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1. 发明申请

US20050111188A1 Thermal management device for an integrated circuit 审中-公开
标题翻译：集成电路的热管理装置
公开(公告)号：US20050111188A1
公开(公告)日：2005-05-26
申请号：US10723533
申请日：2003-11-26
申请人： Anandaroop Bhattacharya , Ravi Prasher , Jerome Garcia , Suzana Prstic
发明人： Anandaroop Bhattacharya , Ravi Prasher , Jerome Garcia , Suzana Prstic
IPC分类号： H01L23/427 , H01L23/473 , H05K7/20
CPC分类号： H01L23/427 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of the present invention include an apparatus, method, and system for an electronic assembly with a thermal management device including a porous medium.
摘要翻译：本发明的实施例包括具有包括多孔介质的热管理装置的电子组件的装置，方法和系统。

2. 发明申请

US20090127701A1 Thermal attach for electronic device cooling 审中-公开
标题翻译：热附件用于电子设备冷却
公开(公告)号：US20090127701A1
公开(公告)日：2009-05-21
申请号：US11985583
申请日：2007-11-15
申请人： Nitin Goel , Anandaroop Bhattacharya , Rajiv Mongia
发明人： Nitin Goel , Anandaroop Bhattacharya , Rajiv Mongia
IPC分类号： H01L23/36
CPC分类号： H01L23/42 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of thermal cooling devices and systems including dies and thermal attaches having surface features are described in this application. The thermal attach may have a surface feature, such as a pattern, to limit movement of a thermal interface material, such as thermal grease, from between the die and the thermal attachment. The restriction of movement of the thermal interface material may improve the thermal performance of cooling systems for electronic devices over many cycles as opposed to known cooling systems. Other embodiments are described.
摘要翻译：在本申请中描述了具有表面特征的热冷却装置和包括管芯和热连接件的系统的实施例。热连接件可以具有诸如图案的表面特征，以限制模具和热附件之间的热界面材料（例如导热油脂）的移动。与已知的冷却系统相比，热界面材料的运动的限制可以改善电子设备在许多循环中的冷却系统的热性能。描述其他实施例。

3. 发明授权

US07183642B2 Electronic package with thermally-enhanced lid 有权
标题翻译：带增强盖的电子封装
公开(公告)号：US07183642B2
公开(公告)日：2007-02-27
申请号：US10241994
申请日：2002-09-11
申请人： Anandaroop Bhattacharya , Varaprasad V. Calmidi , Sanjeev B. Sathe
发明人： Anandaroop Bhattacharya , Varaprasad V. Calmidi , Sanjeev B. Sathe
IPC分类号： H01L23/36 , H01L23/34 , H01L31/024
CPC分类号： H01L23/42 , H01L21/563 , H01L23/3128 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/15311 , H01L2924/00 , H01L2224/0401
摘要： Removing heat generated by an operating IC chip from both the chip and the electronics package containing the chip is essential for proper system operation and to increase the life of the electronics package. Using an air permeable lid with the electronic package increases the heat transfer away from the IC chip and electronics package, thereby cooling the chip and the package.
摘要翻译：从芯片和包含芯片的电子封装中去除由工作IC芯片产生的热量对于正确的系统操作和延长电子封装的寿命至关重要。使用具有电子封装的透气盖增加远离IC芯片和电子封装的热传递，从而冷却芯片和封装。

4. 发明授权

US06958912B2 Enhanced heat exchanger 有权
标题翻译：增强换热器
公开(公告)号：US06958912B2
公开(公告)日：2005-10-25
申请号：US10716734
申请日：2003-11-18
申请人： Himanshu Pokharna , Anandaroop Bhattacharya
发明人： Himanshu Pokharna , Anandaroop Bhattacharya
IPC分类号： H01L23/427 , H01L23/473 , H05K7/20
CPC分类号： H01L23/473 , F28F13/003 , H01L23/427 , H01L2924/0002 , Y10S165/907 , H01L2924/00
摘要： According to some embodiments, an enhanced heat exchanger may be provided. The enhanced heat exchanger may comprise, for example, a heat transfer portion to receive heat from a heat source and to transfer heat from the heat source, and a remote heat sink adjacent to the heat transfer portion to remove heat from the heat transfer portion. In some embodiments, the remote heat sink may comprise a solid metal portion that extends away from the heat transfer portion, and a porous medium coupled to the solid metal portion. According to some embodiments, the porous medium may extend away from the solid metal portion such that a thermal boundary layer exists in substantially the entire porous medium.
摘要翻译：根据一些实施例，可以提供增强的热交换器。增强的热交换器可以包括例如热传递部分，以从热源接收热量并且传递来自热源的热量，以及邻近传热部分的远程散热器以从热传递部分移除热量。在一些实施例中，远程散热器可以包括远离热传递部分延伸的固体金属部分和耦合到固体金属部分的多孔介质。根据一些实施例，多孔介质可以远离固体金属部分延伸，使得热边界层存在于基本上整个多孔介质中。

5. 发明申请

US20090323276A1 HIGH PERFORMANCE SPREADER FOR LID COOLING APPLICATIONS 审中-公开
标题翻译：用于冷却应用的高性能膨胀机
公开(公告)号：US20090323276A1
公开(公告)日：2009-12-31
申请号：US12491097
申请日：2009-06-24
申请人： Rajiv K. Mongia , Krishnakumar Varadarajan , Anandaroop Bhattacharya
发明人： Rajiv K. Mongia , Krishnakumar Varadarajan , Anandaroop Bhattacharya
IPC分类号： G06F1/20 , H05K13/00
CPC分类号： G06F1/203 , F28D15/0266 , G06F2200/201 , Y10T29/49002
摘要： Apparatuses, systems, and methods for a heat spreader plate and pulsating heat pipes to transfer heat sourced from one or more electronic components are described herein. Other embodiments may also be described and claimed.
摘要翻译：本文描述了用于散热板和用于传送来自一个或多个电子部件的热的脉动热管的装置，系统和方法。也可以描述和要求保护其他实施例。

6. 发明申请

US20090190302A1 METHOD, APPARATUS AND COMPUTER SYSTEM FOR VORTEX GENERATOR ENHANCED COOLING 有权
标题翻译：用于VORTEX发电机增强冷却的方法，装置和计算机系统
公开(公告)号：US20090190302A1
公开(公告)日：2009-07-30
申请号：US12021681
申请日：2008-01-29
申请人： Anandaroop Bhattacharya , Rajiv K. Mongia , Krishnakumar Varadarajan
发明人： Anandaroop Bhattacharya , Rajiv K. Mongia , Krishnakumar Varadarajan
IPC分类号： G06F1/20 , F25B9/02 , H05K7/20
CPC分类号： G06F1/20 , F28F13/12 , H01L23/467 , H01L2924/0002 , H05K7/20145 , H01L2924/00
摘要： Some embodiments of a method, apparatus and computer system are described for vortex generator enhanced cooling. The computer system may include a housing and an apparatus. The apparatus may include one or more vortex generators coupled to a heat spreader and positioned in close proximity to an electronic component, and a flow of air to provide for an exchange of thermal energy, where the flow of air is provided by a configuration of the housing, and where the one or more vortex generators may promote turbulence to enhance the exchange of thermal energy of the electronic component. In some embodiments, an air mover may be used to increase the flow of air in the housing. Other embodiments are described.
摘要翻译：描述了用于涡流发生器增强冷却的方法，装置和计算机系统的一些实施例。计算机系统可以包括壳体和装置。该装置可以包括一个或多个涡流发生器，其耦合到散热器并且定位成紧邻电子部件，以及空气流以提供热能交换，其中空气流由壳体，并且其中一个或多个涡流发生器可以促进湍流以增强电子部件的热能交换。在一些实施例中，可以使用空气推动器来增加壳体中的空气流。描述其他实施例。

7. 发明申请

US20050103480A1 Enhanced heat exchanger 有权
标题翻译：增强换热器
公开(公告)号：US20050103480A1
公开(公告)日：2005-05-19
申请号：US10716734
申请日：2003-11-18
申请人： Himanshu Pokharna , Anandaroop Bhattacharya
发明人： Himanshu Pokharna , Anandaroop Bhattacharya
IPC分类号： H01L23/427 , H01L23/473 , H05K7/20
CPC分类号： H01L23/473 , F28F13/003 , H01L23/427 , H01L2924/0002 , Y10S165/907 , H01L2924/00
摘要： According to some embodiments, an enhanced heat exchanger may be used to dissipate heat.
摘要翻译：根据一些实施例，可以使用增强的热交换器来散热。

8. 发明授权

US07764514B2 Electromagnetic interference shielding for device cooling 有权
标题翻译：用于器件冷却的电磁干扰屏蔽
公开(公告)号：US07764514B2
公开(公告)日：2010-07-27
申请号：US11890613
申请日：2007-08-06
申请人： Rajiv K. Mongia , Anandaroop Bhattacharya
发明人： Rajiv K. Mongia , Anandaroop Bhattacharya
IPC分类号： H05K9/00 , H05K7/20
CPC分类号： H05K9/0041
摘要： Embodiments disclosed herein include EMI shielding to cool a computing device with one or more vents. In some embodiments, a louvered vent formed in the EMI shield of a computing device creates an air curtain between the EMI shield and a heat-generating component to cool the component, the EMI shield and the external wall. Other embodiments are described.
摘要翻译：本文公开的实施例包括使用一个或多个通风口来冷却计算设备的EMI屏蔽。在一些实施例中，形成在计算装置的EMI屏蔽中的百叶窗通气孔在EMI屏蔽和发热部件之间产生气幕，以冷却部件，EMI屏蔽件和外壁。描述其他实施例。

9. 发明申请

US20080218968A1 WINGED PIEZO FAN 审中-公开
标题翻译： WINGED PIEZO风扇
公开(公告)号：US20080218968A1
公开(公告)日：2008-09-11
申请号：US11683902
申请日：2007-03-08
申请人： Anandaroop Bhattacharya , Rajiv K. Mongia
发明人： Anandaroop Bhattacharya , Rajiv K. Mongia
IPC分类号： H05K7/20 , H02N2/00
CPC分类号： H01L23/467 , F04D33/00 , H01L41/094 , H01L2924/0002 , H01L2924/00
摘要： A winged piezo-fan to dissipate the heat generated by the devices in an electronic system is disclosed. The winged piezo-fan may comprise a piezo-ceramic element and two blades. The blades may be coupled to the piezo-ceramic element, which may change its physical dimension in response to receiving an alternating voltage signal. The blades coupled to the piezo-ceramic element may move upwards and downwards in a direction that is perpendicular to the axis drawn along the length dimension of the blades in response to the changes in the physical dimension of the piezo-ceramic element. The movement of the blades may cause a flapping movement, which may create turbulence in the surrounding air. The turbulence so created may create eddies, which may dissipate the heat generated by the devices positioned close to the winged piezo-fan.
摘要翻译：公开了一种用于消散由电子系统中的装置产生的热量的翼形压电扇。翼形压电风扇可以包括压电陶瓷元件和两个叶片。叶片可以耦合到压电陶瓷元件，这可以响应于接收到交流电压信号而改变其物理尺寸。耦合到压电陶瓷元件的叶片可以响应于压电陶瓷元件的物理尺寸的变化，沿着垂直于叶片的长度尺寸绘制的轴线的方向向上和向下移动。叶片的运动可能引起扑动运动，这可能在周围空气中产生湍流。如此产生的湍流可能产生涡流，这可能会消散位于靠近翼状压电风扇的设备产生的热量。

10. 发明申请

US20080137291A1 Electromagnetic interference shielding for device cooling 有权
标题翻译：用于器件冷却的电磁干扰屏蔽
公开(公告)号：US20080137291A1
公开(公告)日：2008-06-12
申请号：US11890613
申请日：2007-08-06
申请人： Rajiv K. Mongia , Anandaroop Bhattacharya
发明人： Rajiv K. Mongia , Anandaroop Bhattacharya
IPC分类号： H05K7/20
CPC分类号： H05K9/0041
摘要： Embodiments disclosed herein include EMI shielding to cool a computing device with one or more vents. In some embodiments, a louvered vent formed in the EMI shield of a computing device creates an air curtain between the EMI shield and a heat-generating component to cool the component, the EMI shield and the external wall. Other embodiments are described.
摘要翻译：本文公开的实施例包括使用一个或多个通风口来冷却计算设备的EMI屏蔽。在一些实施例中，形成在计算装置的EMI屏蔽中的百叶窗通气孔在EMI屏蔽和发热部件之间产生气幕，以冷却部件，EMI屏蔽件和外壁。描述其他实施例。

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