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1. 发明授权

US4860461A Coffee beans roasting device 失效
标题翻译：咖啡豆焙烧装置
公开(公告)号：US4860461A
公开(公告)日：1989-08-29
申请号：US177353
申请日：1988-04-01
申请人： Yoji Tamaki , Takuya Kino , Takashi Ito , Akihiko Nakamura
发明人： Yoji Tamaki , Takuya Kino , Takashi Ito , Akihiko Nakamura
IPC分类号： A23N12/10
CPC分类号： A23N12/10
摘要： The roasting body is composed of a roasting body, a rotary drum supported on the inside of the roasting body to rotate in a horizontal attitude to accommodate and stir the coffee beans, infrared heaters disposed on the inner wall surface of the roasting body to surround the rotary drum in order to heat the coffee beans accommodated in the rotary drum by radiant heat, and a circulating path to circulate the hot air in the rotary drum into the roasting body in order to utilize the thermal energy effectively.

2. 发明授权

US5016362A Coffee bean roasting device 失效
标题翻译：咖啡豆焙烧装置
公开(公告)号：US5016362A
公开(公告)日：1991-05-21
申请号：US537148
申请日：1990-06-12
申请人： Akihiko Nakamura , Takashi Ito
发明人： Akihiko Nakamura , Takashi Ito
IPC分类号： A23N12/10
CPC分类号： A23N12/10
摘要： A coffee bean roasting device includes a heating oven and a roasting drum in the heating drum, infrared heaters attached to inner walls of the heating oven, and a cooling drum provided under the roasting drum. The device further includes agitating blades spirally provided on inner walls of the roasting drum and the cooling drum and having smooth inner circumferential edges, a suction blower for sucking air in either of the drums, an exhaust passage for exhausting burnt gases produced in the roasting drum out of the device, a pressure sensor provided in a passage from an opening of the roasting drum to the exhaust passage, a pressure regulating device for regulating pressures in the roasting drum with the aid of differences between pressures detected by the pressure sensor and atmospheric pressure, a temperature sensor provided on an inner wall of the heating oven in opposition to the roasting drum, and a water spray nozzle for spraying water into the roasting drum through its opening.
摘要翻译：咖啡豆焙烧装置包括加热炉中的加热炉和焙烧桶，附着在加热炉内壁的红外线加热器和设置在焙烧鼓下方的冷却鼓。该装置还包括螺旋地设置在焙烧滚筒和冷却滚筒的内壁上并且具有平滑的内圆周边缘的搅拌叶片，用于在任一个滚筒中吸入空气的抽吸鼓风机，用于排出在焙烧滚筒中产生的燃烧气体的排气通道设置在从焙烧鼓的开口到排气通道的通道中的压力传感器，用于通过压力传感器检测到的压力和大气压之间的差异来调节焙烧鼓中的压力的压力调节装置设置在与焙烧鼓相对的加热炉的内壁上的温度传感器，以及通过其开口将水喷入焙烧鼓中的喷水嘴。

3. 发明授权

US09129999B2 Treatment device, treatment method, and surface treatment jig 有权
标题翻译：处理装置，处理方法和表面处理夹具
公开(公告)号：US09129999B2
公开(公告)日：2015-09-08
申请号：US12514193
申请日：2007-10-12
申请人： Yasumasa Iwata , Akihiko Nakamura
发明人： Yasumasa Iwata , Akihiko Nakamura
IPC分类号： B08B3/04 , H01L21/67 , H01L21/02
CPC分类号： H01L21/6708 , H01L21/02057
摘要： The treatment device 100 of the present invention is a treatment device for carrying out treatment to a treatment object 18 whose treatment surface includes a second treatment surface 18b and a first treatment surface 18a surrounding the second treatment surface 18b, the treatment device including: a table section 10 for placing the treatment object 18 thereon; and a first feeding section 24 for feeding a first treatment liquid to an approximate boundary between the first and the second treatment surfaces 18a, 18b and a second feeding section 46 for feeding a second treatment liquid to the second treatment surface 18b. Thus, the present invention provides a treatment device, a treatment method, and a surface treatment jig, each of the treatment device and the treatment method being capable of carrying out independent treatments to a treatment surface and an exposed surface surrounding the treatment surface, respectively.
摘要翻译：本发明的处理装置100是对处理对象18进行处理的处理装置，处理对象18的处理面包括第二处理面18b和围绕第二处理面18b的第一处理面18a，处理装置包括：用于将处理对象18放置在其上的部分10; 以及用于将第一处理液体供给到第一处理用表面18a，第二处理用面18b之间的大致边界的第一供给部24以及向第二处理面18b供给第二处理液的第二供给部46。因此，本发明提供一种处理装置，处理方法和表面处理夹具，每个处理装置和处理方法能够分别对处理表面和处理表面周围的暴露表面进行独立处理。

4. 发明授权

US08701734B2 Separating apparatus and separating method 有权
标题翻译：分离装置和分离方法
公开(公告)号：US08701734B2
公开(公告)日：2014-04-22
申请号：US12453816
申请日：2009-05-22
申请人： Akihiko Nakamura
发明人： Akihiko Nakamura
IPC分类号： B32B38/10 , H01L21/687
CPC分类号： H01L21/68728 , H01L21/67011 , H01L21/67092 , H01L21/6838 , Y10T156/11 , Y10T156/1111 , Y10T156/1137 , Y10T156/1168 , Y10T156/1179 , Y10T156/1184 , Y10T156/1939 , Y10T156/1944 , Y10T156/1961 , Y10T156/1967
摘要： A separating apparatus according to the present invention includes a clamp for gripping an outer peripheral end of a supporting plate. The clamp grips the outer peripheral end of the supporting plate and separates the supporting plate from a wafer by gripping the supporting plate. This makes it possible to separate a supporting plate from a wafer without breaking the wafer. With this, a supporting plate can be separated from a wafer to which the supporting plate has been attached, without breaking the wafer.
摘要翻译：根据本发明的分离装置包括夹持支撑板的外周端的夹具。夹具夹持支撑板的外周端，并通过夹持支撑板将支撑板与晶片分离。这使得可以在不破坏晶片的情况下将支撑板与晶片分离。由此，支撑板可以与已经安装支撑板的晶片分离，而不会破坏晶片。

5. 发明授权

US08277679B2 Composite magnetic material and magnetic element 有权
标题翻译：复合磁性材料和磁性元件
公开(公告)号：US08277679B2
公开(公告)日：2012-10-02
申请号：US13024675
申请日：2011-02-10
申请人： Akihiko Nakamura , Keisuke Watanabe
发明人： Akihiko Nakamura , Keisuke Watanabe
IPC分类号： H01F1/147
CPC分类号： H01F1/14766 , B22F1/004 , B32B15/01 , C22C9/00 , C22C33/0257 , C22C38/02 , C22C38/04 , C22C38/34 , C22C38/38 , C22C2202/02 , H01F1/26 , H01F41/0246
摘要： The object of the present invention is to provide a composite magnetic material having well-balanced magnetic properties and chemical properties, and a magnetic element using thereof. Concretely, the present provides the composite magnetic material comprising a binder and a magnetic powder contains followings: Mn not less than 0.25 wt % and not larger than 3 wt %, Si not less than 1 wt % and not larger than 7 wt %, Cr not less than 2 wt % and not larger than 8 wt %, and the rest of Fe and inevitable impurities with respect to the total weight of a magnetic powder material, and a ratio of powder particles having the major/minor axis is not less than 2 is not larger than 5% of the total powder particles.
摘要翻译：本发明的目的是提供具有良好平衡的磁性能和化学性质的复合磁性材料，以及使用它的磁性元件。具体地，本发明提供了包含粘合剂的复合磁性材料和含有以下的磁性粉末：Mn不低于0.25重量％且不大于3重量％，Si不小于1重量％且不大于7重量％，Cr 不小于2重量％且不大于8重量％，其余的Fe和不可避免的杂质相对于磁粉末材料的总重量，并且具有主轴/短轴的粉末颗粒的比例不小于 2不大于总粉末颗粒的5％。

6. 发明授权

US08181660B2 Treatment liquid permeation unit and treating apparatus 有权
标题翻译：处理液渗透单元和处理装置
公开(公告)号：US08181660B2
公开(公告)日：2012-05-22
申请号：US12322156
申请日：2009-01-29
申请人： Akihiko Nakamura , Junichi Katsuragawa , Yasumasa Iwata
发明人： Akihiko Nakamura , Junichi Katsuragawa , Yasumasa Iwata
IPC分类号： B08B3/00 , B08B3/12 , B08B6/00
CPC分类号： H01L21/67092 , H01L21/67017 , H01L21/67132 , Y10T156/1111 , Y10T156/1126 , Y10T156/1922
摘要： A treatment liquid permeation unit comprises: at least one vibration unit; and a vibration transmission unit for transmitting a vibration from the vibration unit. The vibration transmission unit is positioned between an adhesive with which a wafer is combined to a supporting plate or an adhesive adhered to a surface of the wafer and the vibration unit. A vibration from the vibration unit is transmitted via the vibration transmission unit. This promotes the treatment liquid for dissolving the adhesive to permeate the adhesive to which the treatment liquid is supplied. Therefore, the treatment liquid can more uniformly permeate the adhesive in a shorter time. This allows the treatment liquid for dissolving the adhesive to permeate the adhesive with which the wafer is combined to the supporting plate or to permeate the adhesive adhered to the surface of the wafer in a shorter time.
摘要翻译：处理液体渗透单元包括：至少一个振动单元; 以及用于从振动单元传递振动的振动传递单元。振动传递单元位于与晶片组合的粘合剂与粘合到晶片表面的粘合剂和振动单元之间。来自振动单元的振动经由振动传递单元传递。这促进了用于溶解粘合剂的处理液渗透到供应处理液的粘合剂。因此，处理液可以在更短的时间内更均匀地渗透粘合剂。这使得用于溶解粘合剂的处理液渗透到晶片与支撑板组合的粘合剂上，或者在更短的时间内渗透粘附到晶片表面的粘合剂。

7. 发明授权

US08167687B2 Method of thinning wafer and support plate 失效
标题翻译：减薄晶圆和支撑板的方法
公开(公告)号：US08167687B2
公开(公告)日：2012-05-01
申请号：US12309285
申请日：2007-05-24
申请人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao , Yasumasa Iwata
发明人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao , Yasumasa Iwata
IPC分类号： B24B1/00 , B24B41/06
CPC分类号： B24B41/068 , B24B7/228 , H01L21/6835 , H01L21/6836 , H01L21/78 , H01L2221/68318 , H01L2221/68327
摘要： A wafer can be thinned without occurrences of dimples. A support plate 1 has a number of through holes 10. A circuit forming surface of a wafer 2 is adhered to one surface of the support plate by an adhesive member 4, and a dimple prevention member 3 having a thickness of 100 μm or more and having an adhesive layer 30 on one face is adhered to the other surface, thus the openings at both ends of the through holes 10 are blocked. The support plate is vacuum adsorbed to a support table through the dimple prevention member, and a non circuit-forming face of the wafer is ground/polished to thin the wafer. The dimple prevention member is stripped off, and a solvent is penetrated into the adhesive member through the through holes to detach the wafer from the support plate.
摘要翻译：晶片可以变薄而不发生凹坑。支撑板1具有多个通孔10.晶片2的电路形成表面通过粘合构件4和厚度为100μm以上的凹坑防止构件3粘附到支撑板的一个表面，以及在一个面上具有粘合剂层30粘附到另一个表面，因此通孔10的两端的开口被阻挡。支撑板通过凹坑防止构件被真空吸附到支撑台上，并且将晶片的非电路形成面研磨/抛光以使晶片变薄。剥去防止凹坑的构件，并且通过通孔将溶剂渗透到粘合构件中，以将晶片从支撑板上分离。

8. 发明授权

US07972654B2 Planarizing coating method 有权
标题翻译：平面涂布方法
公开(公告)号：US07972654B2
公开(公告)日：2011-07-05
申请号：US11937266
申请日：2007-11-08
申请人： Akihiko Nakamura
发明人： Akihiko Nakamura
IPC分类号： B05D3/12 , B05D1/38
CPC分类号： H01L21/31051 , H01L21/76819 , H01L21/76837
摘要： A planarizing coating method for filling a step between patterns formed on a board surface, includes the steps of: preparing at least two types of coating liquids different in non-volatile matter densities, first coating one of the coating liquids higher in density on the board surface, rotating the board so as to leave the one coating liquid inside the step and such that, at the same time, substantially none of the one coating liquid is left on a pattern crest of the patterns, subsequently coating another of the coating liquids lower in non-volatile matter density on the board surface, and rotating the board so that the coating liquid lower in density is left on a coating film comprising the one coating liquid higher in density and such that, at the same time, substantially none of the other coating liquid lower in density left on the pattern crest.
摘要翻译：用于在板表面上形成的图案之间填充台阶的平面化涂布方法包括以下步骤：制备不同于不挥发物质密度的至少两种类型的涂布液，首先在板上涂覆更高密度的涂布液之一表面，旋转板，以使步骤中的一个涂布液体留下，并且同时基本上没有一个涂布液体留在图案的图案峰上，随后再涂覆另一个涂布液体在板表面上的非挥发性物质密度，并且旋转板，使得密度较低的涂布液留在包含一个密度较高的一个涂布液的涂膜上，并且同时基本上没有一个其他涂层液体密度较低，留在图案峰上。

9. 发明授权

US07919394B2 Method for thinning substrate and method for manufacturing circuit device 有权
标题翻译：薄板化方法及制造电路器件的方法
公开(公告)号：US07919394B2
公开(公告)日：2011-04-05
申请号：US11517157
申请日：2006-09-07
申请人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao
发明人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao
IPC分类号： H01L21/30 , H01L21/46
CPC分类号： H01L21/78 , H01L21/6835 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68363
摘要： A method for thinning a substrate and a method for manufacturing a circuit device which make it possible to prevent the pattern of penetrating holes of a supporting plate from being transferred to the surface of the substrate and prevent non-uniform grinding of the surface of the substrate from occurring. The supporting plate and the substrate are joined by using an adhesive layer, and a sheet is attached to the supporting plate. The surface of the supporting plate to which the sheet has been attached is mounted and fixed by attraction onto an attracting head. The surface of the semiconductor wafer on which no circuit device is formed is ground by a grinder in this state.
摘要翻译：一种用于使基板变薄的方法和用于制造电路器件的方法，其可以防止支撑板的穿透图案被转移到基板的表面并防止基板表面的不均匀研磨从发生。支撑板和基板通过使用粘合剂层接合，并且片材附接到支撑板。已经安装了片材的支撑板的表面通过吸引安装和固定到吸引头上。在该状态下，通过研磨机研磨不形成电路器件的半导体晶片的表面。

10. 发明申请

US20100178497A1 ADHESIVE COMPOSITION, FILM ADHESIVE, AND PROCESS FOR PRODUCTION OF THE COMPOSITION 审中-公开
标题翻译：胶粘组合物，胶粘剂和组合物的生产方法
公开(公告)号：US20100178497A1
公开(公告)日：2010-07-15
申请号：US12377155
申请日：2007-08-03
申请人： Takahiro Asai , Koichi Misumi , Atsushi Miyanari , Yoshihiro Inao , Akihiko Nakamura , Koji Saito
发明人： Takahiro Asai , Koichi Misumi , Atsushi Miyanari , Yoshihiro Inao , Akihiko Nakamura , Koji Saito
IPC分类号： C08F120/18 , B32B27/36 , B32B27/32
CPC分类号： C09J133/10 , C09J7/381 , C09J125/14 , C09J2425/00 , C09J2433/00 , Y10T428/2891
摘要： Disclosed is an adhesive composition which is mainly composed of a polymer obtained by copolymerizing a monomer composition containing styrene, (meth)acrylic acid ester having a cyclic structure and alkyl (meth)acrylate having a chain structure. The monomer composition may additionally contain a bifunctional monomer, thereby improving heat resistance, adhesive strength under high temperature conditions, and alkali resistance, and easiness in stripping of an adhesive composition that has been processed at a high temperature. Consequently, there can be obtained an adhesive composition which has high heat resistance, adhesion strength under high temperature conditions, and alkali resistance, and which can be easily stripped off after the adhesive composition is processed at a high temperature.
摘要翻译：公开了主要由通过共聚包含苯乙烯的单体组合物，具有环状结构的（甲基）丙烯酸酯和具有链结构的（甲基）丙烯酸烷基酯）而得到的聚合物的粘合剂组合物。单体组合物可以另外含有双官能单体，从而提高耐热性，高温条件下的粘合强度和耐碱性，以及在高温下处理的粘合剂组合物的剥离容易性。因此，可以获得在高温条件下具有高耐热性，粘合强度和耐碱性的粘合剂组合物，并且在粘合剂组合物在高温下加工后可以容易地剥离。

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