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1. 发明授权

US5767573A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US5767573A
公开(公告)日：1998-06-16
申请号：US633456
申请日：1996-04-17
申请人： Sukehisa Noda , Akira Fujita , Naoki Yoshimatsu , Makoto Takehara
发明人： Sukehisa Noda , Akira Fujita , Naoki Yoshimatsu , Makoto Takehara
IPC分类号： H01L25/07 , H01L21/56 , H01L23/24 , H01L23/433 , H01L23/495 , H01L25/18 , H01L23/34
CPC分类号： H01L24/06 , H01L23/24 , H01L23/4334 , H01L23/49575 , H01L24/49 , H01L25/18 , H01L2224/04042 , H01L2224/05553 , H01L2224/05624 , H01L2224/05647 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48472 , H01L2224/48724 , H01L2224/48747 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01021 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01051 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/01084 , H01L2924/01087 , H01L2924/014 , H01L2924/07802 , H01L2924/1305 , H01L2924/13055 , H01L2924/15747 , H01L2924/181 , H01L2924/3025
摘要： A semiconductor device is disclosed which employs transfer molding to simplify a resin sealing step, reduces fabrication costs without using expensive elements, and has an improved efficiency of dissipation of heat generated by a power device and an improved product rating. The power device (101) and a control device (102) are placed in predetermined positions on horizontally positioned lead frames (103a, 103b), respectively. An insulating layer (105) of epoxy resin or the like is formed on a major surface of a heat sink (104), and a circuit pattern layer (106) formed on a major surface of the insulating layer (105) is shaped to conform to a predetermined circuit pattern. The lead frames (103a, 103b) are disposed on the circuit pattern layer (106).
摘要翻译：公开了一种半导体器件，其使用传递模塑来简化树脂密封步骤，降低制造成本而不使用昂贵的元件，并且具有提高的功率器件产生的热耗散效率和提高的产品额定值。功率器件（101）和控制装置（102）分别被放置在水平定位的引线框架（103a，103b）上的预定位置。在散热片（104）的主表面上形成环氧树脂等的绝缘层（105），形成在绝缘层（105）的主表面上的电路图案层（106）成形为符合到预定的电路图案。引线框架（103a，103b）设置在电路图案层（106）上。

2. 发明授权

US5463251A Power semiconductor package having improved durability 失效
标题翻译：功率半导体封装具有改进的耐久性
公开(公告)号：US5463251A
公开(公告)日：1995-10-31
申请号：US47465
申请日：1993-04-19
申请人： Akira Fujita , Naoki Yoshimatsu
发明人： Akira Fujita , Naoki Yoshimatsu
IPC分类号： H01L25/07 , H01L23/13 , H01L23/31 , H01L23/36 , H01L25/18 , H01L23/02
CPC分类号： H01L24/48 , H01L23/13 , H01L23/3121 , H01L23/3135 , H01L23/36 , H01L24/49 , H01L2224/45124 , H01L2224/48091 , H01L2224/484 , H01L2224/48699 , H01L2224/49175 , H01L24/45 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01068 , H01L2924/014 , H01L2924/1305 , H01L2924/13055
摘要： There is disclosed a semiconductor device wherein a mounting substrate (3) including an insulating layer and a pattern electrode selectively provided on the insulating layer is mounted on a heat sink (6) having a major surface. A plurality of copper supports (2) each having a surface forming an angle of substantially not more than 90.degree. with the major surface of the heat sink (6) are provided on the mounting substrate (3) such that the respective surfaces are not opposed to each other, and each of the supports (2) supports a semiconductor body (1). The semiconductor bodies (1) are connected to the pattern electrode with wires (9), and a portion enclosing at least the wires (9) is filled with a silicone gel (11). This permits the semiconductor device of large capacity to be reduced in size and to have an improved durability.
摘要翻译：公开了一种半导体器件，其中包括绝缘层和选择性地设置在绝缘层上的图案电极的安装基板（3）安装在具有主表面的散热器（6）上。在安装基板（3）上设置有多个铜支架（2），每个铜支架（2）具有与散热片（6）的主表面形成大致不大于90°的角度的表面，使得各个表面不相对并且每个支撑件（2）支撑半导体本体（1）。半导体本体（1）通过导线（9）与图案电极连接，并且至少包围电线（9）的部分填充有硅凝胶（11）。这允许大容量的半导体器件的尺寸减小并且具有改善的耐久性。

3. 发明申请

US20150035138A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20150035138A1
公开(公告)日：2015-02-05
申请号：US14385311
申请日：2012-07-05
申请人： Noboru Miyamoto , Naoki Yoshimatsu
发明人： Noboru Miyamoto , Naoki Yoshimatsu
IPC分类号： H01L23/31 , H01L23/34
CPC分类号： H01L23/31 , H01L23/16 , H01L23/3121 , H01L23/3142 , H01L23/34 , H01L23/3735 , H01L23/4334 , H01L23/49562 , H01L23/49575 , H01L25/072 , H01L25/18 , H01L2224/37147 , H01L2224/37599 , H01L2224/40137 , H01L2924/1305 , H01L2924/13055 , H01L2924/00 , H01L2924/00014
摘要： A circuit pattern is bonded to a top surface of a ceramic substrate. A cooling body is bonded to an undersurface of the ceramic substrate. An IGBT and a FWD are provided on the circuit pattern. A coating film covers a junction between the ceramic substrate and the circuit pattern, and a junction between the ceramic substrate and the cooling body. A mold resin seals the ceramic substrate, the circuit pattern, the IGBT, the FWD, the cooling body, and the coating film etc. The ceramic substrate has higher thermal conductivity than the coating film. The coating film has lower hardness than the mold resin and alleviates stress applied from the mold resin to the ceramic substrate. The circuit pattern and the cooling body includes a groove contacting the mold resin without being covered with the coating film.
摘要翻译：电路图案被结合到陶瓷衬底的顶表面。冷却体与陶瓷基板的下表面接合。在电路图案上提供IGBT和FWD。涂膜覆盖陶瓷基板和电路图案之间的接合部以及陶瓷基板与冷却体之间的接合部。模具树脂密封陶瓷基板，电路图案，IGBT，FWD，冷却体和涂膜等。陶瓷基板具有比涂膜更高的热导率。涂膜具有比模制树脂低的硬度，并且减轻了从模制树脂施加到陶瓷基板的应力。电路图案和冷却体包括与模制树脂接触而不被覆膜覆盖的槽。

4. 发明授权

US06787893B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US06787893B2
公开(公告)日：2004-09-07
申请号：US10203629
申请日：2002-08-19
申请人： Dai Nakajima , Naoki Yoshimatsu , Haruyuki Matsuo , Ryuuichi Ishii
发明人： Dai Nakajima , Naoki Yoshimatsu , Haruyuki Matsuo , Ryuuichi Ishii
IPC分类号： H01L2324
CPC分类号： H01L23/3735 , H01L23/16 , H01L23/24 , H01L23/552 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/072 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/48599 , H01L2224/48699 , H01L2224/4899 , H01L2224/49111 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01039 , H01L2924/01042 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/18301 , H01L2924/30105 , H01L2924/3025 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
摘要： A semiconductor device of the invention comprises a semiconductor element provided within a housing, a bonding wire, a sealing resin member covering the semiconductor element and bonding wire, and a sheet member. The sheet member is fixed in the housing and arranged out of contact with the bonding wire, and moreover buried in the sealing resin member. Because the sheet member restrains the sealing resin member from vibrating, the bonding wire is connected with improved reliability. In place of the sheet member, it is possible to use a pillar member fixed on an insulating substrate. The semiconductor device is suitable for use on a mobile body, such as a vehicle, which proceeds with vibrations.
摘要翻译：本发明的半导体器件包括设置在壳体内的半导体元件，接合线，覆盖半导体元件和接合线的密封树脂构件和片构件。片材固定在壳体中并布置成与接合线不接触，并且还被埋在密封树脂构件中。由于片材构件限制密封树脂构件的振动，所以接合线的可靠性提高。代替片状部件，可以使用固定在绝缘基板上的支柱部件。该半导体器件适合于在诸如车辆的移动体上使用，其随着振动而进行。

5. 发明授权

US08401073B2 Inverse quantization circuit, inverse quantization method and image reproducing apparatus 有权
标题翻译：逆量化电路，逆量化方法和图像再现装置
公开(公告)号：US08401073B2
公开(公告)日：2013-03-19
申请号：US12438927
申请日：2008-02-26
申请人： Naoki Yoshimatsu
发明人： Naoki Yoshimatsu
IPC分类号： H04N7/12 , H04N11/02
CPC分类号： H04N19/42 , H04N19/126 , H04N19/157 , H04N19/18 , H04N19/44 , H04N19/60 , H04N19/61
摘要： Provided are a versatile inverse quantization circuit which performs inverse quantization operable for various encoding systems by a single circuit, an inverse quantization method, and an image reproducing apparatus. A first multiplier generation unit (10) generates a first multiplier M1, a second multiplier generation unit (20) generates a second multiplier M2, a shift quantity generation unit (180) generates shift quantity data SF indicating a bit shift quantity, a multiplication unit (140) multiplies quantized coefficient data CD by the first multiplier M1 and the second multiplier M2, a shift unit (170) carries out bit shift operation in accordance with the shift quantity data SF, at least one of the multiplication unit (140) and the shift unit (170) determines whether or not to perform operation depending on the encoding system, and at least one of the first multiplier generation unit (10), the second multiplier generation unit (20) and the shift quantity generation unit (180) determines a value to be generated or a way of generating the value depending on the encoding system.
摘要翻译：提供了一种多功能逆量化电路，其通过单个电路，逆量化方法和图像再现装置执行用于各种编码系统的反量化。第一乘法器生成单元（10）生成第一乘法器M1，第二乘法器生成单元（20）生成第二乘法器M2，移位量生成单元（180）生成表示比特移位量的移位量数据SF，乘法单元（140）乘以量化系数数据CD乘以第一乘法器M1和第二乘法器M2，移位单元（170）根据移位量数据SF执行位移操作，乘法单元（140）和移位单元（170）根据编码系统判定是否进行动作，第一乘法器生成部（10），第二乘法器生成部（20）和移位量生成部（180）中的至少一个，确定要生成的值或根据编码系统生成值的方式。

6. 发明申请

US20120099657A1 IMAGE DECODING DEVICE, IMAGE CODING DEVICE, IMAGE DECODING METHOD, IMAGE CODING METHOD, PROGRAM, AND INTEGRATED CIRCUIT 审中-公开
标题翻译：图像解码装置，图像编码装置，图像解码方法，图像编码方法，程序和集成电路
公开(公告)号：US20120099657A1
公开(公告)日：2012-04-26
申请号：US13379442
申请日：2010-07-05
申请人： Takeshi Tanaka , Naoki Yoshimatsu
发明人： Takeshi Tanaka , Naoki Yoshimatsu
IPC分类号： H04N7/26
CPC分类号： H04N19/436
摘要： An image decoding device and an image coding device are each capable of using spatial dependence across a boundary between slices to smoothly execute parallel processing. The image decoding device includes: a first decoding unit (801) decoding a block in a first slice; a second decoding unit (802) decoding a block in a second slice; and a first storage unit (811) storing inter-slice neighboring information (i) generated by decoding a boundary block included in the first slice and adjacent to the second slice and (ii) referenced when a boundary neighboring block included in the second slice and adjacent to the boundary block is decoded. The first decoding unit (801) generates the inter-slice neighboring information by decoding the boundary block and stores the generated information into the first storage unit (811). The second decoding unit (802) decodes the boundary neighboring block by reference to the stored inter-slice neighboring information.
摘要翻译：图像解码装置和图像编码装置各自能够在切片之间的边界上使用空间依赖来平滑地执行并行处理。图像解码装置包括：第一解码单元，对第一切片中的块进行解码; 第二解码单元，对第二片中的块进行解码; 以及第一存储单元（811），其存储通过对包括在所述第一切片中并与所述第二切片相邻的边界块进行解码而生成的切片间相邻信息（i），以及（ii）当包括在所述第二切片中的边界相邻块时被参考，邻接边界块被解码。第一解码单元（801）通过解码边界块来生成切片间相邻信息，并将生成的信息存储到第一存储单元（811）中。第二解码单元（802）通过参照所存储的切片间相邻信息对边界相邻块进行解码。

7. 发明申请

US20100322317A1 IMAGE DECODING APPARATUS AND IMAGE DECODING METHOD 审中-公开
标题翻译：图像解码设备和图像解码方法
公开(公告)号：US20100322317A1
公开(公告)日：2010-12-23
申请号：US12866430
申请日：2009-10-27
申请人： Naoki Yoshimatsu , Daisuke Iwahashi , Takeshi Tanaka
发明人： Naoki Yoshimatsu , Daisuke Iwahashi , Takeshi Tanaka
IPC分类号： H04N7/26
CPC分类号： H04N19/40 , H04N19/174 , H04N19/436 , H04N19/44 , H04N19/70
摘要： To provide a simply-structured image decoding apparatus which appropriately executes parallel decoding processing. The image decoding apparatus includes: a stream segmentation unit (130) which generates plural segment streams by segmenting each of the pictures included in a bit stream into plural MB lines, and assigning each of the plural MB lines to a corresponding one of the plural segment streams to be generated; and plural decoding engines (120) which decode the respective plural segment streams in parallel. In the case where at least two consecutive MB lines in the bit stream have a dependency indicated by a predetermined code word, the stream segmentation unit (130) sets the code word to the segment streams so as to update the dependencies to new dependencies depending on the contexts of MB lines in the respective segment streams.
摘要翻译：提供一种适当执行并行解码处理的简单结构的图像解码装置。图像解码装置包括：流分割单元，通过将包含在比特流中的每个图像分割成多个MB线来生成多个分段流，并将多个MB线分配给多个分段中的相应一个要生成的流; 以及并行解码各个分段流的多个解码引擎（120）。在比特流中至少两个连续的MB线具有由预定码字指示的依赖性的情况下，流分段单元（130）将码字设置为片段流，以便根据依赖关系将依赖性更新为新依赖各行段流中MB行的上下文。

8. 发明授权

US06940164B1 Power module 有权
标题翻译：电源模块
公开(公告)号：US06940164B1
公开(公告)日：2005-09-06
申请号：US10110344
申请日：2000-08-18
申请人： Naoki Yoshimatsu , Dai Nakajima
发明人： Naoki Yoshimatsu , Dai Nakajima
IPC分类号： H01L23/13 , H01L23/24 , H01L25/16 , H01L23/34 , H01L23/02 , H01L29/00
CPC分类号： H01L23/13 , H01L23/24 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/16 , H01L25/162 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48472 , H01L2224/4903 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/14 , H01L2924/15151 , H01L2924/181 , H01L2924/19041 , H01L2924/19107 , H01L2924/30107 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
摘要： A power module incorporates a switching semiconductor element and a smoothing capacitor and includes a metallic base plate dissipating heat produced by the switching semiconductor element and the smoothing capacitor. The metallic base plate is thermally separated into a first region adjacent to the switching semiconductor element and a second region adjacent to the smoothing capacitor.
摘要翻译：功率模块包括开关半导体元件和平滑电容器，并且包括散热由开关半导体元件和平滑电容器产生的热量的金属基板。金属基板被热分离成与开关半导体元件相邻的第一区域和与平滑电容器相邻的第二区域。

9. 发明授权

US06762937B2 Power module 有权
标题翻译：电源模块
公开(公告)号：US06762937B2
公开(公告)日：2004-07-13
申请号：US10314989
申请日：2002-12-10
申请人： Nobuyoshi Kimoto , Takanobu Yoshida , Naoki Yoshimatsu , Masuo Koga , Dai Nakajima , Gourab Majumdar , Masakazu Fukada
发明人： Nobuyoshi Kimoto , Takanobu Yoshida , Naoki Yoshimatsu , Masuo Koga , Dai Nakajima , Gourab Majumdar , Masakazu Fukada
IPC分类号： H05K720
CPC分类号： H02M7/003 , H01L23/057 , H01L23/50 , H01L23/60 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/072 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/4811 , H01L2224/48137 , H01L2224/48227 , H01L2224/49109 , H01L2224/73265 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01074 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1532 , H01L2924/16152 , H01L2924/19041 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/351 , H01L2924/00014 , H01L2924/00
摘要： A power module includes a substrate with a power semiconductor device mounted thereon, a case having an interior in which the substrate is disposed, a cooling fin having a surface on which the substrate and the case are placed, and a smoothing capacitor disposed on an opposite surface of the cooling fin from the surface on which the substrate is placed, the smoothing capacitor being electrically connected to the power semiconductor device for smoothing a voltage to be externally supplied to the power semiconductor device.
摘要翻译：功率模块包括其上安装有功率半导体器件的衬底，具有其中设置有衬底的内部的壳体，具有衬底和壳体的表面的冷却翅片以及布置在其上的平滑电容器所述平滑电容器电连接到所述功率半导体器件，用于使外部提供给所述功率半导体器件的电压平滑。

10. 发明授权

US06509629B2 Power module 有权
标题翻译：电源模块
公开(公告)号：US06509629B2
公开(公告)日：2003-01-21
申请号：US09759252
申请日：2001-01-16
申请人： Naoki Yoshimatsu , Takanobu Yoshida
发明人： Naoki Yoshimatsu , Takanobu Yoshida
IPC分类号： H01L23552
CPC分类号： H01L23/552 , H01L24/48 , H01L25/162 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/48247 , H01L2224/85399 , H01L2924/00014 , H01L2924/0102 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H05K1/0218 , H05K1/144 , H05K9/0022 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A control substrate is covered by an electromagnetic shielding member connected to a conductive base plate on which a power insulating substrate is placed. A conductive connecting member through which the electromagnetic shielding member and the conductive base plate are electrically connected to each other is inserted into a case. The control substrate and the electromagnetic shielding member are supported by the conductive connecting member.
摘要翻译：控制基板由连接到其上放置有电力绝缘基板的导电基板的电磁屏蔽构件覆盖。将电磁屏蔽构件和导电基板彼此电连接的导电连接构件插入到壳体中。控制基板和电磁屏蔽部件由导电连接部件支撑。

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