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1. 发明申请

US20120253733A1 TRANSACTION BASED WORKLOAD MODELING FOR EFFECTIVE PERFORMANCE TEST STRATEGIES 有权
标题翻译：基于交易的工作负载建模有效的性能测试策略
公开(公告)号：US20120253733A1
公开(公告)日：2012-10-04
申请号：US13179647
申请日：2011-07-11
申请人： Amit GAWANDE , Vikas GUPTA
发明人： Amit GAWANDE , Vikas GUPTA
IPC分类号： G06F19/00
CPC分类号： G06F11/3495 , G06F11/3414 , G06F11/3433 , G06F2201/87
摘要： A method for creating workload model to test performance of a critical application in a data processing network (112) is disclosed. The method includes receiving (202), at one of the plurality of data processing units (114a), an activity log with a plurality of entities from the data processing network (112). The method further includes creating (204) a transaction log of all transactions conducted using the activity log. Further the method determines (206) a plurality of transaction metrics using the transaction log, wherein the plurality of transaction metrics comprises an average transaction response time, a transaction throughput etc. The method further creates a workload model to test the critical performance of an application in the data processing network (112) based on the plurality of transaction metrics and provide effective performance test strategies.
摘要翻译：公开了一种用于创建工作负载模型以测试数据处理网络（112）中的关键应用的性能的方法。该方法包括在多个数据处理单元（114a）之一处接收（202）具有来自数据处理网络（112）的多个实体的活动日志。该方法还包括创建（204）使用活动日志进行的所有交易的交易记录。此外，该方法使用事务日志确定（206）多个事务度量，其中多个事务度量包括平均事务响应时间，事务吞吐量等。该方法进一步创建工作负载模型以测试应用程序的关键性能在数据处理网络（112）中基于多个事务度量并提供有效的性能测试策略。

2. 发明申请

US20170072270A1 BALL FOR BALL GAMES, AND METHOD FOR MANUFACTURING BALL FOR BALL GAMES 审中-公开
标题翻译：球游戏球，以及制作球类游戏的方法
公开(公告)号：US20170072270A1
公开(公告)日：2017-03-16
申请号：US15213970
申请日：2016-07-19
申请人： Hideomi SHISHIDO , Vikas GUPTA , Vinod MAHAJAN
发明人： Hideomi SHISHIDO , Vikas GUPTA , Vinod MAHAJAN
IPC分类号： A63B41/08 , A63B45/00
CPC分类号： A63B41/08 , A63B45/00 , B29C65/4835 , B29C65/62 , B29C65/72 , B29C66/7484 , B29L2031/545
摘要： The ball for ball games has a ball body and a spherical shell-shaped outer layer having a plurality of leather panels and disposed on the outside of the ball body. The plurality of leather panels each have a main body and an extending portion that is thinner than the main body and extends from a front-side portion of an outer end surface of the main body to configure an outer end surface of the leather panel. The extending portions of adjacent leather panels are bonded to each other with an adhesive and stitched together with a stitching thread. In the ball for ball games, the extending portion is provided with a reinforcing member for reinforcing an area thereof stitched with the stitching thread.
摘要翻译：用于球类运动的球具有球体和具有多个皮革面板并且设置在球体外部的球形壳状外层。多个皮革面板各自具有主体和比主体更薄的延伸部分，并且从主体的外端表面的前侧部分延伸以构成皮革面板的外端面。相邻皮革面板的延伸部分用粘合剂彼此粘合并用缝合线缝合在一起。在用于球类运动的球中，延伸部设置有用于加强与缝合线缝合的区域的加强构件。

3. 发明申请

US20150309582A1 GESTURE OPERATED WRIST MOUNTED CAMERA SYSTEM 审中-公开
标题翻译：手工操作手写安装摄像机系统
公开(公告)号：US20150309582A1
公开(公告)日：2015-10-29
申请号：US14634674
申请日：2015-02-27
申请人： Vikas GUPTA
发明人： Vikas GUPTA
IPC分类号： G06F3/01 , H04N5/225
CPC分类号： G06F3/017 , G06F3/011 , G06F3/014 , G06F3/0346 , G06F3/0484 , H04N5/2252
摘要： A system and method for capturing media are disclosed. In a first aspect, the system comprises a wristband device that includes at least one sensor and a camera coupled to the wristband device. The camera is controlled by at least one gesture determined using the at least one sensor. In a second aspect, the method comprises providing a wristband device that includes at least one sensor, coupling a camera to the wristband device, determining at least one gesture using the at least one sensor, and controlling the camera by using the at least one gesture.
摘要翻译：公开了一种用于捕获媒体的系统和方法。在第一方面，该系统包括腕带装置，其包括耦合到腕带装置的至少一个传感器和照相机。使用至少一个传感器确定的至少一个手势来控制照相机。在第二方面，该方法包括提供一种腕带装置，其包括至少一个传感器，将照相机连接到腕带装置，使用该至少一个传感器确定至少一个手势，以及通过使用至少一个手势来控制相机。

4. 发明申请

US20110204506A1 Thermal Interface Material Design for Enhanced Thermal Performance and Improved Package Structural Integrity 有权
标题翻译：热接口材料设计，用于增强热性能和改进的封装结构完整性
公开(公告)号：US20110204506A1
公开(公告)日：2011-08-25
申请号：US13099145
申请日：2011-05-02
申请人： Siva Prakash GURRUM , Paul Joseph HUNDT , Vikas GUPTA
发明人： Siva Prakash GURRUM , Paul Joseph HUNDT , Vikas GUPTA
IPC分类号： H01L23/02
CPC分类号： H01L23/3737 , H01L23/293 , H01L23/373 , H01L23/433 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/48 , H01L2224/16225 , H01L2224/16227 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29311 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29393 , H01L2224/29499 , H01L2224/32225 , H01L2224/32245 , H01L2224/48247 , H01L2224/4826 , H01L2224/48472 , H01L2224/73253 , H01L2224/73265 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/351 , H05K1/0203 , H05K3/305 , H05K2201/0209 , Y02P70/613 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electronic package 100 comprising a semiconductor device 105, a heat spreader layer 110, and a thermal interface material layer 115 located between the semiconductor device and the heat spreader layer. The thermal interface material layer includes a resin layer 120 having heat conductive particles 125 suspended therein. A portion of the particles are exposed on at least one non-planar surface 135 of the resin layer such that the portion of exposed particles 130 occupies a majority of a total area of a horizontal plane 140 of the non-planar surface.
摘要翻译：包括位于半导体器件和散热器层之间的半导体器件105，散热层110和热界面材料层115的电子封装100。热界面材料层包括其中悬置有导热颗粒125的树脂层120。一部分颗粒暴露在树脂层的至少一个非平面表面135上，使得暴露的颗粒130的一部分占据非平面表面的水平面140的总面积的大部分。

5. 发明申请

US20100219528A1 Electromigration-Resistant Flip-Chip Solder Joints 审中-公开
标题翻译：防电镀倒装焊接
公开(公告)号：US20100219528A1
公开(公告)日：2010-09-02
申请号：US12778786
申请日：2010-05-12
申请人： Jie-Hua ZHAO , Vikas GUPTA , Kejun ZENG
发明人： Jie-Hua ZHAO , Vikas GUPTA , Kejun ZENG
IPC分类号： H01L23/498 , H01L21/768 , H01L21/60
CPC分类号： H01L24/11 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05026 , H01L2224/05027 , H01L2224/0508 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/05171 , H01L2224/05184 , H01L2224/05568 , H01L2224/05655 , H01L2224/13099 , H01L2224/16 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2924/013
摘要： A semiconductor device contact structure practically eliminating the copper diffusion into the solder as well as the current crowding at the contact with the subsequent electromigration in the solder. A column-like electroplated copper stud (108) is on each contact pad. The stud is sized to provide low, uniform electrical resistance in order to spread the current from the contact to an approximately uniform, low density. Preferably, the stud height (108a) is at least ten times the thickness of the copper interconnect layer (104). Stud (108) is capped by an electroplated nickel layer (109) thick enough (preferably about 2 μm) to suppress copper diffusion from stud (108) into solder body (120), thus practically inhibiting intermetallic compound formation and Kirkendall voiding.
摘要翻译：半导体器件接触结构实际上消除了铜扩散到焊料中，以及在与焊料中随后的电迁移接触时的电流拥挤。柱状电镀铜螺柱（108）位于每个接触垫上。螺柱的尺寸设计成提供低的均匀的电阻，以便将电流从接触扩散到大致均匀的低密度。优选地，螺柱高度（108a）为铜互连层（104）的厚度的至少十倍。螺栓（108）被厚度足够厚（优选约2μm）的电镀镍层（109）封盖，以抑制从螺柱（108）到焊料体（120）的铜扩散，从而实际上抑制金属间化合物形成和Kirkendall排空。

6. 发明申请

US20090305464A1 Array-Processed Stacked Semiconductor Packages 有权
标题翻译：阵列处理堆叠半导体封装
公开(公告)号：US20090305464A1
公开(公告)日：2009-12-10
申请号：US12491667
申请日：2009-06-25
申请人： Gregory E. HOWARD , Vikas GUPTA , Darvin R. EDWARDS
发明人： Gregory E. HOWARD , Vikas GUPTA , Darvin R. EDWARDS
IPC分类号： H01L21/82 , H01L21/50 , H01L21/56
CPC分类号： H01L23/3121 , H01L23/5389 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/13099 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/4809 , H01L2224/48091 , H01L2224/4813 , H01L2224/48227 , H01L2224/48472 , H01L2224/73207 , H01L2224/73265 , H01L2224/85951 , H01L2224/97 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12044 , H01L2924/13034 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/81 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： One embodiment of the invention is a semiconductor system (1400) of arrays (1401, 1402, etc.) of packaged devices. Each array includes a sheet-like substrate (1411, 1412, etc.) made of insulating material integral with conductive horizontal lines and vertical vias, and terminals on the surfaces. Semiconductor components, which may include more than one active or passive chips, or chips of different sizes, are attached to the substrate; the electrical connections may include flip-chip, wire bond, or combination techniques. Encapsulation compound (1412, 1422, etc.), which adheres to the substrate, embeds the connected components. Metal posts (1431, 1432, etc.) traverse the encapsulation compound vertically, connecting the substrate vias with pads on the encapsulation surface. The pads are covered with solder bodies used to connect to the next-level device array so that a 3-dimensional system of packaged devices is formed.
摘要翻译：本发明的一个实施例是封装装置的阵列（1401,1402等）的半导体系统（1400）。每个阵列包括由与导电水平线和垂直通孔成一体的绝缘材料制成的片状衬底（1411,1412等）和表面上的端子。可以包括多于一个有源或无源芯片或不同尺寸的芯片的半导体部件附接到基板; 电连接可以包括倒装芯片，引线键合或组合技术。附着在基板上的封装化合物（1412,1422等）嵌入所连接的部件。金属柱（1431,1432等）垂直穿过封装化合物，将衬底通孔与封装表面上的焊盘连接。焊盘被用于连接到下一级器件阵列的焊料体覆盖，从而形成封装器件的3维系统。

7. 发明申请

US20110027943A1 Stud Bumps as Local Heat Sinks During Transient Power Operations 有权
标题翻译：在瞬态电力操作期间，螺柱作为局部散热器碰撞
公开(公告)号：US20110027943A1
公开(公告)日：2011-02-03
申请号：US12906240
申请日：2010-10-18
申请人： Siva Prakash GURRUM , Kapil Heramb SAHASRABUDE , Vikas GUPTA
发明人： Siva Prakash GURRUM , Kapil Heramb SAHASRABUDE , Vikas GUPTA
IPC分类号： H01L21/50
CPC分类号： H01L23/367 , H01L23/3171 , H01L24/14 , H01L24/16 , H01L2224/0554 , H01L2224/05548 , H01L2224/05573 , H01L2224/056 , H01L2224/16 , H01L2924/00014 , H01L2924/01079 , H01L2924/01084 , H01L2924/10253 , H01L2924/14 , H01L2924/19041 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A thermal management configuration for a flip chip semiconductor device is disclosed. The device includes a high power silicon based die having a metal bonding surface. A plurality of interconnects are formed on the metal surface and connected to a substrate. A plurality of thermal management stud bumps are formed on the metal bonding surface, the thermal management stud bumps positioned distinct from the interconnects and local to die hot spots, exposed ends of the thermal management stud bumps spaced from the substrate.
摘要翻译：公开了一种用于倒装芯片半导体器件的热管理配置。该器件包括具有金属接合表面的高功率硅基管芯。在金属表面上形成多个互连件并连接到基板。在金属接合表面上形成多个热管理突起，热管理突起凸起与互连不同，并且局部到管芯热点，热管理突起凸起与基板间隔开的暴露端。

8. 发明申请

US20090267218A1 Heat Extraction from Packaged Semiconductor Chips, Scalable with Chip Area 有权
公开(公告)号：US20090267218A1
公开(公告)日：2009-10-29
申请号：US12499182
申请日：2009-07-08
申请人： Vikas GUPTA , Siva P. GURRUM , Gregory E. HOWARD
发明人： Vikas GUPTA , Siva P. GURRUM , Gregory E. HOWARD
IPC分类号： H01L23/36 , H01L23/52
CPC分类号： H01L23/3677 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05553 , H01L2224/05624 , H01L2224/05644 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48599 , H01L2224/48699 , H01L2224/4903 , H01L2224/73265 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/181 , H01L2924/20751 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/01004 , H01L2924/01026 , H01L2924/00014 , H01L2924/20752 , H01L2924/00012
摘要： A semiconductor device (100A) with plastic encapsulation compound (102) and metal sheets (103a and 104) on both surfaces, acting as heat spreaders. One or more thermal conductors (103a) of preferably uniform height connect one sheet (103b) and the chip surface (101a); the number of conductors is scalable with the chip size. Each conductor consists of an elongated wire loop (preferably copper) with the wire ends attached to a pad (105), preferably both ends to the same pad. The major loop diameter is approximately normal to the first surface and the loop vertex in contact with the sheet (103b). The substrate (104, preferably a second metal sheet) covers at least portions of the second package surface and is thermally conductively connected to the chip.

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