专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08186410B2 Separating device 有权
标题翻译：分离装置
公开(公告)号：US08186410B2
公开(公告)日：2012-05-29
申请号：US12326340
申请日：2008-12-02
申请人： Akihiko Nakamura , Junichi Katsuragawa , Atsushi Miyanari , Yoshihiro Inao , Yasumasa Iwata
发明人： Akihiko Nakamura , Junichi Katsuragawa , Atsushi Miyanari , Yoshihiro Inao , Yasumasa Iwata
IPC分类号： B32B38/00
CPC分类号： B32B43/006 , B32B37/12 , B32B2038/1891 , B32B2457/14 , H01L21/67173 , H01L21/67346 , Y10S156/93 , Y10S156/941 , Y10T156/11 , Y10T156/1111 , Y10T156/19 , Y10T156/195 , Y10T156/1978 , Y10T279/11
摘要： A separating device according to the present invention separates a support plate (14) from a substrate (12) of a laminate (10) including the substrate (12) and the support plate (14) bonded to each other. The separating device includes: a first storing section (20) for storing the laminate (10); a plurality of first processing sections (30) for reducing adhesive force of an adhesive (13) applied between the substrate (12) and the support plate (14); and a first carrying section (50) which is capable of moving in the first direction and carries the laminate (10) from the first storing section (20) to the first processing section (30) while holding the laminate (10). With the first carrying section (50), it is possible to provide a separating device (100) which moves straightly so as to carry the laminate (10). This provides a separating device for (i) processing a laminate including a substrate and a support plate and (ii) separating the support plate from the substrate, which separating device performs the separating process efficiently.
摘要翻译：根据本发明的分离装置将支撑板（14）与包括彼此结合的基板（12）和支撑板（14）的层叠体（10）的基板（12）分离。分离装置包括：用于储存层压板（10）的第一储存部分（20）。多个第一处理部（30），用于降低施加在所述基板（12）和所述支撑板（14）之间的粘合剂（13）的粘合力; 以及第一承载部（50），其能够在保持层叠体（10）的同时沿第一方向移动并将层压体（10）从第一收纳部（20）运送到第一处理部（30）。利用第一承载部分（50），可以提供一个分离装置（100），该分离装置（100）直线移动以便承载层压板（10）。这提供了一种分离装置，用于（i）处理包括基板和支撑板的层压板，以及（ii）将支撑板与基板分离，该分离装置有效地执行分离过程。

2. 发明申请

US20090139662A1 SEPARATING DEVICE 有权
标题翻译：分离装置
公开(公告)号：US20090139662A1
公开(公告)日：2009-06-04
申请号：US12326340
申请日：2008-12-02
申请人： Akihiko Nakamura , Junichi Katsuragawa , Atsushi Miyanari , Yoshihiro Inao , Yasumasa Iwata
发明人： Akihiko Nakamura , Junichi Katsuragawa , Atsushi Miyanari , Yoshihiro Inao , Yasumasa Iwata
IPC分类号： B29C63/00
CPC分类号： B32B43/006 , B32B37/12 , B32B2038/1891 , B32B2457/14 , H01L21/67173 , H01L21/67346 , Y10S156/93 , Y10S156/941 , Y10T156/11 , Y10T156/1111 , Y10T156/19 , Y10T156/195 , Y10T156/1978 , Y10T279/11
摘要： A separating device according to the present invention separates a support plate (14) from a substrate (12) of a laminate (10) including the substrate (12) and the support plate (14) bonded to each other. The separating device includes: a first storing section (20) for storing the laminate (10); a plurality of first processing sections (30) for reducing adhesive force of an adhesive (13) applied between the substrate (12) and the support plate (14); and a first carrying section (50) which is capable of moving in the first direction and carries the laminate (10) from the first storing section (20) to the first processing section (30) while holding the laminate (10). With the first carrying section (50), it is possible to provide a separating device (100) which moves straightly so as to carry the laminate (10). This provides a separating device for (i) processing a laminate including a substrate and a support plate and (ii) separating the support plate from the substrate, which separating device performs the separating process efficiently.
摘要翻译：根据本发明的分离装置将支撑板（14）与包括彼此结合的基板（12）和支撑板（14）的层叠体（10）的基板（12）分离。分离装置包括：用于储存层压板（10）的第一储存部分（20）。多个第一处理部（30），用于降低施加在所述基板（12）和所述支撑板（14）之间的粘合剂（13）的粘合力; 以及第一承载部（50），其能够在保持层叠体（10）的同时沿第一方向移动并将层压体（10）从第一收纳部（20）运送到第一处理部（30）。利用第一承载部分（50），可以提供一个分离装置（100），该分离装置（100）直线移动以便承载层压板（10）。这提供了一种分离装置，用于（i）处理包括基板和支撑板的层压板，以及（ii）将支撑板与基板分离，该分离装置有效地执行分离过程。

3. 发明申请

US20100024853A1 LIQUID SOLVENT ABUTMENT UNIT 有权
标题翻译：液体溶剂处理单元
公开(公告)号：US20100024853A1
公开(公告)日：2010-02-04
申请号：US12448916
申请日：2008-01-11
申请人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao , Yasumasa Iwata
发明人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao , Yasumasa Iwata
IPC分类号： B08B3/12
CPC分类号： H01L21/67132 , H01L21/67086 , Y10T156/1111
摘要： In order to provide a liquid solvent abutment unit for accelerating the reaction of a liquid solvent against an adhesive member existing between a perforated support plate and a wafer, a liquid solvent abutment unit comprises: a supply part for supplying a support plate surface with a liquid solvent; a retention part for retaining the supplied liquid solvent in the hole-formed region on the support plate surface; a recovery part for recovering the liquid solvent retained in the hole-formed region; and a vibration unit for vibrating the liquid solvent.
摘要翻译：为了提供液体溶剂抵接单元，用于加速液体溶剂与存在于多孔支撑板和晶片之间的粘合剂的反应，液体溶剂抵接单元包括：用于向支撑板表面供应液体的供应部分溶剂; 用于将供应的液体溶剂保持在支撑板表面上的孔形区域中的保持部分; 用于回收保留在孔形区域中的液体溶剂的回收部分; 以及用于振动液体溶剂的振动单元。

4. 发明授权

US08449691B2 Liquid solvent abutment unit 有权
标题翻译：液体溶剂邻接单元
公开(公告)号：US08449691B2
公开(公告)日：2013-05-28
申请号：US12448916
申请日：2008-01-11
申请人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao , Yasumasa Iwata
发明人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao , Yasumasa Iwata
IPC分类号： B08B3/00
CPC分类号： H01L21/67132 , H01L21/67086 , Y10T156/1111
摘要： In order to provide a liquid solvent abutment unit for accelerating the reaction of a liquid solvent against an adhesive member existing between a perforated support plate and a wafer, a liquid solvent abutment unit includes a supply part for supplying a support plate surface with a liquid solvent, a retention part for retaining the supplied liquid solvent in the hole-formed region on the support plate surface; a recovery part for recovering the liquid solvent retained in the hole-formed region, and a vibration unit for vibrating the liquid solvent.
摘要翻译：为了提供液体溶剂抵靠单元，用于加速液体溶剂与存在于多孔支撑板和晶片之间的粘合剂的反应，液体溶剂抵靠单元包括用于向支撑板表面供给液体溶剂的供应部件，用于将所提供的液体溶剂保持在支撑板表面上的孔形区域中的保持部分; 用于回收保留在孔形区域中的液体溶剂的回收部分和用于使液体溶剂振动的振动单元。

5. 发明申请

US20090325467A1 Method of Thinning Wafer and Support plate 失效
标题翻译：薄板和支撑板变薄的方法
公开(公告)号：US20090325467A1
公开(公告)日：2009-12-31
申请号：US12309285
申请日：2007-05-24
申请人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao , Yasumasa Iwata
发明人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao , Yasumasa Iwata
IPC分类号： B24B1/00 , B24B41/06
CPC分类号： B24B41/068 , B24B7/228 , H01L21/6835 , H01L21/6836 , H01L21/78 , H01L2221/68318 , H01L2221/68327
摘要： A wafer can be thinned without occurrences of dimples. A support plate 1 has a number of through holes 10. A circuit forming surface of a wafer 2 is adhered to one surface of the support plate by an adhesive member 4, and a dimple prevention member 3 having a thickness of 100 μm or more and having an adhesive layer 30 on one face is adhered to the other surface, thus the openings at both ends of the through holes 10 are blocked. The support plate is vacuum adsorbed to a support table through the dimple prevention member, and a non circuit-forming face of the wafer is ground/polished to thin the wafer. The dimple prevention member is stripped off, and a solvent is penetrated into the adhesive member through the through holes to detach the wafer from the support plate.
摘要翻译：晶片可以变薄而不发生凹坑。支撑板1具有多个通孔10.晶片2的电路形成表面通过粘合构件4和厚度为100μm以上的凹坑防止构件3粘附到支撑板的一个表面，以及在一个面上具有粘合剂层30粘附到另一个表面，因此通孔10的两端的开口被阻挡。支撑板通过凹坑防止构件被真空吸附到支撑台上，并且将晶片的非电路形成面研磨/抛光以使晶片变薄。剥去防止凹坑的构件，并且通过通孔将溶剂渗透到粘合构件中，以将晶片从支撑板上分离。

6. 发明申请

US20090288780A1 PERFORATED SUPPORT PLATE 审中-公开
标题翻译：执行支持板
公开(公告)号：US20090288780A1
公开(公告)日：2009-11-26
申请号：US12448499
申请日：2007-11-26
申请人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao , Yasumasa Iwata
发明人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao , Yasumasa Iwata
IPC分类号： B32B37/12
CPC分类号： H01L21/02002 , H01L21/67132 , H01L21/68757 , Y10T29/49998 , Y10T156/1062 , Y10T156/1798
摘要： To provide a perforated support plate with high rigidity, the perforated support plate for supporting a surface of a wafer by interposing an adhesive layer comprises a reinforcing part for deflection prevention.
摘要翻译：为了提供具有高刚性的穿孔支撑板，用于通过插入粘合剂层来支撑晶片表面的穿孔支撑板包括用于偏转预防的加强部件。

7. 发明授权

US08167687B2 Method of thinning wafer and support plate 失效
标题翻译：减薄晶圆和支撑板的方法
公开(公告)号：US08167687B2
公开(公告)日：2012-05-01
申请号：US12309285
申请日：2007-05-24
申请人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao , Yasumasa Iwata
发明人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao , Yasumasa Iwata
IPC分类号： B24B1/00 , B24B41/06
CPC分类号： B24B41/068 , B24B7/228 , H01L21/6835 , H01L21/6836 , H01L21/78 , H01L2221/68318 , H01L2221/68327
摘要： A wafer can be thinned without occurrences of dimples. A support plate 1 has a number of through holes 10. A circuit forming surface of a wafer 2 is adhered to one surface of the support plate by an adhesive member 4, and a dimple prevention member 3 having a thickness of 100 μm or more and having an adhesive layer 30 on one face is adhered to the other surface, thus the openings at both ends of the through holes 10 are blocked. The support plate is vacuum adsorbed to a support table through the dimple prevention member, and a non circuit-forming face of the wafer is ground/polished to thin the wafer. The dimple prevention member is stripped off, and a solvent is penetrated into the adhesive member through the through holes to detach the wafer from the support plate.
摘要翻译：晶片可以变薄而不发生凹坑。支撑板1具有多个通孔10.晶片2的电路形成表面通过粘合构件4和厚度为100μm以上的凹坑防止构件3粘附到支撑板的一个表面，以及在一个面上具有粘合剂层30粘附到另一个表面，因此通孔10的两端的开口被阻挡。支撑板通过凹坑防止构件被真空吸附到支撑台上，并且将晶片的非电路形成面研磨/抛光以使晶片变薄。剥去防止凹坑的构件，并且通过通孔将溶剂渗透到粘合构件中，以将晶片从支撑板上分离。

8. 发明授权

US08302651B2 Stripping device and stripping method 有权
标题翻译：剥离装置和剥离方法
公开(公告)号：US08302651B2
公开(公告)日：2012-11-06
申请号：US13093412
申请日：2011-04-25
申请人： Kimihiro Nakada , Yasumasa Iwata , Akihiko Nakamura , Yoshihiro Inao , Satoshi Kobari
发明人： Kimihiro Nakada , Yasumasa Iwata , Akihiko Nakamura , Yoshihiro Inao , Satoshi Kobari
IPC分类号： B29C63/00
CPC分类号： B32B43/006 , B32B2457/14 , H01L21/67132 , H01L21/6715 , Y10T156/1111 , Y10T156/1121 , Y10T156/19 , Y10T156/1922
摘要： A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes the step of supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.
摘要翻译：一种用于从包括基底和支撑板的层压板剥离支撑板的剥离方法，所述支撑板通过粘合剂层粘合到晶片上，其中粘合剂层由可溶于非极性溶剂或高极性溶剂的粘合剂形成 ; 并且剥离方法包括供给非极性溶剂或高极性溶剂的步骤，使得非极性溶剂或高极性溶剂至少保留在层压体的面向支持体的表面的边缘部分上板，并且在层压板的侧表面上。

9. 发明申请

US20090314438A1 Supporting plate peeling apparatus 审中-公开
标题翻译：支撑板剥皮装置
公开(公告)号：US20090314438A1
公开(公告)日：2009-12-24
申请号：US12457139
申请日：2009-06-02
申请人： Yasumasa Iwata , Akihiko Nakamura , Yoshihiro Inao
发明人： Yasumasa Iwata , Akihiko Nakamura , Yoshihiro Inao
IPC分类号： B32B38/10
CPC分类号： H01L21/67028 , H01L21/02057 , H01L21/6835 , H01L2221/68318 , Y10T156/1111 , Y10T156/1158 , Y10T156/1917
摘要： A supporting plate peeling apparatus in accordance with the present invention has removal means for removing an adhesive agent remaining on a side of a wafer from which a supporting plate has been peeled off, which adhesive agent is removed after (i) a supporting plate which supports a wafer reduced in thickness has been peeled off from the wafer and (ii) the side from which the supporting plate has been peeled off is washed with a washing liquid. The supporting plate peeling apparatus in accordance with the present invention is a supporting plate peeling apparatus which can remove the adhesive agent that remains on the side of the wafer from which the supporting plate has been peeled off that could not be completely removed just by the washing liquid, and which allows satisfactory completion of a peeling step. Hence, a supporting plate peeling apparatus is provided, which peels off a supporting plate for supporting a wafer, while not causing the side of the wafer from which the support plate has been peeled off to deteriorate.
摘要翻译：根据本发明的支撑板剥离装置具有去除残留在已经剥离了支撑板的晶片侧的粘合剂的去除装置，在（i）支撑板已经从晶片剥离了厚度减小的晶片，（ii）用洗涤液清洗支撑板被剥离的一面。根据本发明的支撑板剥离装置是一种支撑板剥离装置，其可以去除残留在已经剥离的支撑板的晶片侧面上的粘合剂，该粘合剂仅通过洗涤才能完全去除液体，并且其允许令人满意地完成剥离步骤。因此，提供了一种支撑板剥离装置，其剥离用于支撑晶片的支撑板，同时不使得支撑板已经剥离的晶片的侧面劣化。

10. 发明申请

US20100000680A1 SEPARATING APPARATUS AND SEPARATING METHOD 有权
标题翻译：分离装置和分离方法
公开(公告)号：US20100000680A1
公开(公告)日：2010-01-07
申请号：US12492620
申请日：2009-06-26
申请人： Yoshihiro INAO , Akihiko Nakamura , Yasumasa Iwata
发明人： Yoshihiro INAO , Akihiko Nakamura , Yasumasa Iwata
IPC分类号： B32B38/10
CPC分类号： H01L21/67092 , H01L21/67011 , H01L21/6838 , Y10T156/1111 , Y10T156/1116 , Y10T156/1132 , Y10T156/1137 , Y10T156/1939 , Y10T156/1944
摘要： A separating apparatus according to the present invention includes a sucking plate for sticking to a support plate by suction. The sucking plate has sucking holes 3 and 3′ for expelling gas from a space between the sucking plate and the support plate. Each of the sucking holes 3 and 3′ has a diameter of not less than 0.3 mm and not more than an outer diameter of the support plate. This makes it possible to separate a supporting plate from a wafer without breaking the wafer.
摘要翻译：根据本发明的分离装置包括用于通过抽吸粘附到支撑板的吸板。吸盘具有用于从吸板和支撑板之间的空间排出气体的吸孔3和3'。每个吸孔3和3'的直径不小于0.3mm且不大于支撑板的外径。这使得可以在不破坏晶片的情况下将支撑板与晶片分离。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式