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1. 发明专利

GB1102167A Improvements in or relating to solenoids 未知
公开(公告)号：GB1102167A
公开(公告)日：1968-02-07
申请号：GB2552065
申请日：1965-06-16
申请人： BAWA SINGH
IPC分类号： H01F7/124 , H01F7/18
摘要： 1,102,167. Electromagnets. B. SINGH. 16 June, 1966 [16 June, 1965], No. 25520/65. Heading HIP. A solenoid, e.g. for actuating the fuel control valve of a diesel engine, has two concentric armatures 20, 21 movable within two selectively energizable coils 10, 11, the outer armature 20 being moved to a right-hand position against a spring 24 by the coil 10, a flanged end 32 of the armature then engaging and being held by a locking arm 28, and the inner armature 21 being moved by the coil 11 so as to release the catch and allow the first armature to spring back to its initial position. The outer armature 20 comprises a hollow cylinder having a screw-threaded end 22 for attachment to the actuating member 23 of a fuel valve, whilst the inner armature 21 is a sliding fit within the cylinder and has a tapered end which engages a cam 27 to release the locking arm 28. Upon de-energization of coil 11, a spring 33 returns the inner armature to its initial left-hand position.

2. 发明专利

GB909515A Improvements relating to battery starting electric generator sets 未知
公开(公告)号：GB909515A
公开(公告)日：1962-10-31
申请号：GB2762659
申请日：1959-08-12
申请人： BAWA SINGH
IPC分类号： H02J9/08
摘要： 909,515. Starting prime movers. SINGH, B. Aug. 11, 1960 [Aug. 12, 1959], No. 27626/59. Class 38 (4). In a self-contained generating set, movement of a manual starting switch 21 to the on position energizes a starting contactor 18, 20 through one contact of an oil pressure operated change-over switch 23, which when the engine is running prepares a circuit to a fuel shut-off solenoid 28 which is energized when the starting switch is moved to the off position. On loss of oil pressure the solenoid 28 is de-energized. The A.C. generator 10 has a shunt winding 15, also a series starting winding 17 energizable with a decompression solenoid 26 through the contact 18 from a battery 24 charged from the generator D.C. armature winding 14 through an ammeter 33.

3. 发明授权

US10535628B2 Sintering materials and attachment methods using same 有权
公开(公告)号：US10535628B2
公开(公告)日：2020-01-14
申请号：US13287820
申请日：2011-11-02
申请人： Oscar Khaselev , Bin Mo , Michael T. Marczi , Bawa Singh , Monnir Boureghda
发明人： Oscar Khaselev , Bin Mo , Michael T. Marczi , Bawa Singh , Monnir Boureghda
IPC分类号： B32B5/16 , H01L23/00 , H01L21/78
摘要： Methods for die attachment of multichip and single components may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.

4. 发明申请

US20120114927A1 SINTERING MATERIALS AND ATTACHMENT METHODS USING SAME 审中-公开
标题翻译：烧结材料及其附着方法
公开(公告)号：US20120114927A1
公开(公告)日：2012-05-10
申请号：US13287820
申请日：2011-11-02
申请人： Oscar Khaselev , Bawa Singh , Bin Mo , Michael T. Marczi , Monnir Boureghda
发明人： Oscar Khaselev , Bawa Singh , Bin Mo , Michael T. Marczi , Monnir Boureghda
IPC分类号： B32B38/10 , H01B1/22 , B32B5/00 , B05D1/12 , B32B37/00 , B82Y30/00
摘要： Methods for die attachment of multichip and single components may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.
摘要翻译：用于多芯片和单个部件的芯片连接的方法可以包括在基板上或在模具的背面上印刷烧结膏。打印可能涉及模版印刷，丝网印刷或分配过程。糊剂可以在切割之前或者在单个模具的背面上印刷在整个晶片的背面上。也可以制造烧结膜并将其转移到晶片，管芯或衬底。后烧结步骤可以增加生产量。

5. 发明授权

US07968008B2 Particles and inks and films using them 有权
标题翻译：使用它们的颗粒和油墨和膜
公开(公告)号：US07968008B2
公开(公告)日：2011-06-28
申请号：US11462089
申请日：2006-08-03
申请人： Sachin Parashar , Siuli Sarkar , Oscar Khaselev , Brian G. Lewis , Michael T. Marczi , Bawa Singh , Nitin Desai , Michael Liberatore
发明人： Sachin Parashar , Siuli Sarkar , Oscar Khaselev , Brian G. Lewis , Michael T. Marczi , Bawa Singh , Nitin Desai , Michael Liberatore
IPC分类号： B05D5/12 , B05D1/26 , C09D11/02 , B22F9/20
CPC分类号： C09D11/03 , B22F1/0018 , B22F1/0022 , B22F1/0062 , B22F9/24 , B82Y30/00 , C01P2002/84 , C01P2004/62 , C01P2004/64 , C08K3/08 , C08K9/04 , C09D7/62 , C09D7/67 , C09D11/00 , C09D11/38 , C23C24/08 , C23C26/00 , H01B1/02 , H01L51/0022 , H05K1/097 , H05K2201/0224 , Y10T428/2982 , Y10T428/2991
摘要： Particles and particle films are provided. In certain examples, particles produced from a single phase process may be used to provide industrial scale synthesis of particles for use in devices such as printed wiring boards.
摘要翻译：提供颗粒和颗粒膜。在某些实例中，由单相工艺生产的颗粒可用于提供用于诸如印刷线路板的装置中的颗粒的工业规模合成。

6. 发明申请

US20090061169A1 ELECTRICAL CONDUCTORS AND METHODS OF MAKING AND USING THEM 有权
标题翻译：电导体及其制造和使用方法
公开(公告)号：US20090061169A1
公开(公告)日：2009-03-05
申请号：US12175381
申请日：2008-07-17
申请人： Oscar Khaselev , Nitin Desai , Supriya Deverajan , Michael T. Marczi , Bawa Singh
发明人： Oscar Khaselev , Nitin Desai , Supriya Deverajan , Michael T. Marczi , Bawa Singh
IPC分类号： B32B15/00 , B23K31/02
CPC分类号： H05K3/38 , H01L31/022425 , H05K1/0306 , H05K1/097 , H05K3/125 , H05K3/246 , H05K2201/0347 , H05K2203/013 , H05K2203/1131 , Y02E10/50 , Y10T428/12535 , Y10T428/12583 , Y10T428/12597 , Y10T428/12896 , Y10T428/24802 , Y10T428/24917
摘要： Certain examples disclosed herein are directed to devices that include a substrate and conductor disposed on the substrate. In some examples, each of the conductor and the substrate may include materials that are mutually insoluble in each other. In other examples, the conductor may further comprise a substantially pure metal. In certain examples, the disposed conductor may be configured to pass adhesion tape test ASTM D3359-02. Methods of forming the conductors are also provided.
摘要翻译：本文公开的某些示例涉及包括设置在基板上的基板和导体的装置。在一些实例中，导体和基底中的每一个可以包括彼此相互不溶解的材料。在其他示例中，导体还可以包括基本上纯的金属。在某些实例中，布置的导体可以被配置为通过粘合带测试ASTM D3359-02。还提供了形成导体的方法。

7. 发明申请

US20080292492A1 Solder Alloy 有权
标题翻译：焊接合金
公开(公告)号：US20080292492A1
公开(公告)日：2008-11-27
申请号：US11720578
申请日：2005-12-01
申请人： Anthony E. Ingham , Gerard Campbell , Brian G. Lewis , Bawa Singh , John P. Laughlin , Ranjit Pandher
发明人： Anthony E. Ingham , Gerard Campbell , Brian G. Lewis , Bawa Singh , John P. Laughlin , Ranjit Pandher
IPC分类号： C22C13/00 , B23K35/24
CPC分类号： B23K35/262 , C22C1/06 , C22C13/00 , C22C13/02
摘要： An alloy suitable for use in a wave solder process, reflow soldering process, hot air levelling process or a ball grid array, the alloy comprising from 0.08-3 wt. % bismuth, from 0.15-1.5 wt. % copper, from 0.1-1.5 wt. % silver, from 0-0.1 wt. % phosphorus, from 0-0.1 wt. % germanium, from 0-0.1 wt. % gallium, from 0-0.3 wt. % one or more rare earth elements, from 0-0.3 wt. % indium, from 0-0.3 wt. % magnesium, from 0-0.3 wt. % calcium, from 0-0.3 wt. % silicon, from 0-0.3 wt. % aluminium, from 0-0.3 wt. % zinc, and at least one of the following elements from 0.02-0.3 wt % nickel, from 0.008-0.2 wt % manganese, from 0.01-0.3 wt % cobalt, from 0.01-0.3 wt % chromium, from 0.02-0.3 wt % iron, and from 0.008-0.1 wt % zirconium, and the balance tin, together with unavoidable impurities.
摘要翻译：适用于波峰焊工艺，回流焊接工艺，热空气整平工艺或球栅阵列的合金，该合金含有0.08-3wt。％铋，0.15-1.5重量％％铜，0.1-1.5重量％％银，0-0.1重量％％磷，0-0.1重量％％锗，0-0.1重量％％镓，0-0.3重量％％的一种或多种稀土元素，0-0.3wt。％铟，0-0.3重量％％镁，0-0.3重量％％钙，0-0.3重量％％硅，0-0.3重量％％铝，0-0.3重量％％锌，以及从0.02-0.3重量％镍，0.008-0.2重量％锰，0.01-0.3重量％钴，0.01-0.3重量％铬，0.02-0.3重量％铁，，和0.008-0.1重量％的锆，余量为锡，以及不可避免的杂质。

8. 发明申请

US20070009738A1 Nanoscale structures and methods of preparation and use 有权
标题翻译：纳米结构及其制备和使用方法
公开(公告)号：US20070009738A1
公开(公告)日：2007-01-11
申请号：US11176017
申请日：2005-07-07
申请人： Rakesh Kumar , Bawa Singh , Brian Lewis , Michael Marczi
发明人： Rakesh Kumar , Bawa Singh , Brian Lewis , Michael Marczi
IPC分类号： B32B1/00
CPC分类号： B01J13/14 , B01J35/06 , B01J35/08 , Y10T428/2982 , Y10T428/2984 , Y10T428/2991
摘要： Structures in the nanoscale and mesoscale domain are provided. The structures typically have a shell which can be comprised of a porous polymeric material such as parylene. The surfaces of the shell can further comprise pendant functional groups that can provide reactive or passive characteristics.
摘要翻译：提供了纳米尺度和中尺度域中的结构。结构通常具有可以由多孔聚合材料如聚对二甲苯构成的壳。壳体的表面可进一步包含可提供反应性或被动特性的侧链官能团。

9. 发明申请

US20060035413A1 Thermal protection for electronic components during processing 审中-公开
标题翻译：加工过程中电子部件的热保护
公开(公告)号：US20060035413A1
公开(公告)日：2006-02-16
申请号：US10755944
申请日：2004-01-13
申请人： Alan Rae , Bawa Singh
发明人： Alan Rae , Bawa Singh
IPC分类号： H01L21/50
CPC分类号： H01L23/36 , H01L24/81 , H01L2224/16 , H01L2224/73253 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00
摘要： A method and device for cooling an electronic component during its manufacture, repair, or rework. There is a cooling unit in thermal communication with the electronic component which extracts heat therefrom.
摘要翻译：一种用于在其制造，修理或返工期间冷却电子部件的方法和装置。存在与电子部件热连通的冷却单元，其从其提取热量。

10. 发明申请

US20050151554A1 Cooling devices and methods of using them 审中-公开
标题翻译：冷却装置及其使用方法
公开(公告)号：US20050151554A1
公开(公告)日：2005-07-14
申请号：US10892303
申请日：2004-07-15
申请人： Alan Rae , Bawa Singh , William Varnell , Angelo Gulino , Mitch Holtzer , Joe Abys , Brian Lewis
发明人： Alan Rae , Bawa Singh , William Varnell , Angelo Gulino , Mitch Holtzer , Joe Abys , Brian Lewis
IPC分类号： G01R31/02 , H01L21/60 , H01L23/36
CPC分类号： H01L23/36 , H01L24/81 , H01L2224/16 , H01L2224/73253 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00
摘要： A method and device for cooling an electronic component during its manufacture, repair, or rework is disclosed. In certain examples, the cooling device includes a cooling device body, and optionally a cooling medium, that can receive, absorb or extract heat from the electronic component and/or the surrounding environment.
摘要翻译：公开了一种用于在其制造，修理或返工期间冷却电子部件的方法和装置。在某些实例中，冷却装置包括可从电子部件和/或周围环境接收，吸收或提取热量的冷却装置主体和任选的冷却介质。

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