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1. 发明授权

US07081671B2 Power module 失效
标题翻译：电源模块
公开(公告)号：US07081671B2
公开(公告)日：2006-07-25
申请号：US10216789
申请日：2002-08-13
申请人： Masakazu Fukada , Dai Nakajima , Ken Takanashi
发明人： Masakazu Fukada , Dai Nakajima , Ken Takanashi
IPC分类号： H01L23/34
CPC分类号： H01L24/49 , H01L23/473 , H01L24/48 , H01L25/072 , H01L2223/6622 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/48227 , H01L2224/4824 , H01L2224/48472 , H01L2224/49111 , H01L2224/49175 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01016 , H01L2924/01029 , H01L2924/01042 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/30107 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： In a power module (111), a free-wheeling diode (1A), an IGBT (1B), and a capacitor (20) for smoothing direct current are disposed directly on a surface (2BS) of a conductive heat sink (2B) with through holes (2BH). The rear electrodes of the free wheeling diode (1A), the IGBT (1B), and the capacitor (20) are bonded to the heat sink (2B) for example with solder, whereby the diode (1A), the IGBT (1B), and the capacitor (20) are electrically connected with the heat sink (2B). The front electrodes of the diode (1A), the IGBT (1B), and the capacitor (20) are connected with each other for example by wires (7). In the heat sink (2B), a cooling medium flows through the through holes (2BH). Such a configuration allows miniaturization of the power module and improves the cooling performance and reliability of the power module.
摘要翻译：在功率模块（111）中，用于平滑直流电流的续流二极管（1A），IGBT（1B）和电容器（20）直接设置在导电散热器的表面（2 BS）上（2B）带通孔（2 BH）。续流二极管（1A），IGBT（1B）和电容器（20）的后电极例如用焊料接合到散热器（2B），由此二极管（1A）， IGBT（1B）和电容器（20）与散热器（2B）电连接。二极管（1A），IGBT（1B）和电容器（20）的前电极通过电线（7）彼此连接。在散热器（2B）中，冷却介质流过通孔（2 BH）。这样的配置允许功率模块的小型化并且提高功率模块的冷却性能和可靠性。

2. 发明授权

US06580147B2 Semiconductor device having built-in capacitors 有权
标题翻译：具有内置电容器的半导体器件
公开(公告)号：US06580147B2
公开(公告)日：2003-06-17
申请号：US09805576
申请日：2001-03-14
申请人： Toru Kimura , Dai Nakajima , Tatsuya Okuda , Takeshi Ohi , Takanobu Yoshida , Naoki Yoshimatsu , Yuuji Kuramoto , Toshinori Yamane , Masakazu Fukada , Majumdar Gourab
发明人： Toru Kimura , Dai Nakajima , Tatsuya Okuda , Takeshi Ohi , Takanobu Yoshida , Naoki Yoshimatsu , Yuuji Kuramoto , Toshinori Yamane , Masakazu Fukada , Majumdar Gourab
IPC分类号： H01L2900
CPC分类号： H01L27/0629 , H01L27/0647
摘要： P-electrode 30a and N-electrode 31a of a semiconductor device 2, and capacitors 10 in a plate-like shape or a block-like shape respectively connected to U-phase 40, V-phase 41, and W-phase 42 having a switching element 20 and a diode 21 are built in a semiconductor device 2, and a single or a plurality of capacitors 10 are respectively connected to P-electrodes 30a and N-electrodes 31a in each of the phases, whereby the smoothing capacitors are built in the semiconductor device to reduce wiring inductances, the capacitors are miniaturized, and an entire electric power converting device, i.e. inverter, is miniaturized.
摘要翻译：半导体器件2的P电极30a和N电极31a以及分别连接到U相40，V相41和W相42的板状或块状形状的电容器10具有开关元件20和二极管21内置在半导体器件2中，并且在各相中分别将单个或多个电容器10连接到P电极30a和N电极31a，由此将平滑电容器内置减少布线电感的半导体器件，电容器小型化，整个电力转换装置即逆变器小型化。

3. 发明授权

US06900986B2 Power module 有权
标题翻译：电源模块
公开(公告)号：US06900986B2
公开(公告)日：2005-05-31
申请号：US10810832
申请日：2004-03-29
申请人： Nobuyoshi Kimoto , Takanobu Yoshida , Naoki Yoshimatsu , Masuo Koga , Dai Nakajima , Gourab Majumdar , Masakazu Fukada
发明人： Nobuyoshi Kimoto , Takanobu Yoshida , Naoki Yoshimatsu , Masuo Koga , Dai Nakajima , Gourab Majumdar , Masakazu Fukada
IPC分类号： H01L23/057 , H01L23/50 , H01L23/60 , H01L25/07 , H01L25/18 , H02M1/00 , H02M7/00 , H02M7/04 , H05K7/20
CPC分类号： H02M7/003 , H01L23/057 , H01L23/50 , H01L23/60 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/072 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/4811 , H01L2224/48137 , H01L2224/48227 , H01L2224/49109 , H01L2224/73265 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01074 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1532 , H01L2924/16152 , H01L2924/19041 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/351 , H01L2924/00014 , H01L2924/00
摘要： A power module includes a first substrate with a power semiconductor device mounted thereon, a second substrate with a control circuit for controlling the power semiconductor device formed thereon, a smoothing capacitor electrically connected to the power semiconductor device for smoothing a voltage to be externally supplied to the power semiconductor device, and a case including a case frame and a case lid. The case has an interior in which the first substrate, the second substrate and the smoothing capacitor are disposed, and the smoothing capacitor is disposed in contact with a side surface of the case frame.
摘要翻译：功率模块包括其上安装有功率半导体器件的第一衬底，具有用于控制其上形成的功率半导体器件的控制电路的第二衬底，电连接到功率半导体器件的平滑电容器，用于平滑外部供应到功率半导体器件，以及包括壳体框架和壳体盖的壳体。壳体具有其中设置有第一基板，第二基板和平滑电容器的内部，并且平滑电容器设置成与壳体框架的侧表面接触。

4. 发明授权

US06563211B2 Semiconductor device for controlling electricity 有权
标题翻译：用于控制电力的半导体装置
公开(公告)号：US06563211B2
公开(公告)日：2003-05-13
申请号：US09791794
申请日：2001-02-26
申请人： Masakazu Fukada , Hiroshi Nishibori , Takanobu Yoshida , Naoki Yoshimatsu , Nobuyoshi Kimoto , Haruo Takao
发明人： Masakazu Fukada , Hiroshi Nishibori , Takanobu Yoshida , Naoki Yoshimatsu , Nobuyoshi Kimoto , Haruo Takao
IPC分类号： H01L2334
CPC分类号： H01L23/5386 , H01L25/18 , H01L2224/45124 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/19107 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device for controlling electricity including a metal base plate and at least one insulating substrate. The insulating substrate includes an insulator plate, a back-side pattern on a back face of the insulator plate and bonded to the metal base plate, and two circuit patterns located on a front face of the insulator plate and above the back-side pattern. Each of the two circuit patterns has an “L” shape and extends along two sides of the insulator plate that are continued and perpendicular to each other. The two circuit patterns are also arranged at opposed corners of the insulator plate in a centrosymmetrical relation each other. Further, in each circuit pattern, a switching element is sandwiched between a free-wheel diode and an electrode area.
摘要翻译：一种用于控制电的半导体器件，包括金属基板和至少一个绝缘基板。绝缘基板包括绝缘体板，绝缘体板的背面上的背面图案并且接合到金属基板，以及位于绝缘体板的正面和背面图案上方的两个电路图案。两个电路图案中的每一个都具有“L”形并且沿彼此连续并垂直的绝缘板的两侧延伸。两个电路图案也以彼此相对中心对称的方式布置在绝缘板的相对的角处。此外，在每个电路图案中，开关元件夹在续流二极管和电极区域之间。

5. 发明授权

US06522544B1 Power module 有权
标题翻译：电源模块
公开(公告)号：US06522544B1
公开(公告)日：2003-02-18
申请号：US09690012
申请日：2000-10-17
申请人： Nobuyoshi Kimoto , Takanobu Yoshida , Naoki Yoshimatsu , Masuo Koga , Dai Nakajima , Gourab Majumdar , Masakazu Fukada
发明人： Nobuyoshi Kimoto , Takanobu Yoshida , Naoki Yoshimatsu , Masuo Koga , Dai Nakajima , Gourab Majumdar , Masakazu Fukada
IPC分类号： H05K720
CPC分类号： H02M7/003 , H01L23/057 , H01L23/50 , H01L23/60 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/072 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/4811 , H01L2224/48137 , H01L2224/48227 , H01L2224/49109 , H01L2224/73265 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01074 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1532 , H01L2924/16152 , H01L2924/19041 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/351 , H01L2924/00014 , H01L2924/00
摘要： A power module includes a box-shaped smoothing capacitor (20) for smoothing a DC supply voltage to be externally applied to a power semiconductor device (5). The smoothing capacitor (20) is in contact with a side surface of a case frame (6) including a side (along which an N-terminal (8N) and a P-terminal (8P) are arranged) of a top surface of the case frame (6), and has a top surface level with the top surface of the case frame (6). An N-electrode (21N) and a P-electrode (21P) of the smoothing capacitor (20) are disposed on the top surface of the smoothing capacitor (20) and in proximity to the N-terminal (8N) and the P-terminal (8P) of a power module body portion (99), respectively. The power module can reduce a circuit inductance, is reduced in size and weight, and has good resistance to vibration.
摘要翻译：功率模块包括用于平滑外部施加到功率半导体器件（5）的DC电源电压的盒形平滑电容器（20）。平滑电容器（20）与壳体框架（6）的侧表面接触，该壳体框架（6）的侧表面包括侧面（其中布置有N端子（8N）和P端子（8P））壳体框架（6），并且具有与壳体框架（6）的顶表面的顶表面水平。平滑电容器（20）的N电极（21N）和P电极（21P）设置在平滑电容器（20）的顶表面上并且靠近N端子（8N）和P- 端子（8P）分别连接到电源模块主体部分（99）。电源模块可以减小电路电感，减小尺寸和重量，并具有良好的抗振动性。

6. 发明授权

US6051893A Electric power supply system for load 失效
标题翻译：负载供电系统
公开(公告)号：US6051893A
公开(公告)日：2000-04-18
申请号：US181556
申请日：1998-10-29
申请人： Hiroshi Yamamoto , Hiroyuki Sasao , Kenichi Koyama , Yukimori Kishida , Toshimasa Maruyama , Masakazu Fukada
发明人： Hiroshi Yamamoto , Hiroyuki Sasao , Kenichi Koyama , Yukimori Kishida , Toshimasa Maruyama , Masakazu Fukada
IPC分类号： H02J9/06 , H02J3/00 , H02J9/04
CPC分类号： H02J9/06 , Y02P80/11 , Y10T307/50 , Y10T307/615 , Y10T307/735
摘要： A fast changeover from one power system to another in the event of an irregularity in the power source system substantially reduces operating costs by minimizing a power loss in switches during conduction, dispenses with a cooling device for cooling a thyristor switch, and implements the thyristor switch in a compact and low-cost design. The power supply system for a load includes one switching apparatus for connecting a load to one power source system, and another switching apparatus for connecting the load to another power source system. Each of the switching apparatus includes a pair of thyristors connected in anti-parallel and a mechanical switch connected in parallel with the thyristor pair. The thyristor pairs and the mechanical switches are controlled so that the mechanical switches conduct a load current when the load is supplied with power from the one power source system in a steady power supply state. The thyristor switches conduct the load current during a power source changeover time within which the load is disconnected from one power source system and connected to the other power source system, and do not conduct the load current during the steady power supply state.
摘要翻译：在电源系统不规则的情况下，从一个电力系统到另一个电力系统的快速切换通过在传导期间最小化开关中的功率损耗来大大降低运行成本，省略用于冷却晶闸管开关的冷却装置，并且实施晶闸管开关在一个紧凑和低成本的设计。用于负载的电源系统包括用于将负载连接到一个电源系统的一个开关装置和用于将负载连接到另一个电源系统的另一个开关装置。开关装置中的每一个包括以并联方式连接的一对晶闸管和与晶闸管对并联连接的机械开关。控制晶闸管对和机械开关，使得当负载在稳定供电状态下从一个电源系统供电时，机械开关传导负载电流。晶闸管开关在负载从一个电源系统断开并连接到另一个电源系统的电源切换时间内导通负载电流，并且在稳定供电状态期间不会导通负载电流。

7. 发明授权

US06501172B1 Power module 有权
标题翻译：电源模块
公开(公告)号：US06501172B1
公开(公告)日：2002-12-31
申请号：US09671172
申请日：2000-09-28
申请人： Masakazu Fukada , Dai Nakajima , Ken Takanashi
发明人： Masakazu Fukada , Dai Nakajima , Ken Takanashi
IPC分类号： H01L2310
CPC分类号： H01L24/49 , H01L23/473 , H01L24/48 , H01L25/072 , H01L2223/6622 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/48227 , H01L2224/4824 , H01L2224/48472 , H01L2224/49111 , H01L2224/49175 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01016 , H01L2924/01029 , H01L2924/01042 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/30107 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： In a powder module (111), a free-wheeling diode (1A), an IGBH (1B), and a capacitor (20) for smoothing direct current are disposed directly on a surface (2BS) of a conductive heat sink (2B) with through holes (2BH). The rear electrodes of the free-wheeling diode (1A), the IGBT (1B), and the capacitor (20) are bonded to the heat sink (2B) for example with solder, whereby the diode (1A), the IGBT (1B), and the capacitor (20) are electrically connected with the heat sink (2B). The front electrodes of the diodes (1A), the IGBT (1B), and the capacitor (20) are connected with each other for example by wires (7). In the heat sink (2B), a cooling medium flows through the through holes (2BH). Such a configuration allows miniaturization of the power module and improves the cooling performance and reliability of the power module.
摘要翻译：在粉末模块（111）中，用于平滑直流电流的续流二极管（1A），IGBH（1B）和电容器（20）直接设置在导电散热器（2B）的表面（2BS）上，带通孔（2BH）。续流二极管（1A），IGBT（1B）和电容器（20）的后电极例如用焊料接合到散热器（2B），由此二极管（1A），IGBT（1B ），电容器（20）与散热器（2B）电连接。二极管（1A），IGBT（1B）和电容器（20）的前电极通过电线（7）彼此连接。在散热器（2B）中，冷却介质流过通孔（2BH）。这样的配置允许功率模块的小型化并且提高功率模块的冷却性能和可靠性。

8. 发明授权

US06304448B1 Power module 有权
标题翻译：电源模块
公开(公告)号：US06304448B1
公开(公告)日：2001-10-16
申请号：US09657236
申请日：2000-09-07
申请人： Masakazu Fukada , Dai Nakajima , Ken Takanashi
发明人： Masakazu Fukada , Dai Nakajima , Ken Takanashi
IPC分类号： H01K720
CPC分类号： H05K7/209 , H01L24/73 , H01L2224/32225 , H01L2224/48227 , H01L2224/49109 , H01L2224/73265 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H05K1/144 , H01L2924/00012 , H01L2924/00
摘要： Obtained is a power module which is excellent in electromagnetic shielding effects, is rarely influenced by external noises and acts as an external noise source with difficulty. An insulating substrate (5) is bonded through a solder (4) to a top surface of a heat sink (3) fixed to a support plate (2). A DC capacitor (16) is fixed to a bottom face of the heat sink (3) by adhesion. A control substrate (11) having a control IC (13) mounted thereon is fixed to the support plate (2). Moreover, a plurality of electrodes (10), a DC side electrode and refrigerant inlet-outlet (9) and a control connector (15) are provided on the support plate (2). A case (1) is fixed to a peripheral portion of the support plate (2), and surrounds the insulating substrate (5), the control substrate (11), the heat sink (3) and the DC capacitor 16 together with the support plate (2). Both the case (1) and the support plate (2) have conducting property.
摘要翻译：获得的是电磁屏蔽效果优异的电源模块，很少受到外部噪声的影响，作为外部噪声源的困难。绝缘基板（5）通过焊料（4）接合到固定到支撑板（2）的散热器（3）的顶表面。直流电容器（16）通过粘附固定在散热器（3）的底面上。安装有控制IC（13）的控制基板（11）固定在支撑板（2）上。此外，在支撑板（2）上设置有多个电极（10），DC侧电极和制冷剂入口出口（9）以及控制连接器（15）。壳体（1）固定在支撑板（2）的周边部分，并与支撑体（1）一起包围绝缘基板（5），控制基板（11），散热片（3）和直流电容器16 板（2）。壳体（1）和支撑板（2）都具有导电性能。

9. 发明授权

US06762937B2 Power module 有权
标题翻译：电源模块
公开(公告)号：US06762937B2
公开(公告)日：2004-07-13
申请号：US10314989
申请日：2002-12-10
申请人： Nobuyoshi Kimoto , Takanobu Yoshida , Naoki Yoshimatsu , Masuo Koga , Dai Nakajima , Gourab Majumdar , Masakazu Fukada
发明人： Nobuyoshi Kimoto , Takanobu Yoshida , Naoki Yoshimatsu , Masuo Koga , Dai Nakajima , Gourab Majumdar , Masakazu Fukada
IPC分类号： H05K720
CPC分类号： H02M7/003 , H01L23/057 , H01L23/50 , H01L23/60 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/072 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/4811 , H01L2224/48137 , H01L2224/48227 , H01L2224/49109 , H01L2224/73265 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01074 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1532 , H01L2924/16152 , H01L2924/19041 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/3025 , H01L2924/351 , H01L2924/00014 , H01L2924/00
摘要： A power module includes a substrate with a power semiconductor device mounted thereon, a case having an interior in which the substrate is disposed, a cooling fin having a surface on which the substrate and the case are placed, and a smoothing capacitor disposed on an opposite surface of the cooling fin from the surface on which the substrate is placed, the smoothing capacitor being electrically connected to the power semiconductor device for smoothing a voltage to be externally supplied to the power semiconductor device.
摘要翻译：功率模块包括其上安装有功率半导体器件的衬底，具有其中设置有衬底的内部的壳体，具有衬底和壳体的表面的冷却翅片以及布置在其上的平滑电容器所述平滑电容器电连接到所述功率半导体器件，用于使外部提供给所述功率半导体器件的电压平滑。

10. 发明授权

US06541838B1 Power module 失效
标题翻译：电源模块
公开(公告)号：US06541838B1
公开(公告)日：2003-04-01
申请号：US09705770
申请日：2000-11-06
申请人： Eiji Suetsugu , Masakazu Fukada
发明人： Eiji Suetsugu , Masakazu Fukada
IPC分类号： H01L2900
CPC分类号： H02P25/08 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48472 , H01L2224/49111 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01038 , H01L2924/01042 , H01L2924/01052 , H01L2924/01068 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/13055 , H01L2924/15787 , H01L2924/19043 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： Provided is a power module capable of driving an SR motor, giving a small size and high versatility and reducing a manufacturing cost. A switching element 1a and a diode element 2b which are to be connected to a P power wiring 5 are provided to form a first line on the band-shaped P power wiring 5, a switching element 1b and a diode element 2a which are to be connected to an N power wiring 6 are provided to form a second line aligned with the first line, and first band-shaped portions 41 and 44 of output terminals 3 and 4 and a band-shaped portion 61 of the N power wiring 6 are provided therebetween. The first band-shaped portions 41 and 44 and the band-shaped portion 61 have a two-layer structure with an insulating layer interposed therebetween. The switching elements 1a and 1b and the diode elements 2a and 2b are arranged alternately.
摘要翻译：提供能够驱动SR电动机的功率模块，具有小尺寸和高通用性并降低制造成本。设置要连接到P电源线5的开关元件1a和二极管元件2b，以在带状P电源线5，开关元件1b和二极管元件2a上形成第一线设置与N个电源线6连接以形成与第一线对齐的第二线，并且设置输出端子3和4的第一带状部分41和44以及N电力线6的带状部分61 之间。第一带状部分41和44以及带状部分61具有介于其间的绝缘层的两层结构。开关元件1a和1b以及二极管元件2a和2b交替布置。

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