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    • 5. 发明申请
    • ACTIVE DEVICE ARRAY SUBSTRATE
    • 主动设备阵列基板
    • US20120112214A1
    • 2012-05-10
    • US13353328
    • 2012-01-19
    • Yu-Cheng ChenChen-Yueh LiChing-Sang ChuangChing-Chieh ShihAn-Thung Cho
    • Yu-Cheng ChenChen-Yueh LiChing-Sang ChuangChing-Chieh ShihAn-Thung Cho
    • H01L27/15
    • H01L27/1288H01L27/1214
    • An active device array substrate is provided. First, a substrate having a display area and a sensing area is provided. Then, a first patterned conductor layer is disposed on the display area of the substrate. A gate insulator is disposed on the substrate. A patterned semiconductor layer, a second patterned conductor layer and a patterned photosensitive dielectric layer are disposed on the gate insulator, wherein the second patterned conductor layer includes a source electrode, a drain electrode and a lower electrode, the patterned photosensitive dielectric layer covering the second patterned conductor layer includes an interface protection layer disposed on the source electrode and the drain electrode and a photo-sensing layer disposed on the lower electrode. A passivation layer is then disposed on the substrate. After that, a third patterned conductor layer including a pixel electrode and an upper electrode is disposed on the passivation layer.
    • 提供有源器件阵列衬底。 首先,提供具有显示区域和感测区域的基板。 然后,在基板的显示区域上设置第一图案化导体层。 栅极绝缘体设置在基板上。 图案化半导体层,第二图案化导体层和图案化感光介电层设置在栅极绝缘体上,其中第二图案化导体层包括源电极,漏电极和下电极,图案化的感光介电层覆盖第二 图案化导体层包括设置在源电极和漏电极上的界面保护层和设置在下电极上的感光层。 然后在衬底上设置钝化层。 之后,在钝化层上设置包括像素电极和上部电极的第三图案化导体层。
    • 6. 发明申请
    • METHOD FOR FABRICATING ACTIVE DEVICE ARRAY SUBSTRATE
    • 用于制作主动装置阵列基板的方法
    • US20100267177A1
    • 2010-10-21
    • US12559506
    • 2009-09-15
    • Yu-Cheng ChenChen-Yueh LiChing-Sang ChuangChing-Chieh ShihAn-Thung Cho
    • Yu-Cheng ChenChen-Yueh LiChing-Sang ChuangChing-Chieh ShihAn-Thung Cho
    • H01L21/28
    • H01L27/1288H01L27/1214
    • A method for fabricating an active device array substrate is provided. First, a substrate having a display area and a sensing area is provided. Then, a first patterned conductor layer is formed on the display area of the substrate. A gate insulator is formed on the substrate. A patterned semiconductor layer, a second patterned conductor layer and a patterned photosensitive dielectric layer are formed on the gate insulator, wherein the second patterned conductor layer includes a source electrode, a drain electrode and a lower electrode, the patterned photosensitive dielectric layer covering the second patterned conductor layer includes an interface protection layer disposed on the source electrode and the drain electrode and a photo-sensing layer disposed on the lower electrode. A passivation layer is then formed on the substrate. After that, a third patterned conductor layer including a pixel electrode and an upper electrode is formed on the passivation layer.
    • 提供一种用于制造有源器件阵列衬底的方法。 首先,提供具有显示区域和感测区域的基板。 然后,在基板的显示区域上形成第一图案化导体层。 在基板上形成栅极绝缘体。 图案化的半导体层,第二图案化导体层和图案化的光敏介电层形成在栅极绝缘体上,其中第二图案化导体层包括源电极,漏电极和下电极,图案化的感光介电层覆盖第二 图案化导体层包括设置在源电极和漏电极上的界面保护层和设置在下电极上的感光层。 然后在衬底上形成钝化层。 之后,在钝化层上形成包括像素电极和上电极的第三图案化导体层。
    • 7. 发明授权
    • Active device array substrate
    • 有源器件阵列衬底
    • US08597968B2
    • 2013-12-03
    • US13353328
    • 2012-01-19
    • Yu-Cheng ChenChen-Yueh LiChing-Sang ChuangChing-Chieh ShihAn-Thung Cho
    • Yu-Cheng ChenChen-Yueh LiChing-Sang ChuangChing-Chieh ShihAn-Thung Cho
    • H01L21/00
    • H01L27/1288H01L27/1214
    • An active device array substrate is provided. First, a substrate having a display area and a sensing area is provided. Then, a first patterned conductor layer is disposed on the display area of the substrate. A gate insulator is disposed on the substrate. A patterned semiconductor layer, a second patterned conductor layer and a patterned photosensitive dielectric layer are disposed on the gate insulator, wherein the second patterned conductor layer includes a source electrode, a drain electrode and a lower electrode, the patterned photosensitive dielectric layer covering the second patterned conductor layer includes an interface protection layer disposed on the source electrode and the drain electrode and a photo-sensing layer disposed on the lower electrode. A passivation layer is then disposed on the substrate. After that, a third patterned conductor layer including a pixel electrode and an upper electrode is disposed on the passivation layer.
    • 提供有源器件阵列衬底。 首先,提供具有显示区域和感测区域的基板。 然后,在基板的显示区域上设置第一图案化导体层。 栅极绝缘体设置在基板上。 图案化半导体层,第二图案化导体层和图案化感光介电层设置在栅极绝缘体上,其中第二图案化导体层包括源电极,漏电极和下电极,图案化的感光介电层覆盖第二 图案化导体层包括设置在源电极和漏电极上的界面保护层和设置在下电极上的感光层。 然后在衬底上设置钝化层。 之后,在钝化层上设置包括像素电极和上部电极的第三图案化导体层。
    • 8. 发明授权
    • Method for fabricating active device array substrate
    • 制造有源器件阵列衬底的方法
    • US08148185B2
    • 2012-04-03
    • US12559506
    • 2009-09-15
    • Yu-Cheng ChenChen-Yueh LiChing-Sang ChuangChing-Chieh ShihAn-Thung Cho
    • Yu-Cheng ChenChen-Yueh LiChing-Sang ChuangChing-Chieh ShihAn-Thung Cho
    • H01L21/00
    • H01L27/1288H01L27/1214
    • A method for fabricating an active device array substrate is provided. First, a substrate having a display area and a sensing area is provided. Then, a first patterned conductor layer is formed on the display area of the substrate. A gate insulator is formed on the substrate. A patterned semiconductor layer, a second patterned conductor layer and a patterned photosensitive dielectric layer are formed on the gate insulator, wherein the second patterned conductor layer includes a source electrode, a drain electrode and a lower electrode, the patterned photosensitive dielectric layer covering the second patterned conductor layer includes an interface protection layer disposed on the source electrode and the drain electrode and a photo-sensing layer disposed on the lower electrode. A passivation layer is then formed on the substrate. After that, a third patterned conductor layer including a pixel electrode and an upper electrode is formed on the passivation layer.
    • 提供一种用于制造有源器件阵列衬底的方法。 首先,提供具有显示区域和感测区域的基板。 然后,在基板的显示区域上形成第一图案化导体层。 在基板上形成栅极绝缘体。 图案化的半导体层,第二图案化导体层和图案化的光敏介电层形成在栅极绝缘体上,其中第二图案化导体层包括源电极,漏电极和下电极,图案化的感光介电层覆盖第二 图案化导体层包括设置在源电极和漏电极上的界面保护层和设置在下电极上的感光层。 然后在衬底上形成钝化层。 之后,在钝化层上形成包括像素电极和上电极的第三图案化导体层。
    • 9. 发明申请
    • METHOD FOR FABRICATING ACTIVE DEVICE ARRAY SUBSTRATE
    • 用于制作主动装置阵列基板的方法
    • US20120115288A1
    • 2012-05-10
    • US13349586
    • 2012-01-13
    • Ming-Wei SunChen-Yueh LiYu-Cheng ChenChia-Tien Peng
    • Ming-Wei SunChen-Yueh LiYu-Cheng ChenChia-Tien Peng
    • H01L21/336
    • H01L27/14692H01L27/1214H01L27/1288H01L27/14609H01L27/14623H01L27/14645
    • A method for fabricating an active device array substrate is provided. A first patterned semiconductor layer, a gate insulator, a first patterned conductive layer and a first dielectric layer is sequentially formed on a substrate. First contact holes exposing the first patterned semiconductor layer are formed in the first dielectric layer and the gate insulator. A second patterned conductive layer and a second patterned semiconductor layer disposed thereon are simultaneously formed on the first dielectric layer. The second conductive layer includes contact conductors and a bottom electrode. The second patterned semiconductor layer includes an active layer. A second dielectric layer having second contact holes is formed on the first dielectric layer, wherein a portion of the second contact holes exposes the active layer. A third patterned conductive layer electrically connected to the active layer through a portion of the second contact holes is formed on the second dielectric layer.
    • 提供一种用于制造有源器件阵列衬底的方法。 第一图案化半导体层,栅极绝缘体,第一图案化导电层和第一介电层依次形成在衬底上。 暴露第一图案化半导体层的第一接触孔形成在第一介电层和栅极绝缘体中。 第一图案化导电层和设置在其上的第二图案化半导体层同时形成在第一介电层上。 第二导电层包括接触导体和底部电极。 第二图案化半导体层包括有源层。 具有第二接触孔的第二电介质层形成在第一电介质层上,其中一部分第二接触孔露出有源层。 通过第二接触孔的一部分电连接到有源层的第三图案化导电层形成在第二介电层上。
    • 10. 发明授权
    • Method for fabricating active device array substrate
    • 制造有源器件阵列衬底的方法
    • US08198149B2
    • 2012-06-12
    • US13349586
    • 2012-01-13
    • Ming-Wei SunChen-Yueh LiYu-Cheng ChenChia-Tien Peng
    • Ming-Wei SunChen-Yueh LiYu-Cheng ChenChia-Tien Peng
    • H01L21/00H01L21/84
    • H01L27/14692H01L27/1214H01L27/1288H01L27/14609H01L27/14623H01L27/14645
    • A method for fabricating an active device array substrate is provided. A first patterned semiconductor layer, a gate insulator, a first patterned conductive layer and a first dielectric layer is sequentially formed on a substrate. First contact holes exposing the first patterned semiconductor layer are formed in the first dielectric layer and the gate insulator. A second patterned conductive layer and a second patterned semiconductor layer disposed thereon are simultaneously formed on the first dielectric layer. The second conductive layer includes contact conductors and a bottom electrode. The second patterned semiconductor layer includes an active layer. A second dielectric layer having second contact holes is formed on the first dielectric layer, wherein a portion of the second contact holes exposes the active layer. A third patterned conductive layer electrically connected to the active layer through a portion of the second contact holes is formed on the second dielectric layer.
    • 提供一种用于制造有源器件阵列衬底的方法。 第一图案化半导体层,栅极绝缘体,第一图案化导电层和第一介电层依次形成在衬底上。 暴露第一图案化半导体层的第一接触孔形成在第一介电层和栅极绝缘体中。 第一图案化导电层和设置在其上的第二图案化半导体层同时形成在第一介电层上。 第二导电层包括接触导体和底部电极。 第二图案化半导体层包括有源层。 具有第二接触孔的第二电介质层形成在第一电介质层上,其中一部分第二接触孔露出有源层。 通过第二接触孔的一部分电连接到有源层的第三图案化导电层形成在第二介电层上。