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    • 1. 发明授权
    • High-speed semiconductor memory device and data processing system using
the same
    • 高速半导体存储器件和数据处理系统使用相同
    • US5654931A
    • 1997-08-05
    • US213531
    • 1994-03-16
    • Akihiro TambaMasahiro IwamuraYutaka KobayashiKinya MitsumotoTatsumi YamauchiShuko YamauchiTakashi Akioka
    • Akihiro TambaMasahiro IwamuraYutaka KobayashiKinya MitsumotoTatsumi YamauchiShuko YamauchiTakashi Akioka
    • G11C7/22G11C13/00
    • G11C7/22
    • A semiconductor integrated circuit device is divided into a plurality of blocks, which are individually equipped with signal generate units such that the signal generate units are distributed in the semiconductor integrated circuit device. The semiconductor integrated circuit device is preferably constructed to generate the pulse signal by the pulse generate units which are provided for the individual blocks, after all initial logic operations on the data and control signals have been taken. Thanks to this construction, an SRAM, for example, can have its write recovery time minimized to 0 so that it can achieve high-speed operations. Moreover, since predecoders are provided for the individual blocks, the wiring line number and area in the chip can be reduced to improve the degree of integration of the semiconductor integrated circuit device. Still moreover, signal delay and skew can be reduced in the chip so that high-speed can be achieved. Another feature is that either the input/output pads of the data into or out of the semiconductor integrated circuit device or their accompanying circuit units are distributed in the semiconductor integrated circuit device. The individual features described above can be used solely or in combination, if necessary, to achieve the above-specified objects.
    • 半导体集成电路器件被分成多个块,它们分别配备有信号生成单元,使得信号生成单元分布在半导体集成电路器件中。 优选地,半导体集成电路器件被构造为在对数据和控制信号进行了所有初始逻辑运算之后,通过针对各个块提供的脉冲产生单元产生脉冲信号。 由于这种结构,例如,SRAM可以将其写恢复时间最小化为0,从而可以实现高速操作。 此外,由于为每个块提供预编码器,所以可以减少芯片中的布线数量和面积,以提高半导体集成电路器件的集成度。 此外,芯片中的信号延迟和偏斜可以降低,从而可以实现高速度。 另一个特征是将半导体集成电路器件的数据的输入/输出焊盘或其相应的电路单元分布在半导体集成电路器件中。 如果需要,可以单独地或组合地使用上述各个特征来实现上述目的。