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1. 发明授权

US06768083B2 Reflow soldering apparatus and method for selective infrared heating 有权
公开(公告)号：US06768083B2
公开(公告)日：2004-07-27
申请号：US10247402
申请日：2002-09-19
申请人： Alan Rae , Mark A. Hodge
发明人： Alan Rae , Mark A. Hodge
IPC分类号： F27D1100
CPC分类号： H05K3/3494 , B23K1/0053 , B23K2101/40 , H05K2203/111 , H05K2203/163
摘要： A reflow soldering apparatus and method are provided for reflow soldering electrical and electronic components to circuit boards. The reflow soldering apparatus and method use selective infrared (IR) heating alone or in combination with convection heating to achieve reflow soldering. Selective IR heating provided by the apparatus and method according to the invention helps to eliminate or helps to at least substantially reduce a risk overheating and thermal damage to non-targeted electrical and electronic components and areas of circuit boards during reflow.

2. 发明申请

US20110310528A1 Capacitor with Three-Dimensional High Surface Area Electrode and Methods of Manufacture 有权
标题翻译：具有三维高表面积电极的电容器及其制造方法
公开(公告)号：US20110310528A1
公开(公告)日：2011-12-22
申请号：US12969186
申请日：2010-12-15
申请人： Liang Chai , Alan Rae , Jim Wilson
发明人： Liang Chai , Alan Rae , Jim Wilson
IPC分类号： H01G4/06 , H01G7/00
CPC分类号： H01G4/10 , H01G4/005 , H01G4/008 , H01G4/12 , H01G4/1209 , H01G4/30 , Y10T29/43 , Y10T29/435
摘要： A capacitor, and methods of its manufacture, having improved capacitance efficiency which results from increasing the effective area of an electrode surface are disclosed. An improved “three-dimensional” capacitor may be constructed with electrode layers having three-dimensional aspects at the point of interface with a dielectric such that portions of the electrode extend into the dielectric layer. Advantageously, embodiments of a three-dimensional capacitor drastically reduce the space footprint that is required in a circuit to accommodate the capacitor, when compared to current capacitor designs. Increased capacitance density may be realized without using high k (high constant) dielectric materials, additional “electrode-dielectric-electrode” arrangements in an ever increasing stack, or serially stringing together multiple capacitors.
摘要翻译：公开了一种电容器及其制造方法，其具有由于增加电极表面的有效面积而提高的电容效率。可以在与电介质的界面点处具有三维方面的电极层来构造改进的“三维”电容器，使得电极的一部分延伸到电介质层中。有利的是，与当前的电容器设计相比，三维电容器的实施例大大减少了电路中所需的容纳电容器的空间足迹。可以在不使用高k（高常数）电介质材料的情况下实现增加的电容密度，而在不断增加的叠层中使用附加的“电极 - 电介质电极”布置，或者串联连接多个电容器。

3. 发明申请

US20090022974A1 TREATED ARTICLES AND METHODS OF TREATING ARTICLES 审中-公开
标题翻译：处理文章和处理文章的方法
公开(公告)号：US20090022974A1
公开(公告)日：2009-01-22
申请号：US12161965
申请日：2007-01-26
申请人： Sang Beom Lee , Lacramioara Trofin , Alan Rae , Keith Blakely
发明人： Sang Beom Lee , Lacramioara Trofin , Alan Rae , Keith Blakely
IPC分类号： B32B9/04 , B32B3/26 , B32B27/00 , B32B27/38 , B32B27/40 , B32B15/04 , B05D3/02 , B05D3/12 , C08F2/48
CPC分类号： A01N59/16 , A01N59/20 , D06M11/46 , D06M11/83 , D06M16/00 , D06M23/08 , Y10T428/249921 , Y10T428/249953 , Y10T428/31504 , Y10T428/31511 , Y10T428/31551 , Y10T428/31678 , Y10T428/31855 , A01N25/34 , A01N2300/00
摘要： Treated articles are provided. The treated articles may have at least one functional particle in a substrate and at least one blocking material. The blocking material inhibits the release of the at least one functional particle from the substrate. Methods of treating articles are further provided.
摘要翻译：提供处理过的物品。经处理的制品可以在基材和至少一种封闭材料中具有至少一个功能性颗粒。阻挡材料抑制至少一种功能性颗粒从基材的释放。进一步提供处理制品的方法。

4. 发明授权

US07351268B2 Fuel composition 失效
标题翻译：燃油组成
公开(公告)号：US07351268B2
公开(公告)日：2008-04-01
申请号：US10476996
申请日：2002-05-13
申请人： Alan Rae , William Hodgson
发明人： Alan Rae , William Hodgson
IPC分类号： C10L1/18
CPC分类号： C10L10/02 , C10L1/10 , C10L1/125 , C10L1/1266 , C10L1/1811 , C10L1/1824 , C10L1/1852 , C10L1/1881 , C10L1/1883 , C10L1/19 , C10L1/191 , C10L1/1985 , C10L1/2225 , C10L1/2227 , C10L1/224 , C10L1/226 , C10L1/231 , C10L10/12
摘要： There is described a fuel composition incorporating levulinic acid or a functional derivative thereof.
摘要翻译：描述了含有乙酰丙酸或其功能性衍生物的燃料组合物。

5. 发明授权

US09343231B2 Methods for manufacture a capacitor with three-dimensional high surface area electrodes 有权
标题翻译：制造具有三维高表面积电极的电容器的方法
公开(公告)号：US09343231B2
公开(公告)日：2016-05-17
申请号：US14033479
申请日：2013-09-22
申请人： Liang Chai , Alan Rae , James M Wilson
发明人： Liang Chai , Alan Rae , James M Wilson
IPC分类号： H01G4/12 , H01G4/008 , H01G4/005 , H01G4/30
CPC分类号： H01G4/10 , H01G4/005 , H01G4/008 , H01G4/12 , H01G4/1209 , H01G4/30 , Y10T29/43 , Y10T29/435
摘要： A capacitor, and methods of its manufacture, having improved capacitance efficiency which results from increasing the effective area of an electrode surface are disclosed. An improved “three-dimensional” capacitor may be constructed with electrode layers having three-dimensional aspects at the point of interface with a dielectric such that portions of the electrode extend into the dielectric layer.
摘要翻译：公开了一种电容器及其制造方法，其具有由于增加电极表面的有效面积而提高的电容效率。可以在与电介质的界面点处具有三维方面的电极层来构造改进的“三维”电容器，使得电极的一部分延伸到电介质层中。

6. 发明授权

US08561271B2 Methods for manufacture a capacitor with three-dimensional high surface area electrodes 有权
标题翻译：制造具有三维高表面积电极的电容器的方法
公开(公告)号：US08561271B2
公开(公告)日：2013-10-22
申请号：US12969186
申请日：2010-12-15
申请人： Liang Chai , Alan Rae , James M Wison
发明人： Liang Chai , Alan Rae , James M Wison
IPC分类号： H01G4/10
CPC分类号： H01G4/10 , H01G4/005 , H01G4/008 , H01G4/12 , H01G4/1209 , H01G4/30 , Y10T29/43 , Y10T29/435
摘要： A method for making a capacitor having improved capacitance efficiency which results from increasing the effective area of an electrode surface is disclosed. Specifically, an improved “three-dimensional” capacitor may be constructed with electrode layers having three-dimensional aspects at the point of interface with a dielectric such that portions of the electrode extend into the dielectric layer. Advantageously, embodiments of a three-dimensional capacitor drastically reduce the space footprint that is required in a circuit to accommodate the capacitor, when compared to current capacitor designs. Increased capacitance density may be realized without using high k (high constant) dielectric materials, additional “electrode-dielectric-electrode” arrangements in an ever increasing stack, or serially stringing together multiple capacitors.
摘要翻译：公开了一种通过增加电极表面的有效面积制造具有提高的电容效率的电容器的方法。具体地说，改进的“三维”电容器可以由与电介质接合点的三维方面的电极层构成，使得电极的一部分延伸到电介质层中。有利的是，与当前的电容器设计相比，三维电容器的实施例大大减少了电路中所需的容纳电容器的空间足迹。可以在不使用高k（高常数）电介质材料的情况下实现增加的电容密度，而在不断增加的叠层中使用附加的“电极 - 电介质电极”布置，或者串联连接多个电容器。

7. 发明申请

US20130176700A1 ELECTRONIC DEVICES WITH INTERNAL MOISTURE RESISTANT COATINGS 审中-公开
标题翻译：具有内部防潮涂层的电子设备
公开(公告)号：US20130176700A1
公开(公告)日：2013-07-11
申请号：US13735862
申请日：2013-01-07
申请人： Blake Stevens , Max Sorenson , Alan Rae , Marc Chason
发明人： Blake Stevens , Max Sorenson , Alan Rae , Marc Chason
IPC分类号： H05K1/18 , H05K13/00
CPC分类号： H05K3/284 , H01L2224/16225 , H05K1/185 , H05K13/00 , H05K2201/09872 , Y10T29/49002 , Y10T29/49117
摘要： A moisture-resistant electronic device includes at least one electronic component at least partially covered by a moisture-resistant coating. The moisture-resistant coating may be located within an interior of the electronic device. The moisture-resistant coating may cover only portions of a boundary of an internal space within the electronic device. A moisture-resistant-coating may include one or more discernible boundaries, or seams, which may be located at or adjacent to locations where two or more components of the electronic device interface with each other. Assembly methods are also disclosed.
摘要翻译：防潮电子设备包括至少一部分至少部分被防潮涂层覆盖的电子部件。防潮涂层可以位于电子设备的内部。防潮涂层可以仅覆盖电子设备内的内部空间的边界的一部分。防潮涂层可以包括一个或多个可辨别的边界或接缝，其可以位于电子设备的两个或更多个部件彼此接合的位置处或邻近位置处。还公开了装配方法。

8. 发明授权

US07172635B2 Fuel additives 有权
标题翻译：燃油添加剂
公开(公告)号：US07172635B2
公开(公告)日：2007-02-06
申请号：US10475411
申请日：2002-04-26
申请人： Frank Bongardt , William Hodgson , Alan Rae , Jurgen Roder
发明人： Frank Bongardt , William Hodgson , Alan Rae , Jurgen Roder
IPC分类号： C10L1/18 , C10L1/224
CPC分类号： C10L1/10 , C10L1/023 , C10L1/026 , C10L1/125 , C10L1/1266 , C10L1/143 , C10L1/1824 , C10L1/1881 , C10L1/1905 , C10L1/1985 , C10L1/2225 , C10L1/2227 , C10L1/224 , C10L1/226 , C10L1/328 , C10L10/02 , C10L10/12 , Y02E50/13 , Y02T50/678
摘要： There is described a fuel additive composition comprising an oleic alkanolamide and an alkoxylated oleic acid. There is also described a fuel composition comprising a hydrocarbon fuel and a fuel additive comprising an oleic alkanolamide and an alkoxylated oleic acid and also a method of running a combustion engine using the fuel if the invention.
摘要翻译：描述了包含油酸烷醇酰胺和烷氧基化油酸的燃料添加剂组合物。还描述了包括烃燃料和包含油酸烷醇酰胺和烷氧基化油酸的燃料添加剂的燃料组合物，以及如果发明，使用燃料运行内燃机的方法。

9. 发明申请

US20060035413A1 Thermal protection for electronic components during processing 审中-公开
标题翻译：加工过程中电子部件的热保护
公开(公告)号：US20060035413A1
公开(公告)日：2006-02-16
申请号：US10755944
申请日：2004-01-13
申请人： Alan Rae , Bawa Singh
发明人： Alan Rae , Bawa Singh
IPC分类号： H01L21/50
CPC分类号： H01L23/36 , H01L24/81 , H01L2224/16 , H01L2224/73253 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00
摘要： A method and device for cooling an electronic component during its manufacture, repair, or rework. There is a cooling unit in thermal communication with the electronic component which extracts heat therefrom.
摘要翻译：一种用于在其制造，修理或返工期间冷却电子部件的方法和装置。存在与电子部件热连通的冷却单元，其从其提取热量。

10. 发明申请

US20050151554A1 Cooling devices and methods of using them 审中-公开
标题翻译：冷却装置及其使用方法
公开(公告)号：US20050151554A1
公开(公告)日：2005-07-14
申请号：US10892303
申请日：2004-07-15
申请人： Alan Rae , Bawa Singh , William Varnell , Angelo Gulino , Mitch Holtzer , Joe Abys , Brian Lewis
发明人： Alan Rae , Bawa Singh , William Varnell , Angelo Gulino , Mitch Holtzer , Joe Abys , Brian Lewis
IPC分类号： G01R31/02 , H01L21/60 , H01L23/36
CPC分类号： H01L23/36 , H01L24/81 , H01L2224/16 , H01L2224/73253 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00
摘要： A method and device for cooling an electronic component during its manufacture, repair, or rework is disclosed. In certain examples, the cooling device includes a cooling device body, and optionally a cooling medium, that can receive, absorb or extract heat from the electronic component and/or the surrounding environment.
摘要翻译：公开了一种用于在其制造，修理或返工期间冷却电子部件的方法和装置。在某些实例中，冷却装置包括可从电子部件和/或周围环境接收，吸收或提取热量的冷却装置主体和任选的冷却介质。

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