts in a semiconductor device 失效
标题翻译：用于在半导体器件中提供减小尺寸的触点的方法和系统
公开(公告)号：US06342415B1
公开(公告)日：2002-01-29
申请号：US09404395
申请日：1999-09-23
申请人： Angela T. Hui , Tuan Duc Pham , Mark T. Ramsbey , Yu Sun
发明人： Angela T. Hui , Tuan Duc Pham , Mark T. Ramsbey , Yu Sun
IPC分类号： H01L218238
CPC分类号： H01L21/31144 , H01L21/76816 , H01L23/485 , H01L2924/0002 , H01L2924/00
摘要： A method and system for providing a contact in a semiconductor device including a plurality of gates is disclosed. The method and system include providing an insulating layer substantially surrounding at least a portion of the plurality of gates and providing at least one contact within the insulating layer. The at least one contact has a reduced width that is less than approximately 0.28 microns
摘要翻译：公开了一种用于在包括多个栅极的半导体器件中提供接触的方法和系统。该方法和系统包括提供基本上围绕多个栅极的至少一部分的绝缘层，并且在绝缘层内提供至少一个触点。所述至少一个接触件具有小于约0.28微米的减小的宽度

3. 发明授权

US06448608B1 Capping layer 有权
标题翻译：封盖层
公开(公告)号：US06448608B1
公开(公告)日：2002-09-10
申请号：US09631894
申请日：2000-08-04
申请人： Tuan Duc Pham , Mark T. Ramsbey , Sameer S. Haddad , Angela T. Hui
发明人： Tuan Duc Pham , Mark T. Ramsbey , Sameer S. Haddad , Angela T. Hui
IPC分类号： H01L29788
CPC分类号： H01L27/11526 , H01L27/105 , H01L27/11543
摘要： An improved flash memory device, which comprises core stacks and periphery stacks which are protected with an oxide layer, a protective layer and an insulating layer. A high energy dopant implant is used to pass the dopant through the insulating layer, the protective layer, and oxide layer into the substrate to create source and drain regions, without using a self aligned etch. The flash memory device has an intermetallic dielectric layer placed over the core stacks and the periphery stacks. A tungsten plug is placed in the intermetallic dielectric layer to provide an electrical connection to the drain of the flash memory device. The use of a high energy dopant implant to pass through dopant through the insulating layer, the protective layer, and the oxide layer into the substrate without the use of a self aligned source etch, reduces damage to the core stacks and periphery stacks caused by various etches during the production of the flash memory device and provides insulation to reduce unwanted current leakage between the tungsten plug and the stacks.
摘要翻译：一种改进的闪速存储器件，其包括用氧化物层，保护层和绝缘层保护的芯堆叠和外围堆叠。使用高能掺杂剂注入来使掺杂剂通过绝缘层，保护层和氧化物层进入衬底以产生源区和漏区，而不使用自对准蚀刻。闪存器件具有放置在芯堆叠和外围堆叠体上的金属间介电层。将钨塞放置在金属间介电层中以提供与闪存器件的漏极的电连接。使用高能掺杂剂注入物通过掺杂剂通过绝缘层，保护层和氧化物层进入衬底而不使用自对准源蚀刻，减少了由各种不同的引线引起的芯堆叠和外围堆叠的损坏在制造闪速存储器件期间蚀刻并提供绝缘以减少钨丝塞和叠层之间的不必要的电流泄漏。

4. 发明授权

US06969654B1 Flash NVROM devices with UV charge immunity 有权
标题翻译：具有UV电荷免疫功能的闪存NVROM器件
公开(公告)号：US06969654B1
公开(公告)日：2005-11-29
申请号：US09727714
申请日：2000-11-28
申请人： Tuan Duc Pham , Mark T. Ramsbey , Jeffrey A. Shields , Angela T. Hui , Dawn Hopper
发明人： Tuan Duc Pham , Mark T. Ramsbey , Jeffrey A. Shields , Angela T. Hui , Dawn Hopper
IPC分类号： H01L21/28 , H01L21/336 , H01L21/8246 , H01L23/552 , H01L27/115
CPC分类号： H01L27/11568 , H01L21/28273 , H01L23/552 , H01L27/115 , H01L2924/0002 , H01L2924/00
摘要： A method of preventing UV charging of flash NVROM cells during fabrication and a device thereby formed. During device fabrication, a UV blocking layer is deposited over the floating gates. The UV blocking layer substantially blocks UV from entering the gate regions so as to prevent electron mobility sufficient to render the cells unprogrammable or unerasable. The reduced electron migration during processing of the NVROM leads to increased yield and reliability of the devices.
摘要翻译：一种在制造期间防止闪存NVROM单元的紫外线充电的方法和由此形成的装置。在器件制造期间，在阻挡层上沉积UV阻挡层。 UV阻挡层基本上阻止UV进入栅极区域，以便防止电子迁移率足以使电池不可编程或不可擦除。在NVROM处理期间减少的电子迁移导致器件的产量和可靠性的提高。

5. 发明授权

US06635943B1 Method and system for reducing charge gain and charge loss in interlayer dielectric formation 有权
标题翻译：降低层间电介质形成中电荷增益和电荷损失的方法和系统
公开(公告)号：US06635943B1
公开(公告)日：2003-10-21
申请号：US09533617
申请日：2000-03-22
申请人： Angela T. Hui , Tuan Duc Pham , Richard J. Huang , Mark T. Ramsbey , Lu You
发明人： Angela T. Hui , Tuan Duc Pham , Richard J. Huang , Mark T. Ramsbey , Lu You
IPC分类号： H01L2900
CPC分类号： H01L21/823425 , H01L21/76819 , H01L21/76837
摘要： A method and system for insulating a lower layer of a semiconductor device from an upper layer of the semiconductor device is disclosed. The method and system include providing an interlayer dielectric on the lower layer. The interlayer dielectric is capable of gap filling while using only species of relatively low mobility. The method and system also include planarizing a surface of the interlayer dielectric.
摘要翻译：公开了一种用于将半导体器件的下层与半导体器件的上层绝缘的方法和系统。该方法和系统包括在下层上提供层间电介质。层间电介质能够间隙填充，同时仅使用相对较低迁移率的物质。该方法和系统还包括平坦化层间电介质的表面。

6. 发明授权

US06548334B1 Capping layer 失效
标题翻译：封盖层
公开(公告)号：US06548334B1
公开(公告)日：2003-04-15
申请号：US10179061
申请日：2002-06-24
申请人： Tuan Duc Pham , Mark T. Ramsbey , Sameer S. Haddad , Angela T. Hui
发明人： Tuan Duc Pham , Mark T. Ramsbey , Sameer S. Haddad , Angela T. Hui
IPC分类号： H01L21337
CPC分类号： H01L27/11526 , H01L27/105 , H01L27/11543
摘要： A method of fabricating an improved flash memory device having core stacks and periphery stacks which are protected with an oxide layer, a protective layer and an insulating layer. A high energy dopant implant is used to pass the dopant through the insulating layer, the protective layer and oxide layer into the substrate to create source and drain regions, without using a self aligned etch. The flash memory device has an intermetallic dielectric layer placed over the core stacks and the periphery stacks. A tungsten plug is placed in the intermetallic dielectric layer to provide an electrical connection to the drain of the flash memory device. The use of a high energy dopant implant to pass through dopant through the insulating layer, the protective layer and the oxide layer into the substrate without the use of a self aligned source etch, reduces damage to the core stacks and periphery stacks caused by various etches during the production of the flash memory device and provides insulation to reduce unwanted current between the tungsten plug and the stacks.
摘要翻译：一种制造具有由氧化层，保护层和绝缘层保护的芯堆叠和外围堆叠的改进的闪存器件的方法。使用高能掺杂剂注入来使掺杂剂通过绝缘层，保护层和氧化物层进入衬底以产生源区和漏区，而不使用自对准蚀刻。闪存器件具有放置在芯堆叠和外围堆叠体上的金属间介电层。将钨塞放置在金属间介电层中以提供与闪存器件的漏极的电连接。使用高能掺杂剂注入物通过掺杂剂通过绝缘层，保护层和氧化物层进入衬底而不使用自对准源蚀刻，减少了由各种蚀刻引起的芯堆叠和外围堆叠的损坏在制造闪速存储器件期间提供绝缘以减少钨插头和堆叠之间的不必要的电流。

7. 发明授权

US06589841B1 Charge gain/charge loss junction leakage prevention for flash technology by using double isolation/capping layer between lightly doped drain and gate 失效
公开(公告)号：US06589841B1
公开(公告)日：2003-07-08
申请号：US10180772
申请日：2002-06-25
申请人： Tuan Duc Pham , Mark T. Ramsbey , Sameer S. Haddad , Angela T. Hui
发明人： Tuan Duc Pham , Mark T. Ramsbey , Sameer S. Haddad , Angela T. Hui
IPC分类号： H01L29788
CPC分类号： H01L27/11526 , H01L27/105 , H01L27/11543
摘要： An improved flash memory device having core stacks and periphery stacks which are protected by first and second thin side walls, side spacers over the side walls, and an HTO layer over the stacks, and side spacer. The flash memory device has an intermetallic dielectric layer placed over the HTO layer. A tungsten plug is placed in the intermetallic dielectric layer to provide an electrical connection to the drain of the flash memory device. The additional first and second side walls reduce current leakage between core stacks and the tungsten plug and help to protect the stacks during fabrication.

8. 发明授权

US06867097B1 Method of making a memory cell with polished insulator layer 有权
标题翻译：制造具有抛光绝缘体层的存储单元的方法
公开(公告)号：US06867097B1
公开(公告)日：2005-03-15
申请号：US09430366
申请日：1999-10-28
申请人： Mark T. Ramsbey , Robert B. Ogle , Tommy C. Hsiao , Angela T. Hui , Tuan Duc Pham , Marina V. Plat , Lewis Shen
发明人： Mark T. Ramsbey , Robert B. Ogle , Tommy C. Hsiao , Angela T. Hui , Tuan Duc Pham , Marina V. Plat , Lewis Shen
IPC分类号： H01L21/28 , H01L21/3105 , H01L21/314 , H01L21/316 , H01L21/336
CPC分类号： H01L29/66825 , H01L21/28273 , H01L21/31053 , H01L21/3144 , H01L21/31612
摘要： An improved method of making a flash memory cell including a substrate having a floating gate of a first thickness includes depositing an insulator on the substrate and over the floating gate. The insulator is preferably a high quality oxide. A portion of the insulator not covering the floating gate has a second thickness which is greater than the first thickness of the floating gate. The method further includes polishing the insulator until the second thickness is substantially equal to the first thickness. Polishing results in a planar floating gate and insulator layer. The method further includes sequentially depositing a dielectric layer and a control gate layer on the planar floating gate and insulator layer and then etching these layers to complete the stacked gate structure of the memory cell.
摘要翻译：制造包括具有第一厚度的浮动栅极的衬底的闪存单元的改进方法包括在衬底上并在浮动栅极上沉积绝缘体。绝缘体优选是高质量的氧化物。不覆盖浮动栅极的绝缘体的一部分具有大于浮栅的第一厚度的第二厚度。该方法还包括抛光绝缘体，直到第二厚度基本上等于第一厚度。抛光导致平面浮栅和绝缘体层。该方法还包括在平面浮置栅极和绝缘体层上依次沉积介电层和控制栅极层，然后蚀刻这些层以完成存储单元的堆叠栅极结构。

9. 发明授权

US06465835B1 Charge gain/charge loss junction leakage prevention for flash technology by using double isolation/capping layer between lightly doped drain and gate 有权
标题翻译：通过在轻掺杂漏极和栅极之间使用双重隔离/覆盖层，对闪存技术进行充电增益/电荷损耗结漏电防护
公开(公告)号：US06465835B1
公开(公告)日：2002-10-15
申请号：US09487964
申请日：2000-01-18
申请人： Tuan Duc Pham , Mark T. Ramsbey , Sameer S. Haddad , Angela T. Hui
发明人： Tuan Duc Pham , Mark T. Ramsbey , Sameer S. Haddad , Angela T. Hui
IPC分类号： H01L29788
CPC分类号： H01L27/11526 , H01L27/105 , H01L27/11543
摘要： An improved flash memory device having core stacks and periphery stacks which are protected by first and second thin side walls, side spacers over the side walls, and an HTO layer over the stacks, and side spacer. The flash memory device has an intermetallic dielectric layer placed over the HTO layer. A tungsten plug is placed in the intermetallic dielectric layer to provide an electrical connection to the drain of the flash memory device. The additional first and second side walls reduce current leakage between core stacks and the tungsten plug and help to protect the stacks during fabrication.
摘要翻译：具有由第一和第二薄侧壁，侧壁上的侧隔离物以及叠层上的HTO层和侧隔板保护的芯堆叠和外围堆叠的改进的闪存器件。闪存器件具有置于HTO层上的金属间介电层。将钨塞放置在金属间介电层中以提供与闪存器件的漏极的电连接。附加的第一和第二侧壁减小了芯堆叠和钨插头之间的电流泄漏，并有助于在制造期间保护堆叠。

10. 发明授权

US06455373B1 Semiconductor device having gate edges protected from charge gain/loss 有权
标题翻译：具有防止电荷增益/损耗的栅极边缘的半导体器件
公开(公告)号：US06455373B1
公开(公告)日：2002-09-24
申请号：US09834419
申请日：2001-04-12
申请人： Tuan D. Pham , Mark T. Ramsbey , Sameer S. Haddad , Angela T. Hui , Yu Sun , Chi Chang
发明人： Tuan D. Pham , Mark T. Ramsbey , Sameer S. Haddad , Angela T. Hui , Yu Sun , Chi Chang
IPC分类号： H01L21336
CPC分类号： H01L27/11526 , H01L21/823468 , H01L27/105 , H01L27/11536
摘要： A plurality of core gate stacks and periphery gates on the substrate, each core gate stack and periphery gate having at least one side and first and second protective shoulders formed on said plurality of core gate stacks and periphery gates, such that a dopant can be implanted sequentially into source and drain regions of a substrate supporting the stacks to establish transistors and such that charge migration into said at least one side of the gate stacks during interlayer dielectric (ILD) formation and device metallization is prevented, at least the second shoulder being frabricated from at least one material selected from a group consisting essentially of nitride and silicon oxynitride (SiON).
摘要翻译：在基板上的多个核心栅极叠层和周边栅极，每个芯栅极叠层和周边栅极具有形成在所述多个芯栅极叠层和外围栅极上的至少一个侧面和第一和第二保护肩部，使得掺杂剂可被植入顺序地进入支撑堆叠的衬底的源极和漏极区域以建立晶体管，并且防止在层间电介质（ILD）形成和器件金属化期间电荷迁移到栅极叠层的所述至少一个侧面，至少第二肩部被破坏选自由氮化物和氮氧化硅（SiON）组成的组中的至少一种材料。

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