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1. 发明授权

US06329899B1 Formation of thin film resistors 有权
标题翻译：薄膜电阻的形成
公开(公告)号：US06329899B1
公开(公告)日：2001-12-11
申请号：US09198954
申请日：1998-11-24
申请人： Andrew T. Hunt , Wen-Yi Lin , Shara S. Shoup , Richard W. Carpenter , Stephen E. Bottomley , Tzyy Jiuan Hwang , Michelle Hendrick
发明人： Andrew T. Hunt , Wen-Yi Lin , Shara S. Shoup , Richard W. Carpenter , Stephen E. Bottomley , Tzyy Jiuan Hwang , Michelle Hendrick
IPC分类号： H01L1012
CPC分类号： H01L28/20 , C23C16/40 , C23C16/453 , H01C7/006 , H01C17/20 , H01C17/2416 , H05K1/167 , H05K3/064 , H05K2201/0317 , H05K2201/0355 , H05K2203/0338 , H05K2203/1338
摘要： A method is provided for forming a patterned layer of resistive material in electrical contact with a layer of electrically conducting material. A three-layer structure is formed which comprises a metal conductive layer, an intermediate layer formed of material which is degradable by a chemical etchant, and a layer of resistive material of sufficient porosity such that the chemical etchant for said intermediate layer may seep through the resistive material and chemically degrade said intermediate layer so that the resistive material may be ablated from said conductive layer wherever the intermediate layer is chemically degraded. A patterned photoresist layer is formed on the resistive material layer. The resistive material layer is exposed to the chemical etchant for said intermediate layer so that the etchant seeps through the porous resistive material layer and degrades the intermediate layer. Then, portions of the resistive material layer are ablated away wherever the intermediate layer has been degraded.
摘要翻译：提供了一种用于形成与导电材料层电接触的电阻材料的图案化层的方法。形成三层结构，其包括金属导电层，由可通过化学蚀刻剂降解的材料形成的中间层和足够孔隙率的电阻材料层，使得所述中间层的化学蚀刻剂可渗透通过电阻材料并化学降解所述中间层，使得电阻材料可以在中间层被化学降解的地方从所述导电层烧蚀。在电阻材料层上形成图案化的光致抗蚀剂层。电阻材料层暴露于所述中间层的化学蚀刻剂，使得蚀刻剂渗透通过多孔电阻材料层并降解中间层。然后，中间层已经劣化的地方，电阻材料层的部分被消融掉。

2. 发明授权

US06500350B1 Formation of thin film resistors 有权
标题翻译：薄膜电阻的形成
公开(公告)号：US06500350B1
公开(公告)日：2002-12-31
申请号：US09779990
申请日：2001-02-08
申请人： Andrew T. Hunt , Wen-Yi Lin , Shara S. Shoup , Richard W. Carpenter , Stephen E. Bottomley , Tzyy Jiuan Hwang , Michelle Hendrick
发明人： Andrew T. Hunt , Wen-Yi Lin , Shara S. Shoup , Richard W. Carpenter , Stephen E. Bottomley , Tzyy Jiuan Hwang , Michelle Hendrick
IPC分类号： H01C112
CPC分类号： H01L28/20 , C23C16/40 , C23C16/453 , H01C7/006 , H01C17/20 , H01C17/2416 , H05K1/167 , H05K3/064 , H05K2201/0317 , H05K2201/0355 , H05K2203/0338 , H05K2203/1338
摘要： A method is provided for forming a patterned layer of resistive material in electrical contact with a layer of electrically conducting material. A three-layer structure is formed which comprises a metal conductive layer, an intermediate layer formed of material which is degradable by a chemical etchant, and a layer of resistive material of sufficient porosity such that the chemical etchant for said intermediate layer may seep through the resistive material and chemically degrade said intermediate layer so that the resistive material may be ablated from said conductive layer wherever the intermediate layer is chemically degraded. A patterned photoresist layer is formed on the resistive material layer. The resistive material layer is exposed to the chemical etchant for said intermediate layer so that the etchant seeps through the porous resistive material layer and degrades the intermediate layer. Then, portions of the resistive material layer are ablated away wherever the intermediate layer has been degraded.
摘要翻译：提供了一种用于形成与导电材料层电接触的电阻材料的图案化层的方法。形成三层结构，其包括金属导电层，由可通过化学蚀刻剂降解的材料形成的中间层和足够孔隙率的电阻材料层，使得所述中间层的化学蚀刻剂可渗透通过电阻材料并化学降解所述中间层，使得电阻材料可以在中间层被化学降解的地方从所述导电层烧蚀。在电阻材料层上形成图案化的光致抗蚀剂层。电阻材料层暴露于所述中间层的化学蚀刻剂，使得蚀刻剂渗透通过多孔电阻材料层并降解中间层。然后，中间层已经劣化的地方，电阻材料层的部分被消融掉。

3. 发明授权

US06433993B1 Formation of thin film capacitors 有权
公开(公告)号：US06433993B1
公开(公告)日：2002-08-13
申请号：US09283100
申请日：1999-03-31
申请人： Andrew T. Hunt , Wen-Yi Lin , Tzyy Jiuan Hwang , Michelle Hendrick , Helmut G. Hornis
发明人： Andrew T. Hunt , Wen-Yi Lin , Tzyy Jiuan Hwang , Michelle Hendrick , Helmut G. Hornis
IPC分类号： H01G4005
CPC分类号： H01G4/085 , H05K1/162 , H05K3/388 , H05K3/467 , H05K2201/0175 , H05K2201/0179 , H05K2201/0317 , H05K2201/0355 , H05K2201/09309
摘要： Thin layer capacitors are formed from a first flexible metal layer, a dielectric layer between about 0.03 and about 2 microns deposited thereon, and a second flexible metal layer deposited on the dielectric layer. The first flexible metal layer may either be a metal foil, such as a copper, aluminum, or nickel foil, or a metal layer deposited on a polymeric support sheet. Depositions of the layers is by or is facilitate by combustion chemical vapor deposition or controlled atmosphere chemical vapor deposition.

4. 发明授权

US07351449B2 Chemical vapor deposition methods for making powders and coatings, and coatings made using these methods 有权
标题翻译：用于制造粉末和涂层的化学气相沉积方法以及使用这些方法制备的涂层
公开(公告)号：US07351449B2
公开(公告)日：2008-04-01
申请号：US09748714
申请日：2000-12-21
申请人： Andrew T. Hunt , Girish N. Deshpande , Tzyy-Jiuan Jan Hwang , Nii Sowa Laye , Miodrag Oljaca , Subramaniam Shanmugham , Shara S. Shoup , Trifon Tomov , William J. Dalzell, Jr. , Aimee Poda , Michelle Hendrick
发明人： Andrew T. Hunt , Girish N. Deshpande , Tzyy-Jiuan Jan Hwang , Nii Sowa Laye , Miodrag Oljaca , Subramaniam Shanmugham , Shara S. Shoup , Trifon Tomov , William J. Dalzell, Jr. , Aimee Poda , Michelle Hendrick
IPC分类号： C23C16/00 , C23C4/00
CPC分类号： C23C16/45587 , C23C16/453 , Y10T428/31507 , Y10T428/31598 , Y10T428/31786
摘要： Flame produced vapors for combustion chemical vapor deposition are redirected from the direction of the flame by differential atmospheric pressure, such as positive pressure provided by a blower or negative pressure provided by a vacuum. This allows, for example, lower surface temperatures of substrates being coated with flame-produced vapors and coating of interior surfaces.
摘要翻译：用于燃烧化学气相沉积的火焰产生的蒸气从不同的大气压力（例如由真空提供的正压力或由真空提供的负压）从火焰的方向转向。这允许例如涂覆有火焰产生的蒸汽的衬底的较低表面温度和内表面的涂层。

5. 发明申请

US20100021710A1 Antimicrobial coatings 审中-公开
标题翻译：抗微生物涂料
公开(公告)号：US20100021710A1
公开(公告)日：2010-01-28
申请号：US12499507
申请日：2009-07-08
申请人： Andrew Tye Hunt , Holly E. Harris , Michelle Hendrick
发明人： Andrew Tye Hunt , Holly E. Harris , Michelle Hendrick
IPC分类号： B32B15/08
CPC分类号： A01N59/16 , A01N59/20 , Y10T428/265 , A01N25/02 , A01N25/34 , A01N2300/00
摘要： The present invention comprises the use of silver-containing nanomaterials that have reduced interaction with light and still mitigate the growth of microorganisms, including fungi. The nanolayer is sufficiently thin and can be non-continuous, so that it has nominal optical effects on the material it is formed on. Silver is combined with other elements to minimize its diffusion and growth into larger sized grains that then would have increased effects on optical properties. Preferably, the additional elements also have mitigation properties for microorganisms, but are not harmful to larger organisms, including humans. Embodiments of the present invention can be used on a wide range of substrates, used in applications such as food processing, food packaging, medical instruments and devices, surgical and health facility surfaces, and other surfaces where it is desirable to mitigate or control the growth of microorganisms.
摘要翻译：本发明包括使用具有减少与光的相互作用并且还减轻包括真菌在内的微生物生长的含银纳米材料。纳米层足够薄并且可以是非连续的，使得其对其形成的材料具有标称的光学效果。银与其他元素组合以使其扩散和生长最小化成更大尺寸的颗粒，然后将对光学性质产生增加的影响。优选地，附加元件还具有微生物的减轻性质，但对包括人类的较大生物体无害。本发明的实施方案可以用于广泛的基材，用于食品加工，食品包装，医疗器械和器械，外科和健康设施表面等应用，以及希望缓解或控制生长的其它表面的微生物。

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