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    • 2. 发明授权
    • ESD configuration for low parasitic capacitance I/O
    • ESD配置用于低寄生电容I / O
    • US07505238B2
    • 2009-03-17
    • US11174731
    • 2005-07-06
    • Agnes Neves WooChun-Ying Chen
    • Agnes Neves WooChun-Ying Chen
    • H02H9/00
    • H02H9/046
    • An I/O ESD protection configuration of an integrated circuit that includes an ESD protection circuit connected between an I/O pad and an internal circuit at a first node and to an inductor at a second node. The inductor is connected between the second node and an external power supply. The external power supply provides a high reverse bias voltage across a diode of the ESD protection circuit. An ESD clamp is connected between the second node and a ground. An ESD discharge current is shunted through the ESD protection circuit and through the ESD clamp during a positive I/O ESD event. The inductor can be chosen to tune out a parasitic capacitance of the ESD clamp. The inductor can also block high frequency signals between the I/O pad and the external power supply, thereby minimizing the parasitic capacitance of the diode of the ESD protection circuit at high frequency.
    • 集成电路的I / O ESD保护配置,其包括连接在第一节点处的I / O焊盘和内部电路之间的ESD保护电路以及第二节点处的电感器。 电感器连接在第二节点和外部电源之间。 外部电源在ESD保护电路的二极管上提供高反向偏置电压。 ESD钳位器连接在第二节点和地之间。 在正I / O ESD事件期间,ESD放电电流通过ESD保护电路并通过ESD钳位分流。 可以选择电感来调整ESD钳位的寄生电容。 电感器还可以阻挡I / O焊盘和外部电源之间的高频信号,从而最大限度地降低ESD保护电路在高频下的二极管的寄生电容。
    • 4. 发明申请
    • ESD protection for high voltage applications
    • ESD保护用于高压应用
    • US20090045464A1
    • 2009-02-19
    • US12285679
    • 2008-10-10
    • Agnes Neves Woo
    • Agnes Neves Woo
    • H01L23/62H01L21/30
    • H01L27/0248H01L2924/0002H01L2924/00
    • An ESD device includes a low doped well connected to a first contact and a diffusion area connected to a second contact. A substrate between the low doped well and the diffusion area has a dopant polarity that is opposite a dopant polarity of the low doped well and the diffusion area. A distance between the low doped well and the diffusion area determines a triggering voltage of the ESD device. A depletion region is formed between the low doped well and the substrate when a reverse bias voltage is applied to the ESD device. A current discharging path is formed between the first contact and the second contact when the depletion region comes in to contact with the diffusion area. The substrate is biased by a connection to the second contact. Alternatively, an additional diffusion area with the same dopant polarity, connected to a third contact, biases the substrate.
    • ESD器件包括连接到第一触点的低掺杂阱和连接到第二触点的扩散区。 低掺杂阱和扩散区之间的衬底具有与低掺杂阱和扩散区的掺杂剂极性相反的掺杂剂极性。 低掺杂阱和扩散区之间的距离决定了ESD器件的触发电压。 当向ESD器件施加反向偏置电压时,在低掺杂阱和衬底之间形成耗尽区。 当耗尽区域与扩散区域接触时,在第一触点和第二触点之间形成电流放电路径。 衬底通过与第二接触件的连接来偏置。 或者,连接到第三接触件的具有相同掺杂剂极性的附加扩散区域偏压衬底。
    • 5. 发明授权
    • ESD configuration for low parasitic capacitance I/O
    • ESD配置用于低寄生电容I / O
    • US07920366B2
    • 2011-04-05
    • US12393417
    • 2009-02-26
    • Chun-Ying ChenAgnes Neves Woo
    • Chun-Ying ChenAgnes Neves Woo
    • H02H9/00
    • H02H9/046
    • An integrated circuit can include an I/O pad, an internal circuit, an inductor, an electrostatic discharge (ESD) protection circuit, and an ESD clamp. The internal circuit can be biased with a first voltage supply and a second voltage supply, where the internal circuit is connected to the I/O pad at a first node. The ESD protection circuit can be connected between the first node and a second node. The inductor can be connected between the second node and a third voltage supply. Further, the ESD clamp can be connected between the second node and the second voltage supply.
    • 集成电路可以包括I / O焊盘,内部电路,电感器,静电放电(ESD)保护电路和ESD钳位。 内部电路可以用第一电压源和第二电压源进行偏置,其中内部电路在第一节点处连接到I / O焊盘。 ESD保护电路可以连接在第一节点和第二节点之间。 电感器可以连接在第二节点和第三电压源之间。 此外,ESD钳位可以连接在第二节点和第二电压源之间。
    • 7. 发明授权
    • Switchable passive termination circuits
    • 可切换无源终端电路
    • US08289046B2
    • 2012-10-16
    • US13173706
    • 2011-06-30
    • Joseph AzizAndrew ChenDerek TamArk-Chew WongAgnes Neves WooMarcel Lugthart
    • Joseph AzizAndrew ChenDerek TamArk-Chew WongAgnes Neves WooMarcel Lugthart
    • H03K17/16H03K19/003
    • H04L25/0298
    • According to one exemplary embodiment, an active termination circuit includes at least one active termination branch, where the at least one active termination branch includes at least one transistor for providing an active termination output. The at least one active termination branch further includes an amplifier driving the at least one transistor, where the amplifier has a non-inverting input coupled to the active termination output via a feedback network. The amplifier controls a current flowing through the at least one transistor so as to provide the active termination output. The active termination output can be provided at a drain of the at least one transistor, where a source of the at least one transistor is coupled to ground through a degeneration transistor and a tail current sink.
    • 根据一个示例性实施例,有源终端电路包括至少一个有源终端分支,其中所述至少一个有源终端分支包括用于提供有源终端输出的至少一个晶体管。 所述至少一个有源终端分支还包括驱动所述至少一个晶体管的放大器,其中所述放大器具有经由反馈网络耦合到所述有源终端输出的非反相输入。 放大器控制流过至少一个晶体管的电流,以便提供有源终端输出。 可以在至少一个晶体管的漏极处提供有源终端输出,其中至少一个晶体管的源极通过退化晶体管和尾部电流吸收器耦合到地。
    • 8. 发明授权
    • ESD protection for high voltage applications
    • ESD保护用于高压应用
    • US07439592B2
    • 2008-10-21
    • US11198277
    • 2005-08-08
    • Agnes Neves Woo
    • Agnes Neves Woo
    • H01L23/62
    • H01L27/0248H01L2924/0002H01L2924/00
    • An ESD device includes a low doped well connected to a first contact and a diffusion area connected to a second contact. A substrate between the low doped well and the diffusion area has a dopant polarity that is opposite a dopant polarity of the low doped well and the diffusion area. A distance between the low doped well and the diffusion area determines a triggering voltage of the ESD device. A depletion region is formed between the low doped well and the substrate when a reverse bias voltage is applied to the ESD device. A current discharging path is formed between the first contact and the second contact when the depletion region comes in to contact with the diffusion area. The substrate is biased by a connection to the second contact. Alternatively, an additional diffusion area with the same dopant polarity, connected to a third contact, biases the substrate.
    • ESD器件包括连接到第一触点的低掺杂阱和连接到第二触点的扩散区。 低掺杂阱和扩散区之间的衬底具有与低掺杂阱和扩散区的掺杂剂极性相反的掺杂剂极性。 低掺杂阱和扩散区之间的距离决定了ESD器件的触发电压。 当向ESD器件施加反向偏置电压时,在低掺杂阱和衬底之间形成耗尽区。 当耗尽区域与扩散区域接触时,在第一触点和第二触点之间形成电流放电路径。 衬底通过与第二接触件的连接来偏置。 或者,连接到第三接触件的具有相同掺杂剂极性的附加扩散区域偏压衬底。
    • 9. 发明授权
    • ESD protection for high voltage applications
    • ESD保护用于高压应用
    • US08049278B2
    • 2011-11-01
    • US12285679
    • 2008-10-10
    • Agnes Neves Woo
    • Agnes Neves Woo
    • H01L23/62H01L21/8238
    • H01L27/0248H01L2924/0002H01L2924/00
    • An ESD device includes a low doped well connected to a first contact and a diffusion area connected to a second contact. A substrate between the low doped well and the diffusion area has a dopant polarity that is opposite a dopant polarity of the low doped well and the diffusion area. A distance between the low doped well and the diffusion area determines a triggering voltage of the ESD device. A depletion region is formed between the low doped well and the substrate when a reverse bias voltage is applied to the ESD device. A current discharging path is formed between the first contact and the second contact when the depletion region comes in to contact with the diffusion area. The substrate is biased by a connection to the second contact. Alternatively, an additional diffusion area with the same dopant polarity, connected to a third contact, biases the substrate.
    • ESD器件包括连接到第一触点的低掺杂阱和连接到第二触点的扩散区。 低掺杂阱和扩散区之间的衬底具有与低掺杂阱和扩散区的掺杂剂极性相反的掺杂剂极性。 低掺杂阱和扩散区之间的距离决定了ESD器件的触发电压。 当向ESD器件施加反向偏置电压时,在低掺杂阱和衬底之间形成耗尽区。 当耗尽区域与扩散区域接触时,在第一触点和第二触点之间形成电流放电路径。 衬底通过与第二接触件的连接来偏置。 或者,连接到第三接触件的具有相同掺杂剂极性的附加扩散区域偏压衬底。
    • 10. 发明申请
    • Switchable Passive Termination Circuits
    • 可切换被动终端电路
    • US20110254584A1
    • 2011-10-20
    • US13173706
    • 2011-06-30
    • Joseph AzizAndrew ChenDerek TamArk-Chew WongAgnes Neves WooMarcel Lugthart
    • Joseph AzizAndrew ChenDerek TamArk-Chew WongAgnes Neves WooMarcel Lugthart
    • H03K17/16
    • H04L25/0298
    • According to one exemplary embodiment, an active termination circuit includes at least one active termination branch, where the at least one active termination branch includes at least one transistor for providing an active termination output. The at least one active termination branch further includes an amplifier driving the at least one transistor, where the amplifier has a non-inverting input coupled to the active termination output via a feedback network. The amplifier controls a current flowing through the at least one transistor so as to provide the active termination output. The active termination output can be provided at a drain of the at least one transistor, where a source of the at least one transistor is coupled to ground through a degeneration transistor and a tail current sink.
    • 根据一个示例性实施例,有源终端电路包括至少一个有源终端分支,其中所述至少一个有源终端分支包括用于提供有源终端输出的至少一个晶体管。 所述至少一个有源终端分支还包括驱动所述至少一个晶体管的放大器,其中所述放大器具有经由反馈网络耦合到所述有源终端输出的非反相输入。 放大器控制流过至少一个晶体管的电流,以便提供有源终端输出。 可以在至少一个晶体管的漏极处提供有源终端输出,其中至少一个晶体管的源极通过退化晶体管和尾部电流吸收器耦合到地。