专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09194038B2 Thin film forming apparatus, thin film forming method, and shield component 有权
标题翻译：薄膜形成装置，薄膜形成方法和屏蔽部件
公开(公告)号：US09194038B2
公开(公告)日：2015-11-24
申请号：US12974245
申请日：2010-12-21
申请人： Akihiro Egami , Toshikazu Nakazawa , Katsuhiro Suzuki , Shinya Hasegawa
发明人： Akihiro Egami , Toshikazu Nakazawa , Katsuhiro Suzuki , Shinya Hasegawa
IPC分类号： C23C14/00 , C23C14/34 , C23C14/56 , C23C16/44 , C23C16/455 , C23C16/458 , H01J37/32 , H01J37/34
CPC分类号： C23C14/564 , C23C14/0036 , C23C14/34 , C23C16/4401 , C23C16/45591 , C23C16/4585 , H01J37/32477 , H01J37/32651 , H01J37/3405 , H01J37/3411 , H01J37/3441 , H01J2237/026 , H01J2237/0268
摘要： The inventors of this invention conducted a test and found out that to prevent peel-off of an adherent film, it is not of essential importance to set the radius of curvature equal to or larger than a predetermined threshold. The inventors of the present invention also found out that peel-off of an adherent film occurs in the region in which the curvature of a shield changes and is less likely to occur when the change in curvature of the shield is small. Accordingly, the key to the problem is the magnitude of a change in curvature of the shield, so changing the curvature stepwise makes it possible to suppress a large change in curvature, and thus to prevent peel-off of an adherent film free from any disadvantages such as deterioration in film thickness distribution, which may occur due to an increase in size of the shield.
摘要翻译：本发明人进行了测试，发现为了防止粘附膜的剥离，将曲率半径设定为等于或大于预定阈值不是重要的。本发明的发明人还发现，粘合膜的剥离发生在屏蔽的曲率变化的区域中，并且当屏蔽的曲率变化小时不太可能发生。因此，问题的关键在于屏蔽体的曲率变化的大小，因此逐渐改变曲率使得可以抑制曲率的大的变化，从而防止粘附膜的剥离没有任何缺点例如由于屏蔽件的尺寸增加而可能发生的膜厚分布的劣化。

2. 发明申请

US20110155059A1 THIN FILM FORMING APPARATUS, THIN FILM FORMING METHOD, AND SHIELD COMPONENT 有权
标题翻译：薄膜成型装置，薄膜成型方法和屏蔽部件
公开(公告)号：US20110155059A1
公开(公告)日：2011-06-30
申请号：US12974245
申请日：2010-12-21
申请人： Akihiro Egami , Toshikazu Nakazawa , Katsuhiro Suzuki , Shinya Hasegawa
发明人： Akihiro Egami , Toshikazu Nakazawa , Katsuhiro Suzuki , Shinya Hasegawa
IPC分类号： C23C16/50 , C23C16/00
CPC分类号： C23C14/564 , C23C14/0036 , C23C14/34 , C23C16/4401 , C23C16/45591 , C23C16/4585 , H01J37/32477 , H01J37/32651 , H01J37/3405 , H01J37/3411 , H01J37/3441 , H01J2237/026 , H01J2237/0268
摘要： The inventors of this invention conducted a test and found out that to prevent peel-off of an adherent film, it is not of essential importance to set the radius of curvature equal to or larger than a predetermined threshold. The inventors of the present invention also found out that peel-off of an adherent film occurs in the region in which the curvature of a shield changes and is less likely to occur when the change in curvature of the shield is small. Accordingly, the key to the problem is the magnitude of a change in curvature of the shield, so changing the curvature stepwise makes it possible to suppress a large change in curvature, and thus to prevent peel-off of an adherent film free from any disadvantages such as deterioration in film thickness distribution, which may occur due to an increase in size of the shield.
摘要翻译：本发明人进行了测试，发现为了防止粘附膜的剥离，将曲率半径设定为等于或大于预定阈值不是重要的。本发明的发明人还发现，粘合膜的剥离发生在屏蔽的曲率变化的区域中，并且当屏蔽的曲率变化小时不太可能发生。因此，问题的关键在于屏蔽体的曲率变化的大小，因此逐渐改变曲率使得可以抑制曲率的大的变化，从而防止粘附膜的剥离没有任何缺点例如由于屏蔽件的尺寸增加而可能发生的膜厚分布的劣化。

3. 发明授权

US09245785B2 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US09245785B2
公开(公告)日：2016-01-26
申请号：US13344663
申请日：2012-01-06
申请人： Yukihito Tashiro , Toshikazu Nakazawa
发明人： Yukihito Tashiro , Toshikazu Nakazawa
IPC分类号： H01L21/677 , H01L21/67
CPC分类号： H01L21/67748 , H01L21/67173 , H01L21/67184 , H01L21/6719 , H01L21/67196
摘要： The present invention provides an in-line type multi-chamber substrate processing apparatus which, with a simple configuration, can decrease influence of particles due to film peeling and enables installation of a number of processing chambers. In one embodiment of the present invention, a jointless arm of a transfer robot that has a substrate holding part 4a and performs rotational movement while maintaining a predetermined length of the arm is disposed inside a first process chamber capable of being evacuated. The first process chamber is configured to be able to transfer substrates from an adjacent second process chamber through an opening by the arm of the transfer robot. A holder as an arm retreating position and a substrate mounting position is positioned so as to overlap with a trajectory of the substrate holding part when the arm of the transfer robot rotates about a rotation axis.
摘要翻译：本发明提供了一种在线型多室基板处理装置，其具有简单的结构，可以减少由于膜剥离引起的颗粒的影响，并且能够安装多个处理室。在本发明的一个实施例中，具有基板保持部4a并且在保持臂的预定长度的同时进行旋转运动的传送机器人的无接头臂设置在能够被抽真空的第一处理室的内部。第一处理室被配置为能够通过传送机器人的臂从相邻的第二处理室传送基板通过开口。作为臂退避位置的保持器和基板安装位置被定位成当传送机器人的臂围绕旋转轴旋转时与基板保持部的轨迹重叠。

4. 发明申请

US20090320948A1 STACKED LOAD LOCK CHAMBER AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME 审中-公开
标题翻译：堆叠式负载锁仓和底板处理装置，包括它们
公开(公告)号：US20090320948A1
公开(公告)日：2009-12-31
申请号：US12482050
申请日：2009-06-10
申请人： Hirofumi Asanuma , Toshikazu Nakazawa
发明人： Hirofumi Asanuma , Toshikazu Nakazawa
IPC分类号： F16K11/02
CPC分类号： F16K51/02 , F16K1/16 , F16K3/0218 , H01L21/67126 , H01L21/67201 , Y10T137/86919
摘要： A stacked load lock chamber comprises a first load lock chamber, a second load lock chamber stacked on the first load lock chamber, a first slit-valve mover configured to open and close a first opening provided to an atmosphere side of the first load lock chamber, a second slit-valve mover configured to open and close a second opening provided to an atmosphere side of the second load lock chamber, a first arm connected to the first slit-valve mover, a second arm connected to the second slit-valve mover, and a driver located below the first and second load lock chambers and configured to drive the first and second arms to move the first and second slit-valve movers through the first and second arms.
摘要翻译：堆叠的负载锁定室包括第一负载锁定室，堆叠在第一负载锁定室上的第二负载锁定室，第一狭缝阀移动器，被配置为打开和关闭设置在第一负载锁定室的大气侧的第一开口第二狭缝阀移动器，被构造成打开和关闭设置在第二负载锁定室的大气侧的第二开口;连接到第一狭缝阀移动器的第一臂，连接到第二狭缝阀移动器的第二臂以及位于第一和第二加载锁定室下方的驱动器，并且构造成驱动第一和第二臂以使第一和第二狭缝阀移动器通过第一和第二臂移动。

5. 发明申请

US20120148375A1 SUBSTRATE PROCESSING APPARATUS 有权
标题翻译：基板加工设备
公开(公告)号：US20120148375A1
公开(公告)日：2012-06-14
申请号：US13344663
申请日：2012-01-06
申请人： Yukihito Tashiro , Toshikazu Nakazawa
发明人： Yukihito Tashiro , Toshikazu Nakazawa
IPC分类号： B65G49/00
CPC分类号： H01L21/67748 , H01L21/67173 , H01L21/67184 , H01L21/6719 , H01L21/67196
摘要： The present invention provides an in-line type multi-chamber substrate processing apparatus which, with a simple configuration, can decrease influence of particles due to film peeling and enables installation of a number of processing chambers. In one embodiment of the present invention, a jointless arm of a transfer robot that has a substrate holding part 4a and performs rotational movement while maintaining a predetermined length of the arm is disposed inside a first process chamber capable of being evacuated. The first process chamber is configured to be able to transfer substrates from an adjacent second process chamber through an opening by the arm of the transfer robot. A holder as an arm retreating position and a substrate mounting position is positioned so as to overlap with a trajectory of the substrate holding part when the arm of the transfer robot rotates about a rotation axis.
摘要翻译：本发明提供了一种在线型多室基板处理装置，其具有简单的结构，可以减少由于膜剥离引起的颗粒的影响，并且能够安装多个处理室。在本发明的一个实施例中，具有基板保持部4a并且在保持臂的预定长度的同时进行旋转运动的传送机器人的无接头臂设置在能够被抽真空的第一处理室的内部。第一处理室被配置为能够通过传送机器人的臂从相邻的第二处理室传送基板通过开口。作为臂退避位置的保持器和基板安装位置被定位成当传送机器人的臂围绕旋转轴旋转时与基板保持部的轨迹重叠。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式