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1. 发明授权

US08070931B1 Electrochemical fabrication method including elastic joining of structures 有权
标题翻译：包括结构弹性连接的电化学制造方法
公开(公告)号：US08070931B1
公开(公告)日：2011-12-06
申请号：US12345624
申请日：2008-12-29
申请人： Adam L. Cohen , Vacit Arat , Michael S. Lockard , Dennis R. Smalley
发明人： Adam L. Cohen , Vacit Arat , Michael S. Lockard , Dennis R. Smalley
IPC分类号： C25D5/02
CPC分类号： B29C65/56 , B33Y10/00 , C25D5/02 , Y10T29/49885
摘要： Embodiments are directed to methods for forming multi-layer three-dimensional structures involving the joining of at least two structural elements, at least one of which is formed as a multi-layer three-dimensional structure, wherein the joining occurs via one of: (1) elastic deformation and elastic recovery and subsequent retention of elements relative to each other, (2) relative deformation of an initial portion of at least one element relative to another portion of the at least one element until the at least two elements are in a desired retention position after which the deformation is reduced or eliminated and a portion of at least one element is brought into position which in turn locks the at least two elements together via contact with one another including contact with the initial portion of at least one element, or (3) moving a retention region of one element into the retention region of the other element, without deformation of either element, along a path including a loading region of the other element and wherein during normal use the first and second elements are configured relative to one another so that the loading region of the second elements is not accessible to the retention region of the first element.
摘要翻译：实施例涉及用于形成多层三维结构的方法，所述多层三维结构涉及至少两个结构元件的接合，其中至少一个结构元件形成为多层三维结构，其中通过以下之一进行接合：（ 1）弹性变形和弹性恢复以及随后元件相对于彼此的保留，（2）至少一个元件的初始部分相对于至少一个元件的另一部分的相对变形，直到至少两个元件处于期望的保持位置，在此之后，变形被减小或消除，并且至少一个元件的一部分进入位置，其又通过彼此接触将至少两个元件锁定在一起，包括与至少一个元件的初始部分的接触，或（3）将一个元件的保持区域移动到另一个元件的保持区域中，而不会使任一元件变形，沿着包括装载物 g区域，并且其中在正常使用期间，第一和第二元件相对于彼此构造，使得第二元件的加载区域不能被第一元件的保持区域访问。

2. 发明申请

US20110031183A1 Multi-Layer Three-Dimensional Structures Having Features Smaller Than a Minimum Feature Size Associated With the Formation of Individual Layers 审中-公开
公开(公告)号：US20110031183A1
公开(公告)日：2011-02-10
申请号：US12873131
申请日：2010-08-31
申请人： Michael S. Lockard , Adam L. Cohen , Vacit Arat , Dennis R. Smalley
发明人： Michael S. Lockard , Adam L. Cohen , Vacit Arat , Dennis R. Smalley
IPC分类号： B01D39/00 , B32B3/26 , B32B5/18 , B32B7/02
CPC分类号： C25D1/08 , B33Y70/00 , C25D1/003 , C25D5/022 , C25D5/10 , Y10T137/86759 , Y10T428/12361 , Y10T428/12479 , Y10T428/19 , Y10T428/24975 , Y10T428/249981 , Y10T428/29
摘要： Embodiments of multi-layer three-dimensional structures and formation methods provide structures with effective feature (e.g. opening) sizes (e.g. virtual gaps) that are smaller than a minimum feature size (MFS) that exists on each layer as a result of the formation method used in forming the structures. In some embodiments, multi-layer structures include a first element (e.g. first patterned layer with a gap) and a second element (e.g. second patterned layer with a gap) positioned adjacent the first element to define a third element (e.g. a net gap or opening resulting from the combined gaps of the first and second elements) where the first and second elements have features that are sized at least as large as the minimum feature size and the third element, at least in part, has dimensions or defines dimensions smaller than the minimum feature size.

3. 发明申请

US20090068460A1 Multi-Layer Three-Dimensional Structures Having Features Smaller Than a Minimum Feature Size Associated With the Formation of Individual Layers 审中-公开
标题翻译：具有小于单个层的形成的最小特征尺寸的特征的多层三维结构
公开(公告)号：US20090068460A1
公开(公告)日：2009-03-12
申请号：US12203094
申请日：2008-09-02
申请人： Michael S. Lockard , Adam L. Cohen , Vacit Arat , Dennis R. Smalley
发明人： Michael S. Lockard , Adam L. Cohen , Vacit Arat , Dennis R. Smalley
IPC分类号： B32B5/00
CPC分类号： C25D1/08 , B33Y70/00 , C25D1/003 , C25D5/022 , C25D5/10 , Y10T137/86759 , Y10T428/12361 , Y10T428/12479 , Y10T428/19 , Y10T428/24975 , Y10T428/249981 , Y10T428/29
摘要： Embodiments of multi-layer three-dimensional structures and formation methods provide structures with effective feature (e.g. opening) sizes (e.g. virtual gaps) that are smaller than a minimum feature size (MFS) that exists on each layer as a result of the formation method used in forming the structures. In some embodiments, multi-layer structures include a first element (e.g. first patterned layer with a gap) and a second element (e.g. second patterned layer with a gap) positioned adjacent the first element to define a third element (e.g. a net gap or opening resulting from the combined gaps of the first and second elements) where the first and second elements have features that are sized at least as large as the minimum feature size and the third element, at least in part, has dimensions or defines dimensions smaller than the minimum feature size.
摘要翻译：多层三维结构和形成方法的实施例提供结构，其具有小于作为形成方法的结果存在于每个层上的最小特征尺寸（MFS）的有效特征（例如开口）尺寸（例如，虚拟间隙）用于形成结构。在一些实施例中，多层结构包括第一元件（例如具有间隙的第一图案化层）和邻近第一元件定位的第二元件（例如具有间隙的第二图案化层），以限定第三元件（例如，净间隙或第一和第二元件的组合间隙产生的开口），其中第一和第二元件具有尺寸至少与最小特征尺寸一样大的特征，并且第三元件至少部分具有尺寸或尺寸小于最小特征尺寸。

4. 发明授权

US07498714B2 Multi-layer three-dimensional structures having features smaller than a minimum feature size associated with the formation of individual layers 有权
标题翻译：具有小于与单独层的形成相关联的最小特征尺寸的特征的多层三维结构
公开(公告)号：US07498714B2
公开(公告)日：2009-03-03
申请号：US10949744
申请日：2004-09-24
申请人： Michael S. Lockard , Adam L. Cohen , Vacit Arat , Dennis R. Smalley
发明人： Michael S. Lockard , Adam L. Cohen , Vacit Arat , Dennis R. Smalley
IPC分类号： H02N1/00 , F16K31/02
CPC分类号： C25D1/08 , B33Y70/00 , C25D1/003 , C25D5/022 , C25D5/10 , Y10T137/86759 , Y10T428/12361 , Y10T428/12479 , Y10T428/19 , Y10T428/24975 , Y10T428/249981 , Y10T428/29
摘要： Embodiments of multi-layer three-dimensional structures and formation methods provide structures with effective feature (e.g. opening) sizes (e.g. virtual gaps) that are smaller than a minimum feature size (MFS) that exists on each layer as a result of the formation method used in forming the structures. In some embodiments, multi-layer structures include a first element (e.g. first patterned layer with a gap) and a second element (e.g. second patterned layer with a gap) positioned adjacent the first element to define a third element (e.g. a net gap or opening resulting from the combined gaps of the first and second elements) where the first and second elements have features that are sized at least as large as the minimum feature size and the third element, at least in part, has dimensions or defines dimensions smaller than the minimum feature size.
摘要翻译：多层三维结构和形成方法的实施例提供结构，其具有小于作为形成方法的结果存在于每个层上的最小特征尺寸（MFS）的有效特征（例如开口）尺寸（例如，虚拟间隙）用于形成结构。在一些实施例中，多层结构包括第一元件（例如具有间隙的第一图案化层）和邻近第一元件定位的第二元件（例如具有间隙的第二图案化层），以限定第三元件（例如，净间隙或第一和第二元件的组合间隙产生的开口），其中第一和第二元件具有尺寸至少与最小特征尺寸一样大的特征，并且第三元件至少部分具有尺寸或尺寸小于最小特征尺寸。

5. 发明授权

US07160429B2 Electrochemically fabricated hermetically sealed microstructures and methods of and apparatus for producing such structures 有权
公开(公告)号：US07160429B2
公开(公告)日：2007-01-09
申请号：US10434103
申请日：2003-05-07
申请人： Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Vacit Arat , Christopher J. Lee
发明人： Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Vacit Arat , Christopher J. Lee
IPC分类号： C25D5/48 , C25D5/02 , C25D5/10
CPC分类号： B81C1/00293 , B33Y10/00 , B81B2201/042 , B81C2203/0145 , C23C18/1605 , C23C18/1651 , C25D1/003 , G01P15/0802 , G01P15/125 , H01P1/202 , H01P3/06 , H01P5/183 , H01P11/00 , H01P11/005 , H05K3/4647
摘要： In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.

6. 发明申请

US20120137497A1 Electrochemical Fabrication Method Including Elastic Joining of Structures 有权
标题翻译：包括结构弹性连接的电化学制造方法
公开(公告)号：US20120137497A1
公开(公告)日：2012-06-07
申请号：US13287437
申请日：2011-11-02
申请人： Adam L. Cohen , Vacit Arat , Michael S. Lockard , Dennis R. Smalley
发明人： Adam L. Cohen , Vacit Arat , Michael S. Lockard , Dennis R. Smalley
IPC分类号： B23P25/00
CPC分类号： B29C65/56 , B33Y10/00 , C25D5/02 , Y10T29/49885
摘要： Embodiments are directed to methods for forming multi-layer three-dimensional structures involving the joining of at least two structural elements, at least one of which is formed as a multi-layer three-dimensional structure, wherein the joining occurs via one of: (1) elastic deformation and elastic recovery and subsequent retention of elements relative to each other, (2) relative deformation of an initial portion of at least one element relative to another portion of the at least one element until the at least two elements are in a desired retention position after which the deformation is reduced or eliminated and a portion of at least one element is brought into position which in turn locks the at least two elements together via contact with one another including contact with the initial portion of at least one element, or (3) moving a retention region of one element into the retention region of the other element, without deformation of either element, along a path including a loading region of the other element and wherein during normal use the first and second elements are configured relative to one another so that the loading region of the second elements is not accessible to the retention region of the first element.
摘要翻译：实施例涉及用于形成多层三维结构的方法，所述多层三维结构涉及至少两个结构元件的接合，其中至少一个结构元件形成为多层三维结构，其中通过以下之一进行接合：（ 1）弹性变形和弹性恢复以及随后元件相对于彼此的保持，（2）至少一个元件的初始部分相对于至少一个元件的另一部分的相对变形，直到至少两个元件处于期望的保持位置，在此之后，变形被减小或消除，并且至少一个元件的一部分进入位置，其又通过彼此接触将至少两个元件锁定在一起，包括与至少一个元件的初始部分的接触，或（3）将一个元件的保持区域移动到另一个元件的保持区域中，而不会使任一元件变形，沿着包括装载物 g区域，并且其中在正常使用期间，第一和第二元件相对于彼此构造，使得第二元件的加载区域不能被第一元件的保持区域访问。

7. 发明申请

US20110198281A1 Multi-Layer Three-Dimensional Structures Having Features Smaller Than a Minimum Feature Size Associated With the Formation of Individual Layers 审中-公开
标题翻译：具有小于单个层的形成的最小特征尺寸的特征的多层三维结构
公开(公告)号：US20110198281A1
公开(公告)日：2011-08-18
申请号：US13040500
申请日：2011-03-04
申请人： Michael S. Lockard , Adam L. Cohen , Vacit Arat , Dennis R. Smalley
发明人： Michael S. Lockard , Adam L. Cohen , Vacit Arat , Dennis R. Smalley
IPC分类号： B01D39/00 , C25D1/08 , B32B5/18
CPC分类号： C25D1/08 , B33Y70/00 , C25D1/003 , C25D5/022 , C25D5/10 , Y10T137/86759 , Y10T428/12361 , Y10T428/12479 , Y10T428/19 , Y10T428/24975 , Y10T428/249981 , Y10T428/29
摘要： Embodiments of multi-layer three-dimensional structures and formation methods provide structures with effective feature (e.g. opening) sizes (e.g. virtual gaps) that are smaller than a minimum feature size (MFS) that exists on each layer as a result of the formation method used in forming the structures. In some embodiments, multi-layer structures include a first element (e.g. first patterned layer with a gap) and a second element (e.g. second patterned layer with a gap) positioned adjacent the first element to define a third element (e.g. a net gap or opening resulting from the combined gaps of the first and second elements) where the first and second elements have features that are sized at least as large as the minimum feature size and the third element, at least in part, has dimensions or defines dimensions smaller than the minimum feature size.
摘要翻译：多层三维结构和形成方法的实施例提供结构，其具有小于作为形成方法的结果存在于每个层上的最小特征尺寸（MFS）的有效特征（例如开口）尺寸（例如，虚拟间隙）用于形成结构。在一些实施例中，多层结构包括第一元件（例如具有间隙的第一图案化层）和邻近第一元件定位的第二元件（例如具有间隙的第二图案化层），以限定第三元件（例如，净间隙或第一和第二元件的组合间隙产生的开口），其中第一和第二元件具有尺寸至少与最小特征尺寸一样大的特征，并且第三元件至少部分具有尺寸或尺寸小于最小特征尺寸。

8. 发明申请

US20100133109A1 Electrochemically Fabricated Hermetically Sealed Microstructures and Methods of and Apparatus for Producing Such Structures 审中-公开
标题翻译：电化学制造的密封微结构，以及用于生产这种结构的方法和装置
公开(公告)号：US20100133109A1
公开(公告)日：2010-06-03
申请号：US12624240
申请日：2009-11-23
申请人： Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Vacit Arat , Christopher A. Bang , John C. Dixon
发明人： Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Vacit Arat , Christopher A. Bang , John C. Dixon
IPC分类号： C25D5/02 , C25D5/48 , C25D7/00
CPC分类号： B81C1/00293 , B81B2201/042 , B81C1/00333 , B81C2201/0197 , B81C2203/0145 , C25D1/003 , G01P15/0802 , G01P15/125 , H01P1/202 , H01P3/06 , H01P5/183 , H01P11/00 , H01P11/005 , H05K3/4647
摘要： In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.
摘要翻译：在一些实施例中，多层结构由至少一种结构材料（例如镍），至少一种牺牲材料（例如铜）和至少一种密封材料（例如焊料）进行电化学制造。在一些实施例中，层状结构被制成具有至少部分地且立即被牺牲材料包围的期望构型，牺牲材料又被几乎完全由结构材料包围。周围的结构材料包括在表面中的开口，蚀刻剂可以通过该开口攻击和去除在其内发现的被捕获的牺牲材料。密封材料位于开口附近。在除去牺牲材料之后，将盒子抽空或填充所需的气体或液体。此后，使密封材料流动，密封开口并重新固化。在其他实施例中，添加了后层形成盖或其它外壳完成结构。

9. 发明授权

US08702955B2 Electrochemical fabrication method including elastic joining of structures 有权
标题翻译：包括结构弹性连接的电化学制造方法
公开(公告)号：US08702955B2
公开(公告)日：2014-04-22
申请号：US13287437
申请日：2011-11-02
申请人： Adam L. Cohen , Vacit Arat , Michael S. Lockard , Dennis R. Smalley
发明人： Adam L. Cohen , Vacit Arat , Michael S. Lockard , Dennis R. Smalley
IPC分类号： C25D5/02 , C25D5/48
CPC分类号： B29C65/56 , B33Y10/00 , C25D5/02 , Y10T29/49885
摘要： Embodiments are directed to methods for forming multi-layer three-dimensional structures involving the joining of at least two structural elements, at least one of which is formed as a multi-layer three-dimensional structure, wherein the joining occurs via one of: (1) elastic deformation and elastic recovery and subsequent retention of elements relative to each other, (2) relative deformation of an initial portion of at least one element relative to another portion of the at least one element until the at least two elements are in a desired retention position after which the deformation is reduced or eliminated and a portion of at least one element is brought into position which in turn locks the at least two elements together via contact with one another including contact with the initial portion of at least one element, or (3) moving a retention region of one element into the retention region of the other element, without deformation of either element, along a path including a loading region of the other element and wherein during normal use the first and second elements are configured relative to one another so that the loading region of the second elements is not accessible to the retention region of the first element.
摘要翻译：实施例涉及用于形成多层三维结构的方法，所述多层三维结构涉及至少两个结构元件的接合，其中至少一个结构元件形成为多层三维结构，其中通过以下之一进行接合：（ 1）弹性变形和弹性恢复以及随后元件相对于彼此的保持，（2）至少一个元件的初始部分相对于至少一个元件的另一部分的相对变形，直到至少两个元件处于期望的保持位置，在此之后，变形被减小或消除，并且至少一个元件的一部分进入位置，其又通过彼此接触将至少两个元件锁定在一起，包括与至少一个元件的初始部分的接触，或（3）将一个元件的保持区域移动到另一个元件的保持区域中，而不会使任一元件变形，沿着包括装载物 g区域，并且其中在正常使用期间，第一和第二元件相对于彼此构造，使得第二元件的加载区域不能被第一元件的保持区域访问。

10. 发明授权

US08512861B2 Multi-layer three-dimensional structures having features smaller than a minimum feature size associated with the formation of individual layers 有权
公开(公告)号：US08512861B2
公开(公告)日：2013-08-20
申请号：US13323995
申请日：2011-12-13
申请人： Michael S. Lockard , Adam L. Cohen , Vacit Arat , Dennis R. Smalley
发明人： Michael S. Lockard , Adam L. Cohen , Vacit Arat , Dennis R. Smalley
IPC分类号： B32B19/00 , B01D39/00
CPC分类号： C25D1/08 , B33Y70/00 , C25D1/003 , C25D5/022 , C25D5/10 , Y10T137/86759 , Y10T428/12361 , Y10T428/12479 , Y10T428/19 , Y10T428/24975 , Y10T428/249981 , Y10T428/29
摘要： Embodiments of multi-layer three-dimensional structures and formation methods provide structures with effective feature (e.g. opening) sizes (e.g. virtual gaps) that are smaller than a minimum feature size (MFS) that exists on each layer as a result of the formation method used in forming the structures. In some embodiments, multi-layer structures include a first element (e.g. first patterned layer with a gap) and a second element (e.g. second patterned layer with a gap) positioned adjacent the first element to define a third element (e.g. a net gap or opening resulting from the combined gaps of the first and second elements) where the first and second elements have features that are sized at least as large as the minimum feature size and the third element, at least in part, has dimensions or defines dimensions smaller than the minimum feature size.

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