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1. 发明授权

US07573107B2 Power module 有权
标题翻译：电源模块
公开(公告)号：US07573107B2
公开(公告)日：2009-08-11
申请号：US11234763
申请日：2005-09-23
申请人： Alberto Guerra , Norman G. Connah , Mark Steers , George Pearson
发明人： Alberto Guerra , Norman G. Connah , Mark Steers , George Pearson
IPC分类号： H01L27/088
CPC分类号： H01L25/072 , H01L2924/0002 , H01L2924/00
摘要： A power module that includes a power circuit assembly in which power components are electrically and mechanically connected without wires.
摘要翻译：一种功率模块，其包括功率电路组件，其中功率部件在电气和机械上连接而没有电线。

2. 发明申请

US20060071238A1 Power module 有权
公开(公告)号：US20060071238A1
公开(公告)日：2006-04-06
申请号：US11234763
申请日：2005-09-23
申请人： Alberto Guerra , Norman Connah , Mark Steers , George Pearson
发明人： Alberto Guerra , Norman Connah , Mark Steers , George Pearson
IPC分类号： H01L31/111
CPC分类号： H01L25/072 , H01L2924/0002 , H01L2924/00
摘要： A power module that includes a power circuit assembly in which power components are electrically and mechanically connected without wires.

3. 发明申请

US20050253258A1 Solder flow stops for semiconductor die substrates 失效
标题翻译：半导体管芯基板的焊料流动停止
公开(公告)号：US20050253258A1
公开(公告)日：2005-11-17
申请号：US11112688
申请日：2005-04-21
申请人： Mark Steers , George Pearson
发明人： Mark Steers , George Pearson
IPC分类号： H01L21/44 , H01L21/60 , H01L21/607 , H01L23/498 , H05K3/34
CPC分类号： H01L24/32 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/83 , H01L24/85 , H01L2224/0603 , H01L2224/26175 , H01L2224/291 , H01L2224/29109 , H01L2224/29111 , H01L2224/2919 , H01L2224/45124 , H01L2224/48247 , H01L2224/48472 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/83136 , H01L2224/83801 , H01L2224/85205 , H01L2924/00011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01082 , H01L2924/01083 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/15153 , H01L2924/1517 , H01L2924/15724 , H01L2924/15787 , H01L2924/3011 , H05K3/341 , H05K3/3452 , H05K2201/2081 , Y02P70/613 , H01L2924/00014 , H01L2924/00 , H01L2224/83205
摘要： A substrate, which has semiconductor die arranged thereon, uses at least one solder flow stop, closely surrounding at least a portion of at least one mounting pad on which the die are mounted, to prevent die rotation during solder reflow. The at least one solder stop is non-wetting, during a solder reflow process, to solder used to mount the die.
摘要翻译：具有布置在其上的半导体管芯的衬底使用至少一个焊料流停止件，紧密地围绕安装有管芯的至少一个安装焊盘的至少一部分，以防止在回流焊时管芯旋转。在焊料回流工艺期间，至少一个焊料停止件不被润湿用于安装模具的焊料。

4. 发明授权

US08466546B2 Chip-scale package 有权
标题翻译：芯片级封装
公开(公告)号：US08466546B2
公开(公告)日：2013-06-18
申请号：US11409298
申请日：2006-04-21
申请人： Andy Farlow , Mark Pavier , Andrew N. Sawle , George Pearson , Martin Standing
发明人： Andy Farlow , Mark Pavier , Andrew N. Sawle , George Pearson , Martin Standing
IPC分类号： H01L23/48
CPC分类号： H01L24/33 , H01L23/041 , H01L23/492 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/29 , H01L2224/29007 , H01L2224/291 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29311 , H01L2224/29347 , H01L2224/29355 , H01L2224/32245 , H01L2224/73153 , H01L2224/83801 , H01L2924/00013 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/0781 , H01L2924/13091 , H01L2924/15747 , H01L2924/16152 , H01L2924/166 , H01L2924/30105 , H01L2924/01083 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A semiconductor package including a conductive clip preferably in the shape of a can, a semiconductor die, and a conductive stack interposed between the die and the interior of the can which includes a conductive platform and a conductive adhesive body.
摘要翻译：一种半导体封装，其包括优选为罐形状的导电夹子，半导体管芯和插入在所述管芯和所述罐体内部的导电堆叠，其包括导电平台和导电粘合体。

5. 发明申请

US20060212465A1 Apparatus and method for identifying asynchronous data in redundant data stores and for re-synchronizing same 有权
标题翻译：用于识别冗余数据存储中的异步数据并重新同步的设备和方法
公开(公告)号：US20060212465A1
公开(公告)日：2006-09-21
申请号：US11084855
申请日：2005-03-18
申请人： Eric Fish , Scott Corbin , Joel Shepherd , George Pearson , Timothy Rathbun
发明人： Eric Fish , Scott Corbin , Joel Shepherd , George Pearson , Timothy Rathbun
IPC分类号： G06F17/00
CPC分类号： G06F17/30578 , G06F11/1662 , G06F11/2097
摘要： A computer readable medium includes executable instruction to compare databases. The executable instructions are configured to identify when a segment of a first database is conditionally out of synchronization with a corresponding segment of a second database to establish a conditionally out of synchronization state at a first time. Executable instructions allow a latency period after the first time in which changes are made to the first database and the second database. Executable instructions also determine after the latency period whether the segment of the first database is in synchronization with the corresponding segment of the second database. Executable instructions also populate a resynchronization table, which is used by a replication mechanism to bring asynchronous rows into synchronization.
摘要翻译：计算机可读介质包括用于比较数据库的可执行指令。可执行指令被配置为识别第一数据库的段何时与第二数据库的对应段有条件地不同步以在第一时间建立有条件地失去同步状态。可执行指令允许在第一次对第一个数据库和第二个数据库进行更改之后的延迟时间。可执行指令还在延迟时段之后确定第一数据库的段是否与第二数据库的相应段同步。可执行指令还会填充一个重新同步表，由复制机制使用，以使异步行同步。

6. 发明申请

US20080065470A1 Enterprise performance management software system having variable-based modeling 失效
标题翻译：企业绩效管理软件系统具有基于变量的建模
公开(公告)号：US20080065470A1
公开(公告)日：2008-03-13
申请号：US11894376
申请日：2007-08-21
申请人： Andrew Nelmes , George Pearson , Johnathan Hodge , John Pitstick , Michael Gould
发明人： Andrew Nelmes , George Pearson , Johnathan Hodge , John Pitstick , Michael Gould
IPC分类号： G06Q10/00
CPC分类号： G06Q10/06 , G06Q10/063 , G06Q10/06313 , G06Q10/0637
摘要： An enterprise planning and performance management system provides a variable-based modeling technique that enables users to interact with a more manageable variable-centric front-end for complex enterprise planning software. The system enables users to specify a plurality of variable definitions via a variable-based user interface. Based on the plurality of variable definitions, the system generates, and in some instances automatically generates, model data that defines an enterprise planning model. The system uses the model data during subsequent enterprise planning sessions. Because model builders typically comprise financial analysts unfamiliar with traditional complex enterprise modeling techniques but familiar with common financial variables of an enterprise, this variable-based modeling technique may facilitate easier model building by allowing these financial analysts to generate model data from the perspective of the more readily understood variables.
摘要翻译：企业规划和绩效管理系统提供了一种基于变量的建模技术，使用户能够与更易于管理的以变量为中心的前端进行交互，用于复杂的企业规划软件。该系统使用户能够通过基于变量的用户界面指定多个变量定义。基于多个变量定义，系统生成并在某些情况下自动生成定义企业规划模型的模型数据。系统在随后的企业计划会话期间使用模型数据。因为模型构建者通常包括不熟悉传统复杂企业建模技术但熟悉企业的常见财务变量的财务分析师，因此，基于变量的建模技术可以通过允许这些财务分析师从更多的角度生成模型数据来促进更容易的模型构建容易理解的变量。

7. 发明申请

US20090266753A1 Dispensing System for Microbial Solution 审中-公开
标题翻译：微生物溶液分配系统
公开(公告)号：US20090266753A1
公开(公告)日：2009-10-29
申请号：US12393807
申请日：2009-02-26
申请人： David Johnson , Reginald Salinas , George Pearson
发明人： David Johnson , Reginald Salinas , George Pearson
IPC分类号： B01D21/30 , B67D5/06 , F16L55/07
CPC分类号： E03C1/126 , C02F3/348 , Y10T137/6123 , Y10T137/613
摘要： A system and method for dispensing microbial solution into a drain line. The system includes a disposable cartridge adapted to hold a quantity of microbial solution. The cartridge may be provided to the end user containing only a dry mix of microbes in a carrier medium. The end user may then remove a replaceable tab covering a fill hole, fill the cartridge with clean water, and replace the tab. The cartridge may then be inserted into a dispensing assembly, which includes an actuator that engages a nozzle on the cartridge at regular intervals. When the actuator engages the nozzle, a small amount of microbial solution is dispensed and routed through a tube to the drain line. The tube may attach to the drain line through a self-tapping valve assembly.
摘要翻译：将微生物溶液分配到排水管线中的系统和方法。该系统包括适于容纳一定量微生物溶液的一次性筒。盒可以被提供给仅在载体介质中仅含微生物干混的最终用户。最终用户可以随后移除覆盖填充孔的可替换的突片，用清水填充墨盒，并且更换卡舌。然后，盒可以插入到分配组件中，分配组件包括以规则的间隔与盒上的喷嘴接合的致动器。当致动器接合喷嘴时，少量的微生物溶液被分配并通过管道被引导到排出管线。管可以通过自动开启阀组件连接到排水管路。

8. 发明申请

US20060249836A1 Chip-scale package 有权
公开(公告)号：US20060249836A1
公开(公告)日：2006-11-09
申请号：US11409298
申请日：2006-04-21
申请人： Andy Farlow , Mark Pavier , Andrew Sawle , George Pearson , Martin Standing
发明人： Andy Farlow , Mark Pavier , Andrew Sawle , George Pearson , Martin Standing
IPC分类号： H01L23/34
CPC分类号： H01L24/33 , H01L23/041 , H01L23/492 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/29 , H01L2224/29007 , H01L2224/291 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29311 , H01L2224/29347 , H01L2224/29355 , H01L2224/32245 , H01L2224/73153 , H01L2224/83801 , H01L2924/00013 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/0781 , H01L2924/13091 , H01L2924/15747 , H01L2924/16152 , H01L2924/166 , H01L2924/30105 , H01L2924/01083 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A semiconductor package including a conductive clip preferably in the shape of a can, a semiconductor die, and a conductive stack interposed between the die and the interior of the can which includes a conductive platform and a conductive adhesive body.

9. 发明授权

US5977630A Plural semiconductor die housed in common package with split heat sink 失效
标题翻译：多个半导体芯片封装在具有分体式散热器的通用封装中
公开(公告)号：US5977630A
公开(公告)日：1999-11-02
申请号：US911866
申请日：1997-08-15
申请人： Arthur Woodworth , George Pearson , Peter Richard Ewer
发明人： Arthur Woodworth , George Pearson , Peter Richard Ewer
IPC分类号： H01L23/433 , H01L23/495 , H05K3/34 , H01L23/28 , H01L23/36 , H01L29/41
CPC分类号： H01L24/06 , H01L23/4334 , H01L23/49562 , H01L24/49 , H01L24/97 , H01L2224/04042 , H01L2224/05599 , H01L2224/0603 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/97 , H01L24/48 , H01L2924/00014 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/12032 , H01L2924/13091 , H01L2924/181 , H05K3/341 , H05K3/3426
摘要： A plurality of semiconductor die, which may be of diverse size and diverse junction pattern, are fixed to a common lead frame and within a common package. The semiconductor die are mounted on respective main pad areas that are laterally spaced from one another and which have respective heat sinks. The heat sinks extend from the boundary of the device package and form external pins that are available for external connection at the same or at different potentials. Isolated pins are also provided. The device package may be used for high and low side chopper circuits, synchronous regulator circuits, single-mode bridges, and the like.
摘要翻译：可以具有不同尺寸和不同结合图案的多个半导体管芯固定到公共引线框架并在公共封装内。半导体管芯安装在彼此横向间隔开并具有相应散热器的相应主焊盘区域上。散热器从器件封装的边界延伸，并形成可在相同或不同电位下进行外部连接的外部引脚。还提供隔离引脚。器件封装可以用于高低侧斩波电路，同步调节器电路，单模桥等。

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