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1. 发明授权

US4778038A Control apparatus for automobile clutch 失效
标题翻译：汽车离合器控制装置
公开(公告)号：US4778038A
公开(公告)日：1988-10-18
申请号：US30561
申请日：1987-03-27
申请人： Akira Ohkawa , Hiroshi Yoshimura , Toshifumi Koshizawa
发明人： Akira Ohkawa , Hiroshi Yoshimura , Toshifumi Koshizawa
IPC分类号： B60W10/02 , B60W10/04 , B60W10/06 , F16D43/00 , F16D48/02 , F16D48/10 , B60K41/28
CPC分类号： B60W10/06 , B60W10/02 , B60W10/11 , B60W30/18 , B60W2510/0652 , B60W2510/1005 , B60W2540/12 , B60W30/1884 , Y10T477/6392 , Y10T477/6414
摘要： A control apparatus for an automotive clutch sets engine rotational speeds set for respective gear positions for disengaging the clutch, and disengages the clutch when the engine rotational speed drops below the set engine rotational speed corresponding to a present gear position at the time a braking force is higher than a preset value upon actuation of a brake. The control apparatus determines a rate of reduction of the engine rotational speed when the brake is actuated, and disengages the clutch when an integrated value of the rate of reduction of the engine rotational speed corresponds to one of preset values set for the respective gear positions.
摘要翻译：用于汽车离合器的控制装置设定用于分离离合器的各个齿轮位置的发动机转速，并且当发动机转速下降到对应于制动力为当前档位时设定的发动机转速时，离合器离合在制动器致动时高于预设值。控制装置确定制动器致动时的发动机转速的降低率，并且当发动机转速的降低率的积分值对应于为各档位设定的预设值之一时，离合器离合。

2. 发明授权

US4732248A Method of and apparatus for controlling automatic clutch 失效
标题翻译：自动离合器控制方法及设备
公开(公告)号：US4732248A
公开(公告)日：1988-03-22
申请号：US870874
申请日：1986-06-05
申请人： Hiroshi Yoshimura , Akira Ohkawa
发明人： Hiroshi Yoshimura , Akira Ohkawa
IPC分类号： B60K17/02 , B60W10/02 , F16D48/06 , F16D67/00 , B60K41/24 , B60K41/28
CPC分类号： B60W30/18 , B60W10/02 , B60W10/18 , B60W2510/0652 , B60W2540/12 , B60W2710/021 , B60W30/18109 , Y10S188/01 , Y10T477/743
摘要： When the brake pedal on a motor vehicle is depressed, the braking force is detected, and thereafter the speed of rotation of the engine is detected, or the rate of increase of the braking force is detected. Whether the clutch is to be quickly disengaged or not is ascertained on the basis of a combination of the detected braking force and the detected engine speed or the detected rate of increase of the braking force, so that the engine is prevented from being stopped due to, for example, quick depression of the brake pedal.
摘要翻译：当机动车辆上的制动踏板被压下时，检测到制动力，然后检测发动机的转速或检测制动力的增加率。基于检测到的制动力和检测到的发动机转速或检测到的制动力的增加率的组合来确定离合器是否快速脱离，从而防止发动机由于，例如，快速按下制动踏板。

3. 发明授权

US06730172B2 Chucking device 失效
标题翻译：夹头装置
公开(公告)号：US06730172B2
公开(公告)日：2004-05-04
申请号：US09970855
申请日：2001-10-05
申请人： Kenji Furuya , Akira Ohkawa , Shoji Tatejima , Yoshihiro Yamaguchi , Masayuki Terayama
发明人： Kenji Furuya , Akira Ohkawa , Shoji Tatejima , Yoshihiro Yamaguchi , Masayuki Terayama
IPC分类号： B05C1300
CPC分类号： B23B31/1176
摘要： A chucking device of the present invention includes an annular elastic member sandwiched between an upper and a lower member. A rod is slidable up and down in a bore formed in the upper and lower members and is partly positioned in the elastic member. The rod presses the elastic member radially outward when raised or lowered, thereby causing the chucking device to chuck a hollow, cylindrical base. The elastic member contacts the inner periphery of the base over a minimum of area and surely, closely contacts it for thereby implementing desirable sealing. The chucking device can therefore form a uniform film on the outer periphery of the base.
摘要翻译：本发明的夹紧装置包括夹在上部和下部构件之间的环形弹性构件。杆可以在形成在上部和下部构件中的孔中上下滑动，并且部分地定位在弹性构件中。杆在升降时径向向外按压弹性部件，由此使夹紧装置卡住中空圆筒状的基部。弹性构件在最小面积上接触基座的内周，并且可靠地与其接触，从而实现所需的密封。因此，夹持装置可以在基部的外周上形成均匀的膜。

4. 发明授权

US06706647B1 Method of and apparatus for manufacturing semiconductors 失效
标题翻译：制造半导体的方法和装置
公开(公告)号：US06706647B1
公开(公告)日：2004-03-16
申请号：US09524510
申请日：2000-03-13
申请人： Yoshitsugu Tsutsumi , Yoshio Okamoto , Hideki Tomioka , Akira Ohkawa , Toshio Ando
发明人： Yoshitsugu Tsutsumi , Yoshio Okamoto , Hideki Tomioka , Akira Ohkawa , Toshio Ando
IPC分类号： H01L21469
CPC分类号： H01L21/6715
摘要： A method of and an apparatus for manufacturing semiconductors, in which a liquid raw material can be uniformly supplied onto a wafer and a gas required for film formation can be also uniformly supplied onto the wafer. A liquid raw material is sprayed from a tip end of a vaporizing nozzle into a vacuum chamber as liquid droplets, and is vaporized by heat generated from the wafer placed on a susceptor. When the liquid raw material is sprayed, a gas required for film forming reaction is supplied into the vacuum chamber from a gas supply pipe provided on an outer periphery of the vaporizing nozzle. The vaporizing nozzle and the gas supply pipe are formed to be concentric, and a liquid raw material spray port is formed centrally of the vaporizing nozzle. A gas supply port or ports on the gas supply pipe are formed on an outer peripheral portion of the vaporizing nozzle to be arranged in annular manner, and the liquid raw material spray port and the gas supply port or ports are formed to be in parallel to each other in a longitudinal direction. The gas supply port or ports are arranged in the same plane as the liquid raw material spray port is, or on an upstream side where the liquid raw material is supplied.
摘要翻译：可以将液体原料均匀地供给到晶片上，并且可以将均匀地供给到晶片上的成膜所需的气体的半导体制造方法和装置。将液体原料从蒸发喷嘴的前端喷射到作为液滴的真空室中，并通过从放置在基座上的晶片产生的热量蒸发。当喷射液体原料时，成膜反应所需的气体从设置在蒸发喷嘴的外周上的气体供给管供给到真空室中。蒸发喷嘴和气体供给管形成为同心的，并且在蒸发喷嘴的中央形成液体原料喷射口。气体供给管上的气体供给口形成在蒸发喷嘴的外周部，环状配置，液体原料喷射口和气体供给口形成为与彼此沿纵向。气体供给口配置在与液体原料喷射口相同的平面内，或配置在供给液体原料的上游侧。

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