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    • 6. 发明申请
    • SPUTTERING DEVICE AND SPUTTERING METHOD
    • 溅射装置和溅射方法
    • US20110223346A1
    • 2011-09-15
    • US13121338
    • 2009-09-29
    • Toru KitadaNaoki WatanabeMotonobu NagaiMasahiro SuenagaTakeo Konno
    • Toru KitadaNaoki WatanabeMotonobu NagaiMasahiro SuenagaTakeo Konno
    • C23C14/35B05C9/02
    • C23C14/542C23C14/3464H01F41/18H01J37/3266H01J37/32733H01J37/3405H01J37/3408H01J37/3414
    • A magnetic film having excellent uniformity in in-plane distribution of film thickness or sheet resistance is formed when the film is formed by forming a magnetic field on a processing surface of a substrate (21) and performing oblique incidence sputtering by using high discharge power.A sputtering apparatus (1) is provided with a substrate holder (22) for holding rotatably the substrate (21) in the surface direction of the processing surface of the substrate; a substrate magnetic field forming device (30) which is disposed to surround the substrate (21) and forms a magnetic field on the processing surface of the substrate (21); cathodes (41) which are arranged diagonally above the substrate (21) and are supplied with electric discharge power; a position detecting device (23) for detecting a rotation position of the substrate (21) ; and a control device (50) which adjusts the rotation speed of the substrate (21) in accordance with the rotation position detected by the position detecting device (23).
    • 当通过在基板(21)的处理表面上形成磁场并且通过使用高放电电力进行倾斜入射溅射形成膜时,形成膜厚度或薄层电阻的面内分布均匀性优异的磁性膜。 溅射装置(1)设置有用于在基板的处理表面的表面方向上可旋转地保持基板(21)的基板保持器(22) 衬底磁场形成装置(30),被设置为围绕所述衬底(21)并在所述衬底(21)的所述处理表面上形成磁场; 在基板(21)上方对角配置并供给放电电力的阴极(41) 位置检测装置,用于检测所述基板的旋转位置; 以及根据由位置检测装置(23)检测到的旋转位置来调整基板(21)的转速的控制装置(50)。