会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 6. 发明申请
    • FILM FORMING METHOD BY SPUTTERING AND SPUTTERING APPARATUS THEREOF
    • 通过溅射和溅射装置形成膜形成方法
    • US20100133090A1
    • 2010-06-03
    • US12684359
    • 2010-01-08
    • Tetsuya EndoEinstein Noel Abarra
    • Tetsuya EndoEinstein Noel Abarra
    • C23C14/36
    • C23C14/225C23C14/044C23C14/3407C23C14/505C23C14/548H01F41/18H01J37/34H01J37/3405H01J37/3414H01J37/3435H01J37/3455
    • To provide a sputtering apparatus that enables oblique film forming by arranging a target and a substrate so as to allow sputtered particles emitted from the target to obliquely enter the substrate selectively, and can form a magnetic film having high uniaxial magnetic anisotropy uniformly and compactly. A sputtering apparatus includes a cathode having a sputtering target supporting surface, the cathode being provided with a rotation axis about which the sputtering target supporting surface rotates, and a stage having a substrate supporting surface, the stage being provided with a rotation axis about which the substrate supporting surface rotates, and the sputtering apparatus is constituted such that the sputtering target supporting surface and the substrate supporting surface face to each other, and are rotatable independently about respective rotation axes. Further, it is constituted such that a shield plate is arranged between the sputtering target supporting surface and the substrate supporting surface, and is rotatable independently from the cathode and the stage.
    • 为了提供一种溅射装置,其能够通过配置目标物和基板使得能够进行倾斜成膜,从而使从靶材发射的溅射粒子选择性倾斜地进入基板,并且可以均匀且紧凑地形成具有高单轴磁各向异性的磁性膜。 溅射装置包括具有溅射靶支撑表面的阴极,阴极设置有溅射靶支撑表面旋转的旋转轴,以及具有基板支撑表面的台,该台设置有旋转轴线, 基板支撑面旋转,并且溅射装置构成为使得溅射靶支撑表面和基板支撑表面彼此面对,并且可以围绕各自的旋转轴独立地旋转。 此外,其构造使得屏蔽板布置在溅射靶支撑表面和基板支撑表面之间,并且可独立于阴极和台转动。
    • 9. 发明申请
    • SPUTTERING APPARATUS
    • 溅射装置
    • US20120160672A1
    • 2012-06-28
    • US13334859
    • 2011-12-22
    • Tetsuya Endo
    • Tetsuya Endo
    • C23C14/35
    • H01J37/3455C23C14/3407C23C14/35H01J37/3405H01J37/3435
    • A sputtering apparatus includes a target electrode capable of mounting a target, a first support member which supports the target electrode, a magnet unit which forms a magnetic field on a surface of the target, a second support member which supports the magnet unit, and a force generation portion which is provided between the first support member and the second support member, and generates a second force in a direction opposite to a first force that acts on the second support member by an action of the magnetic field formed between the target and the magnet unit, wherein the second force has a magnitude which increases as the magnet unit comes closer to the target electrode.
    • 溅射装置包括能够安装靶的目标电极,支撑目标电极的第一支撑构件,在靶的表面上形成磁场的磁体单元,支撑磁体单元的第二支撑构件,以及 力产生部分,其设置在第一支撑构件和第二支撑构件之间,并且通过形成在目标和第二支撑构件之间的磁场的作用沿与第二支撑构件作用的第一力相反的方向产生第二力 磁体单元,其中所述第二力具有随着所述磁体单元靠近所述目标电极而增加的大小。