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    • 3. 发明申请
    • DETECTION OF SUBSTRATE WARPING DURING RAPID THERMAL PROCESSING
    • 在快速热处理过程中检测基板的温度
    • US20120308215A1
    • 2012-12-06
    • US13153135
    • 2011-06-03
    • Jiping Li
    • Jiping Li
    • F27D11/12
    • F27B17/0025F27D19/00F27D21/00
    • Apparatus and methods for detecting substrate warping during RTP processing are provided. In one embodiment, one or more beams of light are provided above and across the substrate being processed. In this embodiment, the amount of beam blockage correlates to the amount of substrate warping. In another embodiment, a beam of light is reflected off of a substrate during processing. In this embodiment, the amount of movement of the beam correlates to the amount of substrate warping. In yet another embodiment, a region of a substrate is illuminated during processing. In this embodiment, images of the illuminated region are analyzed to determine the amount of substrate warping.
    • 提供了用于在RTP处理期间检测基板翘曲的装置和方法。 在一个实施例中,一个或多个光束被提供在被处理的衬底之上和之上。 在该实施例中,光束阻塞的量与基板翘曲的量相关。 在另一个实施例中,在处理期间,光束被从衬底反射出来。 在该实施例中,光束的移动量与基板翘曲量相关。 在另一个实施例中,衬底的区域在处理期间被照亮。 在该实施例中,分析照明区域的图像以确定基板翘曲的量。