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1. 发明申请

US20060226015A1 Method of forming electrically isolated structures using thin dielectric coatings 审中-公开
标题翻译：使用薄电介质涂层形成电隔离结构的方法
公开(公告)号：US20060226015A1
公开(公告)日：2006-10-12
申请号：US11325405
申请日：2006-01-03
申请人： Dennis Smalley , Adam Cohen , Ananda Kumar , Michael Lockard
发明人： Dennis Smalley , Adam Cohen , Ananda Kumar , Michael Lockard
IPC分类号： C25D5/02
CPC分类号： A61N1/00 , C23C18/1605 , C23C18/1651 , C25D1/003 , C25D1/20 , C25D5/022 , G01R1/0483 , G01R1/06716 , G01R1/07357 , G01R31/2886 , H05K3/467 , H05K3/4682
摘要： Electrochemical fabrication processes and apparatus for producing multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers including operations for providing coatings of dielectric material that isolate at least-portions of a first conductive material from (1) other portions of the first conductive material, (2) a second conductive material, or (3) another dielectric material, and wherein the thickness of the dielectric coatings are thin compared to the thicknesses of the layers used in forming the structures. In some preferred embodiments, portions of each individual layer are encapsulated by dielectric material while in other embodiments only boundaries between distinct regions of materials are isolated from one another by dielectric barriers.
摘要翻译：用于生产多层结构的电化学制造方法和装置，其中每个层包括至少两种材料的沉积，并且其中形成至少一些层，包括用于提供绝缘材料的涂层的操作，所述介电材料的涂层隔离第一导电材料的至少一部分从（1）第一导电材料的其他部分，（2）第二导电材料或（3）另一种介电材料，并且其中电介质涂层的厚度与用于形成结构的层的厚度相比较薄。在一些优选实施例中，每个单独层的部分被电介质材料包封，而在其它实施例中，材料的不同区域之间的边界通过电介质屏障彼此隔离。

2. 发明申请

US20080050524A1 Methods of Forming Three-Dimensional Structures Having Reduced Stress and/or Curvature 审中-公开
标题翻译：形成具有减小的应力和/或曲率的三维结构的方法
公开(公告)号：US20080050524A1
公开(公告)日：2008-02-28
申请号：US11733195
申请日：2007-04-09
申请人： Ananda Kumar , Jorge Albarran , Adam Cohen , Kieun Kim , Michael Lockard , Uri Frodis , Dennis Smalley
发明人： Ananda Kumar , Jorge Albarran , Adam Cohen , Kieun Kim , Michael Lockard , Uri Frodis , Dennis Smalley
IPC分类号： B05D1/38 , B05D3/00
CPC分类号： B81C1/00666 , C25D5/022
摘要： Electrochemical fabrication processes and apparatus for producing single layer or multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers includes operations for reducing stress and/or curvature distortion when the structure is released from a sacrificial material which surrounded it during formation and possibly when released from a substrate on which it was formed. Six primary groups of embodiments are presented which are divide into eleven primary embodiments. Some embodiments attempt to remove stress to minimize distortion while others attempt to balance stress to minimize distortion.
摘要翻译：用于生产单层或多层结构的电化学制造方法和装置，其中每个层包括至少两种材料的沉积，并且其中形成至少一些层包括当结构被释放时减少应力和/或曲率失真的操作牺牲材料，其在形成期间包围它，并且可能当从其形成的基底释放时。呈现了六个主要实施例的组，它们分为十一个主要实施例。一些实施例尝试去除应力以最小化失真，而另一些实施例试图平衡应力以最小化失真。

3. 发明申请

US20050215023A1 Electrochemical fabrication process for forming multilayer multimaterial microprobe structures 有权
公开(公告)号：US20050215023A1
公开(公告)日：2005-09-29
申请号：US11029221
申请日：2005-01-03
申请人： Adam Cohen , Ananda Kumar , Michael Lockard , Dennis Smalley
发明人： Adam Cohen , Ananda Kumar , Michael Lockard , Dennis Smalley
IPC分类号： G01R31/02 , H01L21/20
CPC分类号： G01R1/06716 , B33Y10/00 , C23C18/1605 , C23C18/1651 , C25D1/003 , G01R1/0483 , G01R1/07357 , G01R31/2886
摘要： Some embodiments of the invention are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that partially coats the surface of the probe. Other embodiments are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that completely coats the surface of each layer from which the probe is formed including interlayer regions. These first two groups of embodiments incorporate both the core material and the coating material during the formation of each layer. Still other embodiments are directed to the electrochemical fabrication of microprobe arrays that are partially encapsulated by a dielectric material during a post layer formation coating process. In even further embodiments, the electrochemical fabrication of microprobes from two or more materials may occur by incorporating a coating material around each layer of the structure without locating the coating material in inter-layer regions.

4. 发明申请

US20050202180A1 Electrochemical fabrication methods for producing multilayer structures including the use of diamond machining in the planarization of deposits of material 审中-公开
标题翻译：用于生产多层结构的电化学制造方法，包括在平坦化材料沉积中使用金刚石加工
公开(公告)号：US20050202180A1
公开(公告)日：2005-09-15
申请号：US11029165
申请日：2005-01-03
申请人： Adam Cohen , Uri Frodis , Michael Lockard , Ananda Kumar , Gang Zhang , Dennis Smalley
发明人： Adam Cohen , Uri Frodis , Michael Lockard , Ananda Kumar , Gang Zhang , Dennis Smalley
IPC分类号： B05D1/38 , C08K3/00 , C25D3/30 , C25D3/38 , C25D3/48 , C25D5/02 , C25D5/10 , C25D21/12 , H01L21/288 , H01L21/301 , H01L21/302 , H01L21/4763 , H01L21/768
CPC分类号： C25D5/48 , B33Y10/00 , B81C1/00492 , B81C99/0065 , B81C2201/0104 , B81C2201/0197 , C25D1/00 , C25D1/003 , C25D5/022 , C25D5/10 , C25D21/12 , H01L21/2885 , H01L21/76885 , Y10T156/1052
摘要： Electrochemical fabrication methods for forming single and multilayer mesoscale and microscale structures are disclosed which include the use of diamond machining (e.g. fly cutting or turning) to planarize layers. Some embodiments focus on systems of sacrificial and structural materials which are useful in Electrochemical fabrication and which can be diamond machined with minimal tool wear (e.g. Ni—P and Cu, Au and Cu, Cu and Sn, Au and Cu, Au and Sn, and Au and Sn—Pb), where the first material or materials are the structural materials and the second is the sacrificial material). Some embodiments focus on methods for reducing tool wear when using diamond machining to planarize structures being electrochemically fabricated using difficult-to-machine materials (e.g. by depositing difficult to machine material selectively and potentially with little excess plating thickness, and/or pre-machining depositions to within a small increment of desired surface level (e.g. using lapping or a rough cutting operation) and then using diamond fly cutting to complete he process, and/or forming structures or portions of structures from thin walled regions of hard-to-machine material as opposed to wide solid regions of structural material.
摘要翻译：公开了用于形成单层和多层中尺度和微结构的电化学制造方法，其包括使用金刚石加工（例如飞切或车削）来平坦化层。一些实施例集中于可用于电化学制造的牺牲和结构材料的系统，并且可以以最小的工具磨损（例如Ni-P和Cu，Au和Cu，Cu和Sn，Au和Cu，Au和Sn，和Au和Sn-Pb），其中第一材料或材料是结构材料，第二材料是牺牲材料）。一些实施例着重于在使用金刚石加工以平面化使用难以加工的材料进行电化学制造的结构（例如，通过沉积难以机械材料选择性且潜在地具有少量多余电镀厚度和/或预加工沉积到所需表面水平的小增量（例如使用研磨或粗切割操作），然后使用金刚石飞切切割来完成其加工，和/或从硬质材料的薄壁区域形成结构或部分结构而不是结构材料的宽固体区域。

5. 发明申请

US20050189959A1 Electrochemical fabrication process for forming multilayer multimaterial microprobe structures 审中-公开
标题翻译：用于形成多层多材料微探针结构的电化学制造工艺
公开(公告)号：US20050189959A1
公开(公告)日：2005-09-01
申请号：US11029182
申请日：2005-01-03
申请人： Adam Cohen , Ananda Kumar , Michael Lockard , Dennis Smalley
发明人： Adam Cohen , Ananda Kumar , Michael Lockard , Dennis Smalley
IPC分类号： G01R31/02 , H01L21/20
CPC分类号： B81C1/00111 , C23C18/1605 , C23C18/1651 , C25D1/003 , G01R3/00
摘要： Some embodiments of the invention are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that partially coats the surface of the probe. Other embodiments are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that completely coats the surface of each layer from which the probe is formed including interlayer regions. These first two groups of embodiments incorporate both the core material and the coating material during the formation of each layer. Still other embodiments are directed to the electrochemical fabrication of microprobe arrays that are partially encapsulated by a dielectric material during a post layer formation coating process. In even further embodiments, the electrochemical fabrication of microprobes from two or more materials may occur by incorporating a coating material around each layer of the structure without locating the coating material in inter-layer regions.
摘要翻译：本发明的一些实施方案涉及由芯材料和部分涂覆探针的表面的材料形成的微针的电化学制造。其它实施方案涉及由核心材料形成的微结构的电化学制造，以及完全涂覆形成探针的每个层的表面的材料，包括中间层区域。这些前两组实施例在形成每个层期间都包括芯材料和涂层材料。另外的其它实施例涉及在后层形成涂覆过程中由电介质材料部分封装的微探针阵列的电化学制造。在甚至进一步的实施方案中，来自两种或更多种材料的微结构的电化学制造可以通过在结构的每一层周围并入涂层材料而不将涂层材料定位在层间区域中而进行。

6. 发明申请

US20050045585A1 Method of electrochemically fabricating multilayer structures having improved interlayer adhesion 审中-公开
公开(公告)号：US20050045585A1
公开(公告)日：2005-03-03
申请号：US10841382
申请日：2004-05-07
申请人： Gang Zhang , Adam Cohen , Michael Lockard , Ananda Kumar , Ezekiel Kruglick , Kieun Kim
发明人： Gang Zhang , Adam Cohen , Michael Lockard , Ananda Kumar , Ezekiel Kruglick , Kieun Kim
IPC分类号： C25D1/00 , C25D5/02 , C25D5/10 , C25D5/12 , C25D5/14 , C25D5/18 , C25D5/34 , C25D5/40 , C25D5/48 , C25D5/50 , H01L21/288 , H01L21/768 , H05K3/24 , C23F1/00
CPC分类号： C25D5/50 , C25D1/003 , C25D5/022 , C25D5/10 , C25D5/12 , C25D5/14 , C25D5/18 , C25D5/34 , C25D5/40 , C25D5/48 , H01L21/2885 , H01L21/76879 , H05K3/241 , H05K3/243
摘要： Multi-layer microscale or mesoscale structures are fabricated with adhered layers (e.g. layers that are bonded together upon deposition of successive layers to previous layers) and are then subjected to a heat treatment operation that enhances the interlayer adhesion significantly. The heat treatment operation is believed to result in diffusion of material across the layer boundaries and associated enhancement in adhesion (i.e. diffusion bonding). Interlayer adhesion and maybe intra-layer cohesion may be enhanced by heat treating in the presence of a reducing atmosphere that may help remove weaker oxides from surfaces or even from internal portions of layers.

7. 发明申请

US20050253606A1 Microprobe tips and methods for making 有权
公开(公告)号：US20050253606A1
公开(公告)日：2005-11-17
申请号：US11029169
申请日：2005-01-03
申请人： Kieun Kim , Adam Cohen , Willa Larsen , Richard Chen , Ananda Kumar , Ezekiel Kruglick , Vacit Arat , Gang Zhang , Michael Lockard
发明人： Kieun Kim , Adam Cohen , Willa Larsen , Richard Chen , Ananda Kumar , Ezekiel Kruglick , Vacit Arat , Gang Zhang , Michael Lockard
IPC分类号： G01R31/02 , H01R12/00 , H01R13/187 , H01R24/58
CPC分类号： H01R13/187 , H01L24/72 , H01L2924/15747 , H01L2924/00
摘要： Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in over exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of a the tip material around carefully sized placed etching shields, via hot pressing, and the like.

8. 发明申请

US20080093424A1 Probe Arrays and Method for Making 有权
公开(公告)号：US20080093424A1
公开(公告)日：2008-04-24
申请号：US11929539
申请日：2007-10-30
申请人： Ananda Kumar , Ezekiel Kruglick , Adam Cohen , Kieun Kim , Gang Zhang , Richard Chen , Christopher Bang , Vacit Arat , Michael Lockard , Uri Frodis , Pavel Lembrikov , Jeffrey Thompson
发明人： Ananda Kumar , Ezekiel Kruglick , Adam Cohen , Kieun Kim , Gang Zhang , Richard Chen , Christopher Bang , Vacit Arat , Michael Lockard , Uri Frodis , Pavel Lembrikov , Jeffrey Thompson
IPC分类号： B29C65/00 , B23K35/12
CPC分类号： B23K35/0222 , C23C18/1605 , C23C18/1651 , C25D1/003 , C25D1/12 , G01R1/06744 , G01R1/07307 , G01R1/07314 , G01R3/00 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L24/95 , H01L2221/68313 , H01L2221/68354 , H01L2221/68363 , H01L2224/0401 , H01L2224/05568 , H01L2224/10126 , H01L2224/1147 , H01L2224/11831 , H01L2224/1184 , H01L2224/1191 , H01L2224/13017 , H01L2224/13018 , H01L2224/13076 , H01L2224/131 , H01L2224/1403 , H01L2224/81001 , H01L2224/81054 , H01L2224/81136 , H01L2224/8121 , H01L2224/8181 , H01L2224/81815 , H01L2924/00013 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/3651 , H01L2924/3841 , H01L2224/13099 , H01L2224/29099 , H01L2924/00 , H01L2224/05552 , H01L2924/00012
摘要： Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.

9. 发明申请

US20080105355A1 Probe Arrays and Method for Making 审中-公开
标题翻译：探针阵列和制作方法
公开(公告)号：US20080105355A1
公开(公告)日：2008-05-08
申请号：US11929597
申请日：2007-10-30
申请人： Ananda Kumar , Ezekiel Kruglick , Adam Cohen , Kieun Kim , Gang Zhang , Richard Chen , Christopher Bang , Vacit Arat , Michael Lockard , Uri Frodis , Pavel Lembrikov , Jeffrey Thompson
发明人： Ananda Kumar , Ezekiel Kruglick , Adam Cohen , Kieun Kim , Gang Zhang , Richard Chen , Christopher Bang , Vacit Arat , Michael Lockard , Uri Frodis , Pavel Lembrikov , Jeffrey Thompson
IPC分类号： B32B37/00 , B23K31/02
CPC分类号： G01R3/00 , G01R1/06761 , G01R1/07307 , Y10T29/49002 , Y10T156/10
摘要： Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.
摘要翻译：本发明的实施例涉及在临时衬底上形成微探针（即柔性电气或电子接触元件），切割单独的探针阵列，然后将阵列转移到空间变压器或其它永久衬底。在将探针从其上形成探针的临时基底分离出来之前，本发明的一些实施方案将探针转移到永久性基底上，而其他实施方案相反。一些实施例，在转移之前去除牺牲材料，而其它实施例在转移后去除牺牲材料。一些实施例涉及使用一个或多个具有增强的纵横比（即，高度与宽度比）的焊料凸块来将第一和第二电气部件接合在一起，这是由于至少部分地由保持材料的环围绕凸块而得到的。保留材料可以用作焊接掩模材料。

10. 发明申请

US20060053625A1 Microprobe tips and methods for making 审中-公开
标题翻译：微型笔尖和制作方法
公开(公告)号：US20060053625A1
公开(公告)日：2006-03-16
申请号：US11177798
申请日：2005-07-07
申请人： Kieun Kim , Adam Cohen , Willa Larsen , Richard Chen , Ananda Kumar , Ezekiel Kruglick , Vacit Arat , Gang Zhang , Michael Lockard , Christopher Bang
发明人： Kieun Kim , Adam Cohen , Willa Larsen , Richard Chen , Ananda Kumar , Ezekiel Kruglick , Vacit Arat , Gang Zhang , Michael Lockard , Christopher Bang
IPC分类号： H01R43/16 , H01R43/00
CPC分类号： G01R3/00 , C25D1/003 , G01R1/073 , Y10T29/49204 , Y10T29/49222
摘要： Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.
摘要翻译：本发明的实施例涉及形成具有各种构造的微探针尖元件。在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性地蚀刻硅的图案化孔中模制，通过在曝光的光致抗蚀剂中形成的空隙中模制，通过在牺牲材料中的空隙中模制，由于牺牲材料通过电介质材料的细小尺寸和定位的区域，经由热压等等仔细地尺寸和放置的蚀刻屏蔽部分上的尖端材料的各向同性蚀刻而形成。

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