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    • 1. 发明授权
    • Network vector channel analyzer
    • 网络矢量通道分析仪
    • US06456092B1
    • 2002-09-24
    • US09698876
    • 2000-10-27
    • Andreas ArnoldOliver BrazHans KunkelManfred Thumm
    • Andreas ArnoldOliver BrazHans KunkelManfred Thumm
    • G01R2732
    • G01R27/28H03L7/099
    • In a vector network analyzer with a transmitting and, a receiving side, each including a downward mixing super heterodyne receiver, a high voltage power supply for providing an accelerating voltage is arranged in series with a second power supply with a controllable lower output voltage so that unavoidable voltage variations in the acceleration voltage can be controlled. The second power supply is connected to the output of a phase and frequency discriminator by way of an amplifier and a low-pass filter. The discriminator has two inputs, one receiving the downwardly mixed transmitting side signal and the other the signal provided by a reference oscillator having a constant frequency. As millimeter wave oscillator a backward wave oscillator is used whose frequency drifting by temperature changes or by aging is compensated for by a control signal for the second power supply, which control signal is derived from the phase and frequency discriminator.
    • 在具有发送和接收侧的矢量网络分析器中,每个包括向下混合超外差接收器,用于提供加速电压的高压电源与具有可控的较低输出电压的第二电源串联布置,使得 可以控制加速电压中的不可避免的电压变化。 第二电源通过放大器和低通滤波器连接到相位和鉴频器的输出端。 鉴频器具有两个输入,一个接收向下混合的发送侧信号,另一个由具有恒定频率的参考振荡器提供的信号。 作为毫米波振荡器,使用通过温度变化或老化的频率偏移的反向波形振荡器由第二电源的控制信号补偿,该控制信号从相位和频率鉴别器导出。
    • 5. 发明授权
    • Antenna system producing a millimeter wave beam having a Gaussian-like
distribution
    • 产生具有高斯分布的毫米波束的天线系统
    • US5302962A
    • 1994-04-12
    • US688502
    • 1991-05-23
    • Luigi RebuffiManfred Thumm
    • Luigi RebuffiManfred Thumm
    • G21B1/11H01P3/20H01Q15/24H05H1/18H01Q13/00
    • H01Q15/248H05H1/18
    • An antenna system for producing a millimeter wave beam having a Gaussian distribution uses a high power source and a partial mode converter operatively coupled to the source and reviving from the source a T.sub.m,n mode wave which might either be TE.sub.m,n or TM.sub.m,n'. The converter delivers a mixture of modes including the mode T.sub.m,n at a relative power rate of 70 to 85% and at a relative phase 0, and at least one of the following additional modes, namely T.sub.m,n-1 at a relative power rate of 10 to 20% and at relative phase .pi., and TE.sub.m,n+1 at a relative power rate of 10 to 20% and at relative phase .pi.. The mixture of modes is applied to a collimation reflector (3, 10), having a concentration point (5) constituting the antenna system outlet. The antenna system can convert any T.sub.m,n mode into a linearly polarized narrow beam of very high power (about 1 MW) and and of high frequencies above 100 GHz.
    • PCT No.PCT / EP89 / 01483第 371日期1991年5月23日 102(e)日期1991年5月23日PCT提交1989年12月5日PCT公布。 出版物WO90 / 06665 日期:1990年6月14日。用于产生具有高斯分布的毫米波束的天线系统使用高功率源和部分模式转换器,其可操作地耦合到源并且从源恢复来自Tm,n模式波 TEm,n或TMm,n'。 转换器提供模式的混合,包括模式Tm,n,相对功率为70至85%,相对相位0,以及至少一个以下附加模式,即相对功率下的Tm,n-1 速率为10〜20%,相对相位(pi)为10〜20%,相对相位(pi)为TEm,n + 1。 将模式的混合应用于具有构成天线系统出口的浓度点(5)的准直反射器(3,10)。 天线系统可以将任何Tm,n模式转换成非常高功率(约1MW)的线性极化窄波束和高于100GHz的高频。
    • 6. 发明授权
    • Lead frame for leaded semiconductor chip carriers
    • 引线框架为引线半导体芯片载体
    • US4477827A
    • 1984-10-16
    • US526600
    • 1983-08-26
    • John C. WalkerManfred Thumm
    • John C. WalkerManfred Thumm
    • H01L21/50H01L23/495H01L23/48H01L23/28H01L29/44
    • H01L21/50H01L23/49541H01L2224/05554H01L2224/48091H01L2224/48247H01L24/48H01L2924/00014H01L2924/01322H01L2924/09701
    • A lead frame with parallel side members and parallel transverse members defining chip receiving areas along the frame, has a chip pad at each area. A support lead extends from each corner of the chip pad to corresponding conjunctions of side and transverse members. A U-shaped support bar extends between each adjacent pair of support leads, each support bar including spaced parallel leg portions connected at inner ends to the support leads and at the outer ends by a lead support portion. Leads extend from each lead support portion towards the chip pad. By this means the chip can be assembled to the pad and wire bonding between chip and leads carried out and the leads can be preformed or not, as desired, prior to encapsulation. After encapsulation, the lead support portions can be trimmed off but the encapsulated device is still held in the lead frame but the leads are electrically isolated from each other. Testing can be carried out while devices are still in the lead frame.
    • 具有平行侧构件和沿着框架定义芯片接收区域的平行横向构件的引线框架在每个区域具有芯片垫。 支撑引线从芯片垫的每个角延伸到相应的侧面和横向构件的连接。 U形支撑杆在每个相邻的一对支撑引线之间延伸,每个支撑杆包括在内端连接到支撑引线并且在外端由引线支撑部分连接的间隔开的平行腿部。 引线从每个引线支撑部分延伸到芯片焊盘。 通过这种方式,芯片可以组装到焊盘,并且在芯片和引线之间进行导线接合,并且可以根据需要在封装之前预先形成导线。 在封装之后,可以修剪引线支撑部分,但是封装的器件仍然保持在引线框架中,但是引线彼此电隔离。 当设备仍处于引导框架时,可以进行测试。