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1. 发明授权

US06514214B2 Intravascular temperature sensor 有权
标题翻译：血管内温度传感器
公开(公告)号：US06514214B2
公开(公告)日：2003-02-04
申请号：US09782502
申请日：2001-02-13
申请人： Jaydeep Y. Kokate , Eric M. DoBrava , Marwane S. Berrada , Scott Kimmel , Suzana Prstic , Michael F. Hoey , Avram Bar-Cohen , Paul A. Iaizzo
发明人： Jaydeep Y. Kokate , Eric M. DoBrava , Marwane S. Berrada , Scott Kimmel , Suzana Prstic , Michael F. Hoey , Avram Bar-Cohen , Paul A. Iaizzo
IPC分类号： A61B500
CPC分类号： A61B5/01 , A61B5/6852 , A61B5/6853 , A61B5/6858 , A61B5/6859 , A61B5/6885 , A61B2017/00101 , A61B2017/22051
摘要： Devices and methods for detecting vulnerable plaque within a blood vessel are disclosed. A catheter in accordance with the present invention includes an elongate shaft having a proximal end, a distal end, and an outer surface. At least one temperature sensor is disposed proximate to the distal end of the elongate shaft. In one preferred embodiment, the at least one temperature sensor is adapted to contact an inner surface of the blood vessel. In another preferred embodiment, at least one temperature sensor is disposed within a channel defined by a body member that is disposed about the elongate shaft.
摘要翻译：公开了用于检测血管内的易损斑块的装置和方法。根据本发明的导管包括具有近端，远端和外表面的细长轴。至少一个温度传感器设置在细长轴的远端附近。在一个优选实施例中，至少一个温度传感器适于接触血管的内表面。在另一优选实施例中，至少一个温度传感器设置在由围绕细长轴布置的主体构件限定的通道内。

2. 发明授权

US06579243B2 Catheter with thermal sensor for detection of vulnerable plaque 有权
公开(公告)号：US06579243B2
公开(公告)日：2003-06-17
申请号：US09797400
申请日：2001-03-01
申请人： Jaydeep Y. Kokate , Eric M. DoBrava , Suzana Prstic , Scott Kimmell , Marwane S. Berrada , Avram Bar-Cohen , Michael Hoey
发明人： Jaydeep Y. Kokate , Eric M. DoBrava , Suzana Prstic , Scott Kimmell , Marwane S. Berrada , Avram Bar-Cohen , Michael Hoey
IPC分类号： A61B500
CPC分类号： A61M29/02 , A61B5/015 , A61B5/6853 , A61M25/0084 , A61M25/0147 , A61M25/104 , A61M2025/0089 , A61M2205/3368
摘要： Methods and devices for detecting vulnerable plaque within a blood vessel are disclosed. An elongate medical device in accordance with the present invention includes an elongate shaft having a proximal end and a distal end. A substrate is fixed to the elongate shaft proximate the distal end thereof, and a plurality of sensors are disposed on the substrate. Each sensor is preferably coupled to a switching device. The switching devices are preferably disposed on the substrate.

3. 发明授权

US08410802B2 System including thermal control unit having conduit for dispense and removal of liquid thermal interface material 有权
标题翻译：包括具有用于分配和去除液体热界面材料的导管的热控单元的系统
公开(公告)号：US08410802B2
公开(公告)日：2013-04-02
申请号：US12647261
申请日：2009-12-24
申请人： Ashish Gupta , James R. Hastings , Nader N. Abazarnia , Suzana Prstic , Jerome L. Garcia
发明人： Ashish Gupta , James R. Hastings , Nader N. Abazarnia , Suzana Prstic , Jerome L. Garcia
IPC分类号： G01R31/00
CPC分类号： F28F23/00 , G01R31/2874 , H01L23/42 , H01L2924/0002 , H01L2924/00
摘要： Systems and methods including testing of electronic components are described. One system relates to a system including a thermal control unit adapted to control the temperature of at least a portion of an electronic component during testing. The system includes at least one conduit extending through a portion of the thermal control unit, the conduit sized to permit the flow of a thermal interface material therethrough, the thermal interface material comprising a liquid. The at least one conduit is positioned so that the thermal interface material can be delivered through the conduit and onto the electronic component. The system also includes a device adapted to control the flow of the thermal interface material through the conduit, wherein the flow can be controlled to deliver the thermal interface material to the electronic component and to remove the thermal interface material from the electronic component. Other embodiments are described and claimed.
摘要翻译：描述了包括电子元件测试的系统和方法。一个系统涉及包括适于在测试期间控制电子部件的至少一部分的温度的热控制单元的系统。该系统包括延伸穿过热控制单元的一部分的至少一个导管，该导管的尺寸适于允许热界面材料流过其中，该热界面材料包括液体。定位至少一个导管，使得热界面材料可以通过导管输送到电子部件上。该系统还包括适于控制通过导管的热界面材料的流动的装置，其中可以控制流动以将热界面材料输送到电子部件并从电子部件移除热界面材料。描述和要求保护其他实施例。

4. 发明授权

US07982478B2 Liquid TIM dispense and removal method and assembly 有权
标题翻译：液体TIM分配和去除方法和装配
公开(公告)号：US07982478B2
公开(公告)日：2011-07-19
申请号：US12345234
申请日：2008-12-29
申请人： Nader Abazarnia , Ashish X Gupta , Suzana Prstic
发明人： Nader Abazarnia , Ashish X Gupta , Suzana Prstic
IPC分类号： G01R31/26
CPC分类号： G01R31/2874
摘要： In some embodiments, a liquid TIM dispense and removal method and assembly is presented. In this regard, a method is introduced including loading an absorbent material of a thermal control unit with a liquid thermal interface material (TIM), pressing the absorbent material against an integrated circuit device causing the liquid TIM to be released, testing the integrated circuit device, and removing the absorbent material from against the integrated circuit device causing the liquid TIM to be reabsorbed. Other embodiments are also disclosed and claimed.
摘要翻译：在一些实施例中，呈现液体TIM分配和去除方法和组装。在这方面，引入了一种方法，其包括将热控制单元的吸收材料装载有液体热界面材料（TIM），将吸收材料压靠在集成电路装置上，使得液体TIM被释放，测试集成电路装置并且将吸收材料从集成电路装置上除去，导致液体TIM被再吸收。还公开并要求保护其他实施例。

5. 发明申请

US20050111188A1 Thermal management device for an integrated circuit 审中-公开
标题翻译：集成电路的热管理装置
公开(公告)号：US20050111188A1
公开(公告)日：2005-05-26
申请号：US10723533
申请日：2003-11-26
申请人： Anandaroop Bhattacharya , Ravi Prasher , Jerome Garcia , Suzana Prstic
发明人： Anandaroop Bhattacharya , Ravi Prasher , Jerome Garcia , Suzana Prstic
IPC分类号： H01L23/427 , H01L23/473 , H05K7/20
CPC分类号： H01L23/427 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of the present invention include an apparatus, method, and system for an electronic assembly with a thermal management device including a porous medium.
摘要翻译：本发明的实施例包括具有包括多孔介质的热管理装置的电子组件的装置，方法和系统。

6. 发明申请

US20110155348A1 LIQUID THERMAL INTERFACE MATERIAL DISPENSE AND REMOVAL SYSTEM 有权
标题翻译：液体热界面材料分离和去除系统
公开(公告)号：US20110155348A1
公开(公告)日：2011-06-30
申请号：US12647261
申请日：2009-12-24
申请人： Ashish GUPTA , James R. Hastings , Nader N. Abazarnia , Suzana Prstic , Jerome L. Garcia
发明人： Ashish GUPTA , James R. Hastings , Nader N. Abazarnia , Suzana Prstic , Jerome L. Garcia
IPC分类号： F28D15/00
CPC分类号： F28F23/00 , G01R31/2874 , H01L23/42 , H01L2924/0002 , H01L2924/00
摘要： Systems and methods including testing of electronic components are described. One system relates to a system including a thermal control unit adapted to control the temperature of at least a portion of an electronic component during testing. The system includes at least one conduit extending through a portion of the thermal control unit, the conduit sized to permit the flow of a thermal interface material therethrough, the thermal interface material comprising a liquid. The at least one conduit is positioned so that the thermal interface material can be delivered through the conduit and onto the electronic component. The system also includes a device adapted to control the flow of the thermal interface material through the conduit, wherein the flow can be controlled to deliver the thermal interface material to the electronic component and to remove the thermal interface material from the electronic component. Other embodiments are described and claimed.
摘要翻译：描述了包括电子元件测试的系统和方法。一个系统涉及包括适于在测试期间控制电子部件的至少一部分的温度的热控制单元的系统。该系统包括延伸穿过热控制单元的一部分的至少一个导管，该导管的尺寸适于允许热界面材料流过其中，该热界面材料包括液体。定位至少一个导管，使得热界面材料可以通过导管输送到电子部件上。该系统还包括适于控制通过导管的热界面材料的流动的装置，其中可以控制流动以将热界面材料输送到电子部件并从电子部件移除热界面材料。描述和要求保护其他实施例。

7. 发明申请

US20100164510A1 LIQUID TIM DISPENSE AND REMOVAL METHOD AND ASSEMBLY 有权
标题翻译：液体时间歧化和去除方法和装配
公开(公告)号：US20100164510A1
公开(公告)日：2010-07-01
申请号：US12345234
申请日：2008-12-29
申请人： Nader Abazarnia , Ashish X. Gupta , Suzana Prstic
发明人： Nader Abazarnia , Ashish X. Gupta , Suzana Prstic
IPC分类号： G01R31/02 , H05K7/20
CPC分类号： G01R31/2874
摘要： In some embodiments, a liquid TIM dispense and removal method and assembly is presented. In this regard, a method is introduced including loading an absorbent material of a thermal control unit with a liquid thermal interface material (TIM), pressing the absorbent material against an integrated circuit device causing the liquid TIM to be released, testing the integrated circuit device, and removing the absorbent material from against the integrated circuit device causing the liquid TIM to be reabsorbed. Other embodiments are also disclosed and claimed.
摘要翻译：在一些实施例中，呈现液体TIM分配和去除方法和组装。在这方面，引入了一种方法，其包括将热控制单元的吸收材料装载有液体热界面材料（TIM），将吸收材料压靠在集成电路装置上，使得液体TIM被释放，测试集成电路装置并且将吸收材料从集成电路装置上除去，导致液体TIM被再吸收。还公开并要求保护其他实施例。

8. 发明授权

US07332423B2 Soldering a die to a substrate 有权
标题翻译：将模具焊接到基板上
公开(公告)号：US07332423B2
公开(公告)日：2008-02-19
申请号：US11170188
申请日：2005-06-29
申请人： Robert Starkston , Sridhar Narasimhan , Chia-Pin Chiu , Suzana Prstic , Patrick N Stover , Hong Xie
发明人： Robert Starkston , Sridhar Narasimhan , Chia-Pin Chiu , Suzana Prstic , Patrick N Stover , Hong Xie
IPC分类号： H01L21/44
CPC分类号： H01L24/81 , H01L21/563 , H01L2224/14051 , H01L2224/73203 , H01L2224/81141 , H01L2224/81193 , H01L2224/81345 , H01L2224/81801 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K3/303 , H05K3/3436 , H05K3/3457 , H05K2201/094 , H05K2201/09781 , H05K2201/10674 , H05K2203/167 , Y02P70/613
摘要： One example electronic assembly includes a substrate that has a plurality of contacts which become bonded to a plurality of contacts on a die. The electronic assembly further includes a male member that extends from at least one of the substrate and the die and a female member that extends from the other of the substrate and the die. The male member is inserted into the female member to align the die relative to the substrate. The male member and the female member may have any configuration as long as one or more portions of the male member extend partially, or wholly, into the female member. An example method includes aligning a die relative to a substrate by inserting a male member that extends from one of the die and the substrate into a female member that extends from the other of the die and the substrate.
摘要翻译：一个示例性电子组件包括具有多个接触件的基板，该多个触点被结合到模具上的多个触点。电子组件还包括从基板和模具中的至少一个延伸的阳构件和从基板和模具中的另一个延伸的阴构件。将阳构件插入阴构件中以使模具相对于衬底对准。阳构件和阴构件可以具有任何构造，只要阳构件的一个或多个部分部分地或全部地延伸到阴构件中即可。一种示例性方法包括通过将从模具和基板中的一个延伸的阳构件插入从模具和基板中的另一个延伸的凹形构件中来相对于基板对准模具。

9. 发明申请

US20070001318A1 Soldering a die to a substrate 有权
标题翻译：将模具焊接到基板上
公开(公告)号：US20070001318A1
公开(公告)日：2007-01-04
申请号：US11170188
申请日：2005-06-29
申请人： Robert Starkston , Sridhar Narasimhan , Chia-Pin Chiu , Suzana Prstic , Patrick Stover , Hong Xie
发明人： Robert Starkston , Sridhar Narasimhan , Chia-Pin Chiu , Suzana Prstic , Patrick Stover , Hong Xie
IPC分类号： H01L23/48
CPC分类号： H01L24/81 , H01L21/563 , H01L2224/14051 , H01L2224/73203 , H01L2224/81141 , H01L2224/81193 , H01L2224/81345 , H01L2224/81801 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K3/303 , H05K3/3436 , H05K3/3457 , H05K2201/094 , H05K2201/09781 , H05K2201/10674 , H05K2203/167 , Y02P70/613
摘要： One example electronic assembly includes a substrate that has a plurality of contacts which become bonded to a plurality of contacts on a die. The electronic assembly further includes a male member that extends from at least one of the substrate and the die and a female member that extends from the other of the substrate and the die. The male member is inserted into the female member to align the die relative to the substrate. The male member and the female member may have any configuration as long as one or more portions of the male member extend partially, or wholly, into the female member. An example method includes aligning a die relative to a substrate by inserting a male member that extends from one of the die and the substrate into a female member that extends from the other of the die and the substrate.
摘要翻译：一个示例性电子组件包括具有多个接触件的基板，该多个触点被结合到模具上的多个触点。电子组件还包括从基板和模具中的至少一个延伸的阳构件和从基板和模具中的另一个延伸的阴构件。将阳构件插入阴构件中以使模具相对于衬底对准。阳构件和阴构件可以具有任何构造，只要阳构件的一个或多个部分部分地或全部地延伸到阴构件中即可。一种示例性方法包括通过将从模具和基板中的一个延伸的阳构件插入从模具和基板中的另一个延伸的凹形构件中来相对于基板对准模具。

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